NXP Semiconductors MRFE6S9125NBR1
- Part No.:
- MRFE6S9125NBR1
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- TO-272BB
- Datasheet:
-
MRFE6S9125NBR1.pdf
- Description:
- RF MOSFET LDMOS 28V TO272-4
- Quantity:
- Payment:

- Shipping:

Inventory:9,141
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Product details
Overview
MRFE6S9125NBR1 from NXP Semiconductors (formerly Freescale) is a 27 W average, 125 W PEP, N-channel enhancement-mode lateral RF power MOSFET optimized for broadband base station amplifiers operating up to 1000 MHz. It delivers 20.2 dB power gain and 31% drain efficiency at 880 MHz under N-CDMA conditions (28 V, 950 mA IDQ), with integrated ESD protection and rugged 10:1 VSWR tolerance. It targets commercial wireless infrastructure transmitters.
For engineers reviewing the MRFE6S9125NBR1 datasheet, MRFE6S9125NBR1 pinout, MRFE6S9125NBR1 application, or MRFE6S9125NBR1 equivalent, key selection criteria include its 225°C junction rating, TO-272 WB-4 plastic package, 28 V operation, and verified N-CDMA/GSM EDGE spectral performance - critical for high-reliability RF PA design in 865–960 MHz bands.
Technical Context
This device employs a laterally diffused MOS (LDMOS) structure with internal input matching, enabling stable large-signal operation in common-source configuration. Its series-equivalent source/load impedances are characterized across 860–900 MHz (e.g., Zload = 0.57 − j2.42 Ω at 880 MHz), supporting broadband impedance tuning in 50 Ω systems.
Thermal design relies on low RθJC = 0.45°C/W (at 27 W CW, TC = 76°C) and a 225°C-rated plastic package, validated per JESD22-A114 Class 1B ESD and J-STD-020 MSL Level 3. It operates with fixed gate bias (VGS(Q) = 2.86 V typ.) and requires external output matching networks for optimal ACPR and EVM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 865–960 MHz (full-band GSM/EDGE); validated to 1000 MHz |
| Output Power | 27 W avg. (N-CDMA), 60 W avg. (GSM EDGE), 125 W PEP (CW) |
| Power Gain | 20.2 dB (N-CDMA @ 880 MHz); supports high-efficiency multi-carrier amplification |
| Drain Efficiency | 31% (N-CDMA), 40% (GSM EDGE), 62% (GSM CW) - enables thermal management at 28 V |
| ACPR / Spectral Regrowth | −45.7 dBc @ ±750 kHz (N-CDMA), −63 dBc @ ±400 kHz (EDGE) - meets 3GPP spectral mask requirements |
| Junction Temperature | 225°C max - allows sustained operation under high VSWR and overdrive conditions |
| VSWR Tolerance | 10:1 @ 32 V, 880 MHz, 3 dB overdrive - ensures amplifier survivability in mismatched antenna environments |
Pinout & Package
MRFE6S9125NBR1 uses the TO-272 WB-4 plastic package (Case 1484-04, Style 1), featuring four terminals: Drain (tab), Source (pin 1), Gate (pin 2), and second Source (pin 3). The metal tab is electrically connected to the Drain and serves as the primary thermal path. Pin 4 is internally unused and isolated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Drain) | Main RF power output and thermal conduction path | Must be bolted to heatsink with thermal interface material; electrically active high-power node |
| Pin 1 (Source) | Source reference for gate drive and RF return | Primary RF ground connection; used with external bypassing for stability |
| Pin 2 (Gate) | RF input control terminal | High-impedance node requiring matched 50 Ω input network; protected by integrated ESD diodes |
| Pin 3 (Source) | Secondary source connection | Provides low-inductance RF return path to improve stability and reduce parasitic oscillation risk |
| Pin 4 | No internal connection | Unused and electrically isolated; must remain unconnected in PCB layout |
Key Features
| Feature | Design Value |
|---|---|
| Internally matched input | Reduces external matching complexity; enables rapid prototyping in 50 Ω test fixtures |
| Integrated ESD protection | Class 1B HBM (per JESD22-A114) - eliminates need for discrete ESD clamps in front-end design |
| 225°C capable plastic package | Enables higher power density without ceramic packaging cost; qualified for industrial temperature cycling |
| Ruggedized 10:1 VSWR handling | Supports real-world antenna mismatches without derating or protection circuitry |
| Tape-and-reel packaging (R1) | 500 units per 44 mm, 13-inch reel - compatible with automated SMT placement for production-scale RF PA assembly |
Applications
| Macro Base Station Transmitter | Small Cell Remote Radio Head |
|---|---|
Use Scenario: High-power final-stage amplifier in 800/900 MHz macrocell BTS supporting N-CDMA and GSM standards. IC Role / Device Role / Timing Role: RF power transistor delivering 27 W average output in common-source Class AB configuration with external harmonic filtering. Use Value: Achieves −45.7 dBc ACPR at 750 kHz offset while maintaining 31% efficiency - reduces cooling requirements and improves system energy efficiency. | Use Scenario: Compact, air-cooled PA module in LTE small cell RRH operating in 920–960 MHz band. IC Role / Device Role / Timing Role: Single-device 60 W average output stage for EDGE modulation with tight EVM control. Use Value: Delivers 1.8% rms EVM and −78 dBc spectral regrowth at 600 kHz offset - meets 3GPP TS 36.104 linearity requirements without digital pre-distortion overhead. |
| GSM 900 MHz Broadcast Amplifier | Multi-Band Infrastructure Repeater |
Use Scenario: High-efficiency CW amplifier in 920–960 MHz GSM broadcast transmitter. IC Role / Device Role / Timing Role: Final-stage LDMOS transistor biased at 700 mA IDQ, delivering 125 W PEP with 62% drain efficiency. Use Value: Enables >60% efficiency at full output - significantly lowers DC power consumption and thermal load in continuous-duty applications. | Use Scenario: Bidirectional repeater PA supporting simultaneous 880 MHz uplink and 925 MHz downlink bands. IC Role / Device Role / Timing Role: Dual-band RF power stage using harmonic-tuned matching networks for frequency-selective amplification. Use Value: Maintains <0.93 dB gain flatness over 35 MHz bandwidth - ensures uniform signal boost across wide channel allocations without gain ripple compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF6S9125NR1 | Same die, TO-270 WB-4 package (Case 1486-03); slightly higher RθJC (0.44°C/W) | Better suited for forced-air cooled designs due to larger tab area; less compact than TO-272 | Select when thermal interface pressure or heatsink clamping geometry favors TO-270 mechanical form factor |
| MRFE6S9125N | Same electrical specs but non-R1 tape-and-reel variant; identical TO-272 WB-4 package | No functional difference; intended for manual or low-volume prototype assembly | Choose for evaluation or pilot builds where reel packaging is unnecessary |
Compared with MRFE6S9125NR1 and MRFE6S9125N, the MRFE6S9125NBR1 offers identical RF performance and thermal capability in the more space-efficient TO-272 WB-4 package with industry-standard 500-unit tape-and-reel delivery - optimizing both PCB area and high-volume manufacturing throughput.
Availability
MRFE6S9125NBR1 is available at Aetrix Electronics and suitable for macro base station transmitters, small cell remote radio heads, and GSM broadcast amplifiers requiring stable component supply, long-lifecycle support, and traceable sourcing for wireless infrastructure OEMs.
Supply support for MRFE6S9125NBR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communication markets, with deep heritage in RF power technology via its acquisition of Freescale.
The MRFE6S9125NBR1 belongs to NXP's RF Power LDMOS portfolio, engineered specifically for high-efficiency, high-linearity, and rugged broadband amplification in commercial wireless infrastructure - addressing stringent 3GPP spectral and reliability requirements.
FAQ
What is the maximum continuous drain voltage rating for MRFE6S9125NBR1?
The MRFE6S9125NBR1 has a maximum drain-source voltage (VDSS) rating of +66 Vdc and −0.5 Vdc, with a maximum operating drain voltage (VDD) of +32 Vdc. This 32 V rating defines the safe DC supply limit for continuous operation; exceeding it risks permanent device failure even under transient conditions.
Does MRFE6S9125NBR1 require external gate bias circuitry?
Yes, MRFE6S9125NBR1 requires an external gate bias network to set VGS(Q) ≈ 2.86 V (typical) at 950 mA IDQ. The device does not include integrated bias regulation; Freescale's reference design uses R1 (15 Ω) and R2 (560 kΩ) with decoupling capacitors to establish stable quiescent current under thermal variation.
Can MRFE6S9125NBR1 be used in pulsed RF applications?
Yes, MRFE6S9125NBR1 is characterized for pulsed CW operation (12 μs pulse width, 1% duty cycle) delivering up to 218 W P6dB output at 880 MHz. Its thermal design and ruggedness support short-duration high-peak-power bursts, provided average power remains within 27 W and junction temperature stays ≤225°C.
What is the moisture sensitivity level (MSL) of MRFE6S9125NBR1?
MRFE6S9125NBR1 is rated MSL Level 3 per J-STD-020, with a peak reflow temperature of 260°C. This requires floor life management: unopened reels must be stored ≤30°C/60% RH and used within 168 hours after opening unless dry-packed - critical for reliable lead-free reflow soldering.
How does the internal input matching of MRFE6S9125NBR1 affect PCB layout?
The internal input matching of MRFE6S9125NBR1 simplifies layout by eliminating discrete input matching components in many 50 Ω systems, but it does not eliminate the need for proper RF grounding. Pin 1 and Pin 3 (both sources) must be independently low-inductance connected to ground planes, and gate traces require controlled impedance routing to avoid instability - as validated in Freescale's Figure 2 layout.
MRFE6S9125NBR1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- TO-272BB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 880MHz
- Gain:
- 20.2dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 950 mA
- Power - Output:
- 27W
- Voltage - Rated:
- 66 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- TO-272 WB-4
MRFE6S9125NBR1 FAQ
1.How can I place an order for MRFE6S9125NBR1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFE6S9125NBR1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFE6S9125NBR1 reliable?
The price and inventory of MRFE6S9125NBR1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFE6S9125NBR1 is usually 5 days.
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MRFE6S9125NBR1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFE6S9125NBR1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFE6S9125NBR1?
For technical support, including MRFE6S9125NBR1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFE6S9125NBR1 requirements.
6.How does Aetrix verify that MRFE6S9125NBR1 is sourced from the original manufacturer or authorized distributors?
All MRFE6S9125NBR1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFE6S9125NBR1 meets industry standards.
7.What is the process for return or replacement of MRFE6S9125NBR1?
All MRFE6S9125NBR1 units undergo pre-shipment inspection (PSI). If there is an issue with MRFE6S9125NBR1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFE6S9125NBR1 part is unused and in its original packaging.
Return procedure for MRFE6S9125NBR1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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