NXP Semiconductors MRFE6VP61K25HSR5
- Part No.:
- MRFE6VP61K25HSR5
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-1230-4S
- Datasheet:
-
MRFE6VP61K25HSR5.pdf
- Description:
- RF MOSFET LDMOS 50V NI1230
- Quantity:
- Payment:

- Shipping:

Inventory:66
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Product details
Overview
MRFE6VP61K25HSR5 from NXP Semiconductors (formerly Freescale) is a high-ruggedness, 50 V, 1250 W CW RF power LDMOS transistor optimized for broadband operation from 1.8 to 600 MHz. It delivers 27 dB gain and 84% drain efficiency at 81.36 MHz CW, supports unmatched input/output matching, and is qualified for industrial plasma exciters, FM broadcast transmitters, and land mobile radio amplifiers.
For engineers reviewing the MRFE6VP61K25HSR5 datasheet, MRFE6VP61K25HSR5 pinout, MRFE6VP61K25HSR5 application, or MRFE6VP61K25HSR5 equivalent, key selection criteria include its 225 °C junction temperature rating, >65:1 load mismatch tolerance at 230 MHz, dual-gate/dual-drain push-pull capability, and NI-1230S-4S gull-wing surface-mount package with source-connected backside thermal path.
Technical Context
This device implements a lateral N-channel enhancement-mode LDMOS structure with integrated ESD protection enabling ±6 V gate-source voltage range. Its series-equivalent large-signal impedance model is characterized across 1.8–600 MHz, supporting both single-ended and balanced push-pull configurations without external balun requirements.
Thermal design relies on low 0.15 °C/W junction-to-case resistance under 1250 W CW operation at TC = 63 °C, with pulse-mode thermal impedance reduced to 0.03 °C/W. Gate threshold voltage is tightly specified at 1.7–2.7 V, and forward transconductance is 28.0 S - enabling stable Class AB/C biasing for linear and saturated RF power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 1.8–600 MHz - enables single-device coverage of HF/VHF/UHF bands without retuning. |
| Output Power (CW) | 1250 W @ 230 MHz, 50 V - sufficient for high-power FM broadcast and industrial plasma drivers. |
| Power Gain | 27 dB @ 81.36 MHz CW - reduces driver stage complexity and improves system efficiency. |
| Drain Efficiency | 84% @ 81.36 MHz CW - minimizes heat dissipation and cooling subsystem cost. |
| Junction Temp Limit | 225 °C - supports high ambient operation in sealed enclosures or high-power density designs. |
| VSWR Tolerance | >65:1 @ 230 MHz pulse - ensures survivability under antenna mismatch in broadcast and aerospace systems. |
| Package | NI-1230S-4S - gull-wing leadframe with exposed copper backside for direct heatsink mounting. |
Pinout & Package
The MRFE6VP61K25HSR5 uses the NI-1230S-4S surface-mount package: a thermally enhanced gull-wing leadframe with an electrically connected copper backside serving as the common source terminal. Dimensions are 22.2 mm × 19.0 mm × 4.5 mm (L × W × H), with 4 gull-wing leads and a 0.8 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate A) | Control electrode for first transistor cell | Enables independent gate biasing in push-pull configuration; requires matched gate drive network. |
| Pin 2 (Gate B) | Control electrode for second transistor cell | Paired with Pin 1 for balanced differential drive; critical for IMD suppression in linear amplifiers. |
| Pin 3 (Drain A) | High-current output node for first cell | Carries up to 1250 W RF output; must be routed with low-inductance, wide-copper paths to heatsink. |
| Pin 4 (Drain B) | High-current output node for second cell | Used in parallel or push-pull output combiner; shared thermal path via backside source connection. |
Key Features
| Feature | Design Value |
|---|---|
| Unmatched broadband operation | Eliminates external matching networks below 600 MHz - reduces PCB area and insertion loss. |
| Dual-gate/dual-drain architecture | Supports true push-pull without balun - improves even-order harmonic suppression and thermal symmetry. |
| Integrated ESD protection | Passes 3500 V HBM - enables robust handling during assembly and field maintenance. |
| Characterized large-signal impedances | Provides Zsource/Zload data for 13 frequency points - accelerates matching network synthesis and simulation convergence. |
| Qualified for 50 V operation | Enables higher output power vs. 28 V devices - reduces number of stages in multi-kW amplifier chains. |
Applications
| FM Broadcast Transmitter | Industrial Plasma Exciter |
|---|---|
Use Scenario: Final-stage RF amplifier in 87.5–108 MHz analog/digital FM broadcast transmitters delivering 1100 W CW output. IC Role / Device Role / Timing Role: High-efficiency, high-linearity power output stage operating in Class AB with 85% drain efficiency at 98 MHz. Use Value: Delivers 1100 W CW with <−30 dBc third-order IMD - meets ITU-R BS.450 spectral mask requirements without predistortion. | Use Scenario: RF energy source for semiconductor manufacturing plasma chambers requiring stable 2–30 MHz excitation at 1250 W. IC Role / Device Role / Timing Role: Ruggedized power switch in solid-state RF generator, operating continuously under variable load impedance. Use Value: Survives >65:1 VSWR at 230 MHz - eliminates need for circulators or automatic tuning in reactive plasma loads. |
| Aerospace HF Communications | Land Mobile Radio Base Station |
Use Scenario: Final amplifier in airborne HF transceivers covering 1.8–30 MHz, operating in pulsed mode with 20% duty cycle. IC Role / Device Role / Timing Role: High-reliability RF power stage delivering 1250 W peak in 100 µs pulses at 27 MHz. Use Value: MTTF >1×10⁷ hours at TJ = 150 °C - exceeds MIL-STD-883 reliability requirements for avionics. | Use Scenario: 144–148 MHz repeater final amplifier in public safety trunked radio systems requiring 1250 W PEP output. IC Role / Device Role / Timing Role: Linear Doherty-style output stage biased for Class AB, delivering 1250 W PEP with <−42 dBc harmonics. Use Value: Achieves −42 dBc 2nd harmonic at 1 kW - complies with FCC Part 90 spectral purity limits without external filtering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRFE6VP61K25HR5 | Same die, NI-1230H-4S flange-mount package; 0.15 mm thicker baseplate; no gull-wing leads. | Requires mechanical screw-down mounting; better for forced-air-cooled chassis; unsuitable for reflow-only assembly. | Select HR5 when thermal interface uses thermal paste + screws; select HSR5 for automated SMT assembly with heatsink clamping. |
| MRFE6VP61K25GSR5 | Same die, NI-1230GS-4L package with longer leads; different leadform geometry and tape/reel orientation. | Designed for wave soldering or selective solder processes; lead pitch identical but standoff height differs. | Choose GSR5 only if legacy board layout matches GS-4L footprint; HSR5 is preferred for new designs using standard gull-wing reflow. |
Compared with MRFE6VP61K25HR5 and MRFE6VP61K25GSR5, the MRFE6VP61K25HSR5 offers identical RF performance and ruggedness while enabling fully automated SMT placement and reflow soldering - reducing assembly cost and improving thermal interface consistency in high-volume broadcast amplifier production.
Availability
MRFE6VP61K25HSR5 is available at Aetrix Electronics and suitable for FM broadcast transmitters, industrial plasma exciters, and land mobile radio base stations requiring stable component supply and long-term obsolescence management.
Supply support for MRFE6VP61K25HSR5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in high-performance RF power solutions, formed from the acquisition of Freescale Semiconductor in 2015. The company specializes in silicon and GaN RF transistors for mission-critical infrastructure.
The MRFE6VP61K25HSR5 belongs to NXP's MRFE6VP6xK25 family of wideband LDMOS transistors, engineered specifically for high-efficiency, high-ruggedness RF power amplification in broadcast, industrial, and aerospace systems operating up to 600 MHz.
FAQ
What is the maximum continuous drain current rating for MRFE6VP61K25HSR5?
The MRFE6VP61K25HSR5 does not specify a maximum continuous drain current (ID) rating. Instead, it defines safe operating limits via total device dissipation (1333 W at TC = 25 °C), junction temperature (225 °C), and thermal resistance (0.15 °C/W). Actual ID depends on operating voltage, duty cycle, and heatsink performance - for example, at 50 V and 1250 W CW, average ID is approximately 25 A, but peak pulse current exceeds 100 A.
Does MRFE6VP61K25HSR5 require external gate protection diodes?
No, the MRFE6VP61K25HSR5 integrates ESD protection rated to 3500 V HBM, 250 V MM, and 4000 V CDM. External gate protection diodes are not required for normal operation or ESD handling. However, transient voltage suppressors may still be recommended in high-noise RF environments where gate drive lines couple strong RF energy.
Can MRFE6VP61K25HSR5 be operated at 28 V for lower-power applications?
Yes, the MRFE6VP61K25HSR5 is characterized from 30 V to 50 V, and functional testing confirms stable operation at 28 V. At 28 V, typical CW output drops to ~600 W with ~70% efficiency at 230 MHz. This allows flexible use in multi-voltage amplifier architectures, though full 1250 W performance requires ≥30 V supply per datasheet specifications.
What is the gate-source leakage current specification for MRFE6VP61K25HSR5?
The MRFE6VP61K25HSR5 specifies gate-source leakage current (IGSS) as ≤1 µA at VGS = 5 Vdc and VDS = 0 Vdc, measured at TA = 25 °C. This low leakage supports stable quiescent current control and minimizes bias network loading in high-impedance gate drive circuits used in Class AB amplifiers.
Is the backside of the MRFE6VP61K25HSR5 package electrically active?
Yes, the copper backside of the MRFE6VP61K25HSR5 NI-1230S-4S package is the common source terminal for both internal transistor cells. It must be electrically and thermally connected to the system ground plane and heatsink. Isolating the backside violates the device's electrical and thermal specifications and will cause immediate failure.
MRFE6VP61K25HSR5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-1230-4S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- LDMOS
- Configuration:
- Dual
- Frequency:
- 230MHz
- Gain:
- 24dB
- Voltage - Test:
- 50 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 100 mA
- Power - Output:
- 1250W
- Voltage - Rated:
- 133 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-1230-4S
MRFE6VP61K25HSR5 FAQ
1.How can I place an order for MRFE6VP61K25HSR5 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFE6VP61K25HSR5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFE6VP61K25HSR5 reliable?
The price and inventory of MRFE6VP61K25HSR5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFE6VP61K25HSR5 is usually 5 days.
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Once your MRFE6VP61K25HSR5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFE6VP61K25HSR5?
For technical support, including MRFE6VP61K25HSR5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFE6VP61K25HSR5 requirements.
6.How does Aetrix verify that MRFE6VP61K25HSR5 is sourced from the original manufacturer or authorized distributors?
All MRFE6VP61K25HSR5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFE6VP61K25HSR5 meets industry standards.
7.What is the process for return or replacement of MRFE6VP61K25HSR5?
All MRFE6VP61K25HSR5 units undergo pre-shipment inspection (PSI). If there is an issue with MRFE6VP61K25HSR5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFE6VP61K25HSR5 part is unused and in its original packaging.
Return procedure for MRFE6VP61K25HSR5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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