NXP Semiconductors MRFG35002N6T1
- Part No.:
- MRFG35002N6T1
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- PLD-1.5
- Datasheet:
-
MRFG35002N6T1.pdf
- Description:
- RF MOSFET PHEMT FET 6V PLD-1.5
- Quantity:
- Payment:

- Shipping:

Inventory:6,990
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Product details
Overview
MRFG35002N6T1 from Freescale Semiconductor is a gallium arsenide (GaAs) pseudomorphic high-electron-mobility transistor (PHEMT) RF power FET designed for WLL/MMDS/BWA and UMTS driver applications. It delivers 1.5 W P1dB at 3550 MHz under CW conditions, achieves 10 dB power gain and 27% drain efficiency at 3550 MHz with 158.5 mW average W-CDMA output, and operates from 500 to 5000 MHz in unmatched Class AB configurations for CPE amplifiers.
For engineers reviewing the MRFG35002N6T1 datasheet, MRFG35002N6T1 pinout, MRFG35002N6T1 application, or MRFG35002N6T1 equivalent, this device requires attention to gate bias stability, thermal management via its 15.2 °C/W junction-to-case resistance, S-parameter matching across 0.5–5.45 GHz, and compatibility with 6 V DC supply and 65 mA quiescent drain current in RF driver stages.
Technical Context
This GaAs PHEMT operates in common-source Class AB configuration with VDS = 6 V and IDQ = 65 mA. Its unmatched design necessitates external input/output impedance matching networks-verified using Freescale's PLD-1.5 test fixture with Rogers 4350 PCB and specified microstrip dimensions-to achieve optimal W-CDMA linearity (ACPR = –41 dBc) and phase/group delay performance.
Thermal operation is constrained by a maximum channel temperature of 150 °C and a case operating range of –20 to +85 °C, supported by RθJC = 15.2 °C/W. The device meets JESD22-A113 moisture sensitivity level 1 and RoHS compliance, packaged in plastic CASE 466-03 (STYLE 1) with 1000 units per 12 mm tape-and-reel (T1 suffix).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| P1dB (CW) | 1.5 W at 3550 MHz - defines maximum linear output before 1 dB compression in continuous-wave operation |
| Power Gain | 10 dB typical at 3550 MHz - enables single-stage driver amplification without cascaded gain blocks |
| Drain Efficiency | 27% typical at 3550 MHz - reduces heat dissipation and DC power demand in battery- or thermally constrained CPE |
| ACPR @ ±5 MHz | –41 dBc in 3.84 MHz channel - meets W-CDMA spectral mask requirements for adjacent channel interference suppression |
| VDS Max | 8 Vdc - sets absolute upper limit for drain supply voltage to prevent catastrophic breakdown |
| RθJC | 15.2 °C/W - determines required heatsink thermal resistance to maintain Tch ≤ 150 °C at full RF output |
| Frequency Range | 500–5000 MHz - supports multi-band WLL, MMDS, BWA, and UMTS infrastructure driver applications |
Pinout & Package
MRFG35002N6T1 uses a 4-pin plastic surface-mount package (CASE 466-03, STYLE 1), designated PLD-1.5. Pin 1 is Drain, Pin 2 is Gate, Pins 3 and 4 are Source terminals-enabling dual-source connection for improved grounding and thermal conduction in RF PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Drain | Main RF power output node; connects to output matching network and DC supply via RF choke |
| 2 | Gate | RF input control terminal; requires stable negative bias (VGS(Q) = –1.1 to –0.6 V) and ESD protection |
| 3 & 4 | Source | Common RF/DC ground reference; dual pins reduce parasitic inductance and improve thermal path to PCB copper |
Key Features
| Feature | Design Value |
|---|---|
| High Linearity | –41 dBc ACPR at 3550 MHz enables compliant W-CDMA transmission without digital predistortion complexity |
| Phase & Group Delay Stability | Excellent linearity over frequency ensures minimal signal distortion in wideband modulation schemes |
| Unmatched Architecture | Allows custom impedance tuning for specific band and efficiency targets-no internal matching components |
| RoHS Compliance | Meets EU Directive 2011/65/EU for lead-free assembly and environmental safety in production |
| Tape-and-Reel Packaging | T1 suffix denotes 1000-unit 12 mm reel-optimized for automated SMT placement in high-volume CPE manufacturing |
Applications
| Fixed Wireless Access (FWA) CPE | MMDS Base Station Driver |
|---|---|
Use Scenario: Outdoor customer premise equipment transmitting 3.5 GHz W-CDMA signals over point-to-multipoint links. IC Role / Device Role / Timing Role: RF power driver stage amplifying baseband-modulated signals prior to final PA and antenna feed. Use Value: 1.5 W P1dB and 27% efficiency enable compact, fanless CPE enclosures while meeting regulatory spectral masks via –41 dBc ACPR. | Use Scenario: Medium-power uplink driver in 2.5–3.7 GHz MMDS infrastructure serving rural broadband. IC Role / Device Role / Timing Role: Linear gain block between IF modulator and high-power final amplifier in multi-carrier transmit chain. Use Value: Broad 500–5000 MHz coverage and stable S-parameters support reconfigurable band filtering without hardware change. |
| UMTS Band I Driver Amplifier | Broadband Wireless Access (BWA) Transmitter |
Use Scenario: 1920–1980 MHz UMTS uplink driver in small-cell femtocell base stations. IC Role / Device Role / Timing Role: High-gain (10 dB), low-distortion intermediate amplifier ensuring EVM < 8% at 158.5 mW avg. output. Use Value: Verified W-CDMA performance at 3550 MHz extrapolates to Band I with appropriate matching-reducing qualification time. | Use Scenario: 3.3–3.8 GHz BWA transmitter in municipal WiMAX or LTE-TDD deployments. IC Role / Device Role / Timing Role: Unmatched RF driver enabling flexible front-end architecture with external harmonic filtering and PA selection. Use Value: Dual-source pins and 15.2 °C/W RθJC support reliable 24/7 outdoor operation in uncooled rooftop enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF7S35015HSR3 | Higher P1dB (15 W), LDMOS process, requires 28 V supply vs. MRFG35002N6T1's 6 V GaAs architecture | Suitable for macrocell final PA; not drop-in for low-voltage CPE drivers | Select MRFG35002N6T1 for 6 V, space-constrained, thermally sensitive driver stages; choose MRF7S35015HSR3 only when >5 W output and 28 V infrastructure exist |
| QPD1005 | Gallium nitride (GaN) HEMT, 10 W P1dB, 28 V operation, higher efficiency (>55%), wider bandwidth (1.8–3.8 GHz) | Targets high-efficiency base station final PA-not optimized for sub-2 W driver linearity | MRFG35002N6T1 remains preferred for cost-sensitive, low-voltage, W-CDMA-compliant driver designs where GaN's voltage/complexity overhead is unjustified |
Compared with MRF7S35015HSR3 and QPD1005, MRFG35002N6T1 offers uniquely optimized 6 V operation, unmatched flexibility, and verified W-CDMA linearity at sub-2 W levels-making it irreplaceable in thermally constrained, low-supply-voltage CPE driver applications despite lower absolute power.
Availability
MRFG35002N6T1 is available at Aetrix Electronics and suitable for fixed wireless access (FWA) CPE, MMDS infrastructure, and UMTS driver amplifier applications requiring stable component supply, long-term obsolescence planning, and traceable sourcing for industrial RF design.
Supply support for MRFG35002N6T1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of RF power transistors, microcontrollers, and analog ICs for automotive, industrial, and wireless infrastructure markets.
The MRFG35002N6T1 belongs to Freescale's GaAs PHEMT RF power FET product line, engineered specifically for high-linearity, high-efficiency driver amplification in 3.5 GHz wireless broadband systems including WLL, MMDS, BWA, and UMTS.
FAQ
What is the maximum operating frequency range for the MRFG35002N6T1?
The MRFG35002N6T1 is characterized from 500 MHz to 5000 MHz, with key W-CDMA performance data validated at 3550 MHz. Its S-parameters are fully specified up to 5.45 GHz, supporting use in multi-band 3.3–3.8 GHz BWA, UMTS Band I, and MMDS applications when matched appropriately. Operation beyond 5 GHz is not guaranteed by Freescale's published specifications for MRFG35002N6T1.
Does the MRFG35002N6T1 require external matching networks?
Yes, the MRFG35002N6T1 is an unmatched GaAs PHEMT and requires external input and output matching networks to achieve target gain, efficiency, and linearity. Freescale provides a complete test circuit schematic and layout (including microstrip dimensions and capacitor values) in the MRFG35002N6T1 datasheet to guide implementation of these networks on Rogers 4350 PCB material.
What is the recommended gate bias voltage for MRFG35002N6T1 in Class AB operation?
The MRFG35002N6T1 specifies a quiescent gate voltage VGS(Q) of –1.1 V to –0.6 V at VDS = 6 V and ID = 65 mA. A stable, low-noise negative bias supply is required-typically implemented with a resistive divider and bypass capacitors-to maintain consistent Class AB operating point and prevent thermal runaway during RF drive.
Is MRFG35002N6T1 still in active production or obsolete?
The MRFG35002N6T1 has been formally replaced by MRFG35002N6AT1 per Freescale documentation (Rev. 2, Jan. 2008). While MRFG35002N6T1 is no longer actively manufactured, Aetrix Electronics maintains legacy inventory and supports design continuity for existing CPE and infrastructure programs still utilizing this qualified RF FET.
How does the thermal resistance of MRFG35002N6T1 impact heatsink design?
With a junction-to-case thermal resistance (RθJC) of 15.2 °C/W, the MRFG35002N6T1 demands careful thermal interface design. To keep channel temperature below 150 °C at full 1.5 W RF output, the total thermal path-including PCB copper area, thermal vias, and heatsink-must limit total RθJA to ≤ 35 °C/W under worst-case ambient (85 °C case temperature), requiring direct metal-core PCB mounting or low-thermal-resistance clip-on heatsinks.
MRFG35002N6T1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- PLD-1.5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- pHEMT FET
- Configuration:
- -
- Frequency:
- 3.55GHz
- Gain:
- 10dB
- Voltage - Test:
- 6 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 65 mA
- Power - Output:
- 1.5W
- Voltage - Rated:
- 8 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLD-1.5
MRFG35002N6T1 FAQ
1.How can I place an order for MRFG35002N6T1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFG35002N6T1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFG35002N6T1 reliable?
The price and inventory of MRFG35002N6T1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFG35002N6T1 is usually 5 days.
3.What payment methods are accepted for MRFG35002N6T1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFG35002N6T1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFG35002N6T1?
MRFG35002N6T1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFG35002N6T1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFG35002N6T1?
For technical support, including MRFG35002N6T1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFG35002N6T1 requirements.
6.How does Aetrix verify that MRFG35002N6T1 is sourced from the original manufacturer or authorized distributors?
All MRFG35002N6T1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFG35002N6T1 meets industry standards.
7.What is the process for return or replacement of MRFG35002N6T1?
All MRFG35002N6T1 units undergo pre-shipment inspection (PSI). If there is an issue with MRFG35002N6T1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFG35002N6T1 part is unused and in its original packaging.
Return procedure for MRFG35002N6T1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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