NXP Semiconductors MRFG35003N6AT1
- Part No.:
- MRFG35003N6AT1
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- PLD-1.5
- Datasheet:
-
MRFG35003N6AT1.pdf
- Description:
- RF MOSFET PHEMT FET 6V PLD-1.5
- Quantity:
- Payment:

- Shipping:

Inventory:448
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Product details
Overview
MRFG35003N6AT1 from NXP Semiconductors (formerly Freescale) is a gallium arsenide pseudomorphic high-electron-mobility transistor (GaAs PHEMT) RF power amplifier designed for driver-stage operation in WLL/MMDS/BWA and UMTS infrastructure equipment. It delivers 3 W P1dB at 3550 MHz under CW conditions, achieves 10 dB power gain and 27% drain efficiency at 450 mW average W-CDMA output, and operates across 500–5000 MHz with unmatched input/output ports.
For engineers reviewing the MRFG35003N6AT1 datasheet, MRFG35003N6AT1 pinout, MRFG35003N6AT1 application, or MRFG35003N6AT1 equivalent, this device supports critical design decisions for broadband RF power stages requiring high linearity, phase stability, and thermal robustness in customer premise equipment (CPE) and base station driver modules.
Technical Context
This GaAs PHEMT operates in Class AB bias (IDQ = 180 mA at VDD = 6 V), optimized for single-carrier W-CDMA signals with 3.84 MHz bandwidth and 8.5 dB PAR. Its unmatched configuration requires external matching networks, as confirmed by the Freescale test circuit using microstrip lines and discrete ATC/AVX capacitors on Rogers 4350 PCB.
Thermal performance is defined by RθJC = 5.9 °C/W and a maximum channel temperature of 175 °C (derated to 150 °C for reliable operation). ESD protection meets HBM Class 2, MM Class A, and CDM Class IV per JESD22 standards, with MSL Level 3 per J-STD-020.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| P1dB (CW) | 3 W at 3550 MHz - defines maximum linear CW output before 1 dB compression |
| Power Gain | 10 dB typical at 3550 MHz - enables compact two-stage amplifier designs without intermediate gain blocks |
| Drain Efficiency | 27% typical at 450 mW W-CDMA avg. output - reduces thermal load and DC power supply requirements |
| ACPR @ ±5 MHz | –42.5 dBc in 3.84 MHz BW - meets stringent spectral mask requirements for W-CDMA uplink transmission |
| VDS Max | 8 Vdc - sets absolute upper limit for drain supply rail design margin |
| RθJC | 5.9 °C/W - enables accurate junction temperature estimation from case temperature measurements |
| Channel Temp Max | 150 °C operating limit - constrains heatsink selection and airflow requirements in sealed CPE enclosures |
Pinout & Package
MRFG35003N6AT1 uses the PLD-1.5 plastic package (Case 466-03, Style 1), a 4-pin surface-mount leadless device with exposed drain paddle for thermal conduction. Dimensions: 6.93 × 6.22 mm footprint, 1.60 mm height, 0.51 mm thickness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | RF Power Output / DC Supply Node | Primary current path; must be thermally anchored to PCB ground plane via exposed paddle and multiple vias |
| 2. Gate | RF Input Control Terminal | High-impedance control node; requires DC blocking and bias network isolation from RF path |
| 3. Source | RF/DC Common Reference | Low-inductance return path; tied directly to ground plane with minimal trace length |
| 4. Source | Secondary RF/DC Common Reference | Dual-source configuration improves grounding integrity and reduces source inductance in high-frequency operation |
Key Features
| Feature | Design Value |
|---|---|
| Phase linearity & group delay stability | Enables low EVM in OFDM and W-CDMA modulation without complex predistortion calibration |
| Unmatched RF ports | Permits custom impedance matching for target frequency band and system PA architecture |
| RoHS-compliant plastic packaging | Meets environmental compliance for global telecom equipment deployment and recycling requirements |
| Tape-and-reel packaging (T1 suffix) | 1000 units per 12 mm, 7-inch reel - supports automated SMT assembly in volume production |
Applications
| Wireless Local Loop (WLL) CPE | MMDS/BWA Base Station Driver |
|---|---|
Use Scenario: Outdoor customer premise transceiver operating in 2.5–3.7 GHz licensed bands for fixed wireless access. IC Role / Device Role / Timing Role: Final-stage RF power driver amplifying uplink signal prior to antenna coupling. Use Value: Delivers 3 W P1dB with –42.5 dBc ACPR to meet FCC Part 101 spectral emission limits while maintaining 27% efficiency under real-world W-CDMA traffic. |
Use Scenario: Point-to-multipoint base station sector module transmitting in 3.5 GHz BWA spectrum. IC Role / Device Role / Timing Role: Medium-power driver stage feeding a higher-power final amplifier or antenna array feed network. Use Value: Provides 10 dB gain and excellent group delay flatness across 3450–3650 MHz, enabling consistent modulation quality across wide instantaneous bandwidths. |
| UMTS Band I Driver Amplifier | Fixed-Mobile Convergence Unit |
Use Scenario: Indoor femtocell or picocell unit supporting UMTS 2100 MHz uplink transmission. IC Role / Device Role / Timing Role: Linear driver amplifier operating in Class AB with precise quiescent current control (IDQ = 180 mA). Use Value: Achieves <–42 dBc ACPR at 450 mW avg. output while maintaining 22–27% drain efficiency, reducing thermal management complexity in space-constrained enclosures. |
Use Scenario: Integrated broadband gateway combining LTE, WiMAX, and cordless telephony in multi-service residential units. IC Role / Device Role / Timing Role: Reconfigurable RF driver supporting multiple air interfaces via software-defined bias and matching networks. Use Value: Broad 500–5000 MHz frequency coverage and stable phase response allow shared hardware platform across 800 MHz, 2.1 GHz, and 3.5 GHz bands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF7S35030HSR3 | Higher P1dB (30 W), LDMOS technology, 28 V operation, larger TO-270WB package | Suitable for macro base station final PA stages, not CPE driver replacement | Select when >5 W output and 28 V architecture are required; not drop-in compatible |
| QPD1003 | GaAs pHEMT, 3.5 GHz, 2.5 W P1dB, 12 V operation, different pinout (3-pin SOT-89) | Lower power, single-source configuration, limited to lower-efficiency Class A bias | Consider for cost-sensitive, lower-power CPE designs where board space permits SOT-89 mounting |
Compared with MRF7S35030HSR3 and QPD1003, MRFG35003N6AT1 uniquely balances 3 W output, 6 V operation, dual-source thermal grounding, and unmatched flexibility for compact, efficient driver stages in sub-6 GHz licensed-band CPE-without requiring voltage rail or PCB layout changes.
Availability
MRFG35003N6AT1 is available at Aetrix Electronics and suitable for wireless local loop (WLL), broadband wireless access (BWA), and UMTS infrastructure applications requiring stable component supply, long-term obsolescence management, and RoHS-compliant RF power solutions.
Supply support for MRFG35003N6AT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale Semiconductor in 2015 and continues to support its RF power portfolio for telecom infrastructure, automotive radar, and industrial heating applications.
The MRFG35003N6AT1 belongs to Freescale's legacy GaAs PHEMT RF power FET family, engineered specifically for high-efficiency, high-linearity driver amplifiers in 500–5000 MHz licensed wireless infrastructure equipment.
FAQ
What is the recommended gate bias voltage for MRFG35003N6AT1 in Class AB operation?
The MRFG35003N6AT1 specifies a typical quiescent gate voltage VGS(Q) of –0.82 V at VDD = 6 V and IDQ = 180 mA. This value is confirmed in Table 5 of the datasheet and must be set using a stable, low-noise bias network to maintain linearity and prevent thermal runaway. The MRFG35003N6AT1 gate threshold range (–1.2 to –0.7 V) allows fine-tuning for specific PA architecture requirements.
Does MRFG35003N6AT1 require external matching components for 3550 MHz operation?
Yes, MRFG35003N6AT1 is an unmatched device and requires external microstrip-based matching networks for optimal 3550 MHz performance. Figure 1 in the datasheet shows the full test circuit, including Z1–Z17 microstrip segments and 13 discrete capacitors (e.g., AVX 08051J0R5BBS, ATC100A100JT150XT). These components establish 50 Ω input/output impedance transformation and harmonic suppression essential for meeting W-CDMA ACPR specifications.
What is the maximum allowable channel temperature for continuous operation of MRFG35003N6AT1?
The MRFG35003N6AT1 has a maximum channel temperature rating of 175 °C, but Freescale specifies 150 °C as the maximum operating channel temperature for reliable long-term operation. This derating is critical for CPE applications where ambient temperatures may reach 70 °C and airflow is limited. Thermal design must use RθJC = 5.9 °C/W and ensure case temperature remains ≤100 °C under worst-case RF and DC loading.
Is MRFG35003N6AT1 suitable for OFDM-based systems like WiMAX or LTE?
Yes, MRFG35003N6AT1 demonstrates validated OFDM performance: Figure 7 shows EVM and drain efficiency versus output power for 802.16d (WiMAX) 64-QAM 3/4 with 7 MHz bandwidth and 9.5 dB PAR. Its excellent phase linearity and group delay characteristics-highlighted as a key feature-directly support low-EVM operation in OFDM waveforms, making MRFG35003N6AT1 applicable beyond W-CDMA to multi-standard CPE platforms.
What does the 'T1' suffix indicate in MRFG35003N6AT1?
The 'T1' suffix in MRFG35003N6AT1 denotes tape-and-reel packaging: 1000 devices per 12 mm wide, 7-inch diameter reel. This format is optimized for high-speed pick-and-place SMT assembly. The datasheet confirms this in the Features section and Package Dimensions page, specifying compatibility with standard 12 mm feeder systems and RoHS-compliant plastic carrier tape.
MRFG35003N6AT1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- PLD-1.5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- pHEMT FET
- Configuration:
- -
- Frequency:
- 3.55GHz
- Gain:
- 10dB
- Voltage - Test:
- 6 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 180 mA
- Power - Output:
- 450mW
- Voltage - Rated:
- 8 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLD-1.5
MRFG35003N6AT1 FAQ
1.How can I place an order for MRFG35003N6AT1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFG35003N6AT1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFG35003N6AT1 reliable?
The price and inventory of MRFG35003N6AT1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFG35003N6AT1 is usually 5 days.
3.What payment methods are accepted for MRFG35003N6AT1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFG35003N6AT1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFG35003N6AT1?
MRFG35003N6AT1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFG35003N6AT1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFG35003N6AT1?
For technical support, including MRFG35003N6AT1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFG35003N6AT1 requirements.
6.How does Aetrix verify that MRFG35003N6AT1 is sourced from the original manufacturer or authorized distributors?
All MRFG35003N6AT1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFG35003N6AT1 meets industry standards.
7.What is the process for return or replacement of MRFG35003N6AT1?
All MRFG35003N6AT1 units undergo pre-shipment inspection (PSI). If there is an issue with MRFG35003N6AT1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFG35003N6AT1 part is unused and in its original packaging.
Return procedure for MRFG35003N6AT1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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