NXP Semiconductors MRFG35003NT1
- Part No.:
- MRFG35003NT1
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- PLD-1.5
- Datasheet:
-
MRFG35003NT1.pdf
- Description:
- RF MOSFET PHEMT FET 12V PLD-1.5
- Quantity:
- Payment:

- Shipping:

Inventory:5,288
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Product details
Overview
MRFG35003NT1 from Freescale Semiconductor is a Gallium Arsenide PHEMT RF power field-effect transistor designed for WLL/MMDS/BWA and UMTS driver applications at 1.8–3.6 GHz. It delivers 3 W P1dB at 3.55 GHz, 11.5 dB power gain, and 25% drain efficiency under Class AB operation at 12 V, IDQ = 55 mA - enabling linear base station amplifier stages.
For engineers reviewing the MRFG35003NT1 datasheet, MRFG35003NT1 pinout, MRFG35003NT1 application, or MRFG35003NT1 equivalent, this device is selected for high-linearity, high-efficiency RF power amplification in 3G/4G infrastructure where ACPR < −42 dBc and phase linearity are critical.
Technical Context
The MRFG35003NT1 operates as a common-source GaAs PHEMT with unmatched input/output impedance, requiring external matching networks for optimal performance. Its S-parameters (e.g., |S21| = 1.620 @ 3.55 GHz) and load-pull-validated characteristics confirm suitability for broadband linear amplification in 3.5 GHz band infrastructure.
Thermal design is constrained by RθJC = 18.5 °C/W and a maximum channel temperature of 175 °C (derated to 150 °C for reliable operation). The device supports stable Class AB biasing via VGS(Q) = −0.9 V (typ) at IDQ = 55 mA and VDS = 12 Vdc.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| P1dB Output Power | 3 W @ 3.55 GHz - enables driver-stage amplification before final PA in macrocell/base station transceivers |
| Power Gain | 11.5 dB @ 3.55 GHz - reduces required driver stage count in multi-stage RF chains |
| Drain Efficiency | 25% @ 0.30 W avg output - balances linearity and thermal load in continuous-wave and W-CDMA modulated operation |
| ACPR | −42 dBc @ 3.55 GHz, W-CDMA, 64 DPCH - meets stringent spectral mask requirements for 3GPP-compliant base stations |
| Operating Frequency Range | 1.8–3.6 GHz - covers key bands for UMTS Band I (2100 MHz), Band VIII (900 MHz), and MMDS/WLL allocations |
| Maximum Drain Voltage | 15 Vdc - allows safe operation with 12 V supply and transient margin |
| Thermal Resistance | RθJC = 18.5 °C/W - dictates heatsink interface requirements for sustained 3 W operation at TC ≤ +85 °C |
Pinout & Package
MRFG35003NT1 uses the PLD-1.5 plastic package (Case 466-03, Style 1), a 4-pin surface-mount leadless structure with dual-source terminals for low-inductance grounding. Package dimensions: 6.93 × 6.22 × 1.60 mm (L × W × H), RoHS-compliant with lead-free terminations (N suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | RF Power Output Node | High-current RF output path; requires low-impedance thermal and RF ground return via package bottom |
| 2. Gate | RF Input Control Terminal | High-impedance control node; DC-biased at ~−0.9 V for Class AB; sensitive to ESD and layout parasitics |
| 3. Source | RF/Common Ground Reference | Primary RF ground reference and DC return; electrically tied to pin 4 for minimized source inductance |
| 4. Source | Secondary RF Ground Terminal | Dual-source configuration reduces source inductance and improves stability and gain flatness above 3 GHz |
Key Features
| Feature | Design Value |
|---|---|
| Unmatched RF I/O | Enables flexible external matching for custom frequency band optimization (e.g., 3.5 GHz WLL or UMTS Band I) |
| High Phase Linearity | Supports wideband modulation (W-CDMA, OFDMA) without distortion-induced EVM degradation |
| Group Delay Stability | Maintains signal integrity across 3.5 GHz bandwidth, critical for multi-carrier and MIMO baseband alignment |
| RoHS-Compliant Packaging | N-suffix lead-free terminations meet global environmental compliance without performance trade-offs |
| Tape-and-Reel Delivery | T1 suffix denotes 1000-unit 12 mm × 7″ reel - optimized for automated SMT placement in high-volume RF module assembly |
Applications
| UMTS Base Station Driver | WLL/MMDS Transmitter |
|---|---|
Use Scenario: Final driver stage in 2100 MHz UMTS macrocell BTS, preceding GaN final PA. IC Role / Device Role / Timing Role: Linear RF power amplifier delivering 300 mW average output with −42 dBc ACPR under 64-DPCH W-CDMA modulation. Use Value: Enables high-fidelity uplink signal amplification while meeting 3GPP TS 25.104 spectral mask and ACLR requirements. |
Use Scenario: Transmit amplifier in 3.5 GHz licensed WLL access point serving fixed wireless broadband subscribers. IC Role / Device Role / Timing Role: Class AB GaAs PHEMT providing 3 W saturated output and 11.5 dB gain across 3.4–3.6 GHz band. Use Value: Delivers sufficient drive level for antenna array feed networks while maintaining group delay flatness for multi-user beamforming coherence. |
| BWA Infrastructure Amplifier | 3.5 GHz Test Bench Driver |
Use Scenario: Medium-power amplifier in 3.5 GHz BWA customer premise equipment (CPE) outdoor unit. IC Role / Device Role / Timing Role: Unmatched RF FET biased at IDQ = 55 mA, VDS = 12 V for linear operation with 25% efficiency. Use Value: Provides robust small-signal gain and compression headroom for OFDM-based IEEE 802.16d/e signals without spectral regrowth. |
Use Scenario: Calibration and stimulus source in 3.5 GHz RF lab test setups requiring repeatable, stable gain. IC Role / Device Role / Timing Role: Bench-mounted matched amplifier using documented Z1–Z18 microstrip network per Figure 1 for known 50 Ω system interface. Use Value: Offers traceable S-parameter data (Table 6) and load-pull-validated performance for metrology-grade characterization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRFG35003ANT1 | Direct replacement per Freescale revision history; identical electrical specs, improved manufacturing consistency and updated qualification | No functional or layout change required; same pinout, thermal profile, and matching network | Select MRFG35003ANT1 for new designs or inventory refresh to ensure long-term availability and latest process revision |
| QPD1005 | Gallium Nitride HEMT; higher P1dB (5 W), higher gain (14 dB), but requires 28 V supply and different bias sequencing | Suitable for higher-output driver or final PA stages; not drop-in due to voltage, thermal, and gate drive differences | Choose QPD1005 only when upgrading output power beyond 3 W or migrating to GaN-based architecture with revised power delivery |
Compared with MRFG35003NT1, MRFG35003ANT1 offers identical RF performance with enhanced process control, while QPD1005 provides higher power capability at the cost of increased supply voltage, thermal management complexity, and non-interchangeable biasing - making MRFG35003NT1 optimal for established 12 V, 3 W Class AB driver designs.
Availability
MRFG35003NT1 is available at Aetrix Electronics and suitable for UMTS base station drivers, WLL transmitter modules, and 3.5 GHz broadband access equipment requiring stable component supply and legacy RF FET compatibility.
Supply support for MRFG35003NT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of RF power semiconductors for wireless infrastructure, emphasizing high-frequency GaAs and later GaN solutions for cellular and broadband systems.
The MRFG35003NT1 belongs to Freescale's MRFG-series GaAs PHEMT portfolio, engineered specifically for linear, high-efficiency driver amplification in 2–4 GHz wireless infrastructure applications including UMTS, WLL, and BWA.
FAQ
What is the primary RF frequency range supported by the MRFG35003NT1?
The MRFG35003NT1 is specified for operation from 1.8 GHz to 3.6 GHz, with full characterization at 3.55 GHz. Its S-parameters (Table 6) and W-CDMA ACPR data confirm optimal performance in UMTS Band I (2100 MHz), 3.5 GHz WLL, and BWA allocations. Performance remains usable down to 1.8 GHz and up to 4.0 GHz, though gain and efficiency degrade outside the core 3–3.6 GHz band.
Is the MRFG35003NT1 pin-compatible with its replacement part MRFG35003ANT1?
Yes, the MRFG35003ANT1 is a direct replacement for the MRFG35003NT1 with identical pinout, package (Case 466-03, Style 1), thermal characteristics, and electrical specifications. Freescale's documentation explicitly states the replacement relationship and confirms no PCB or schematic changes are needed when migrating to MRFG35003ANT1.
What is the recommended gate bias voltage for Class AB operation of the MRFG35003NT1?
The MRFG35003NT1 is characterized at IDQ = 55 mA and VDS = 12 Vdc, with a typical quiescent gate voltage VGS(Q) of −0.9 V (range: −1.2 V to −0.7 V). Stable Class AB operation requires a precision negative bias supply or resistive divider network capable of delivering this voltage under varying temperature and unit-to-unit VGS(th) spread (−1.2 V to −0.7 V).
Does the MRFG35003NT1 require external matching components, and if so, why?
Yes, the MRFG35003NT1 is an unmatched GaAs PHEMT, meaning its intrinsic input and output impedances are not 50 Ω. External microstrip or lumped-element matching networks (e.g., Z1–Z18 per Figure 1) are required to transform impedances for maximum power transfer, gain flatness, and stability across the operating band - especially critical for linear W-CDMA operation.
What thermal management considerations apply to the MRFG35003NT1 in continuous operation?
The MRFG35003NT1 has RθJC = 18.5 °C/W and a maximum channel temperature of 175 °C (derated to 150 °C for reliability). At 3 W P1dB and 25% efficiency, junction temperature rise is ~139 °C above case - requiring a low-thermal-resistance PCB layout (e.g., large copper pour, thermal vias) and heatsinking to maintain TC ≤ +85 °C and ensure long-term reliability.
MRFG35003NT1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- PLD-1.5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- pHEMT FET
- Configuration:
- -
- Frequency:
- 3.55GHz
- Gain:
- 11.5dB
- Voltage - Test:
- 12 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 55 mA
- Power - Output:
- 3W
- Voltage - Rated:
- 15 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PLD-1.5
MRFG35003NT1 FAQ
1.How can I place an order for MRFG35003NT1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFG35003NT1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFG35003NT1 reliable?
The price and inventory of MRFG35003NT1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFG35003NT1 is usually 5 days.
3.What payment methods are accepted for MRFG35003NT1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFG35003NT1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFG35003NT1?
MRFG35003NT1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFG35003NT1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFG35003NT1?
For technical support, including MRFG35003NT1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFG35003NT1 requirements.
6.How does Aetrix verify that MRFG35003NT1 is sourced from the original manufacturer or authorized distributors?
All MRFG35003NT1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFG35003NT1 meets industry standards.
7.What is the process for return or replacement of MRFG35003NT1?
All MRFG35003NT1 units undergo pre-shipment inspection (PSI). If there is an issue with MRFG35003NT1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFG35003NT1 part is unused and in its original packaging.
Return procedure for MRFG35003NT1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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