NXP Semiconductors MRFG35010
- Part No.:
- MRFG35010
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- NI-360HF
- Datasheet:
-
MRFG35010.pdf
- Description:
- RF MOSFET PHEMT FET 12V NI360
- Quantity:
- Payment:

- Shipping:

Inventory:2,901
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MRFG35010 from NXP Semiconductors (formerly Freescale) is a gallium arsenide pseudomorphic high-electron-mobility transistor (GaAs PHEMT) RF power FET designed for 3.4–3.6 GHz WLL/MMDS and UMTS driver stages in Class A or Class AB linear base station amplifiers. It delivers 10 W P1dB at 3.55 GHz, 10 dB power gain, 30% drain efficiency, and −42 dBc ACPR under W-CDMA conditions.
For engineers reviewing the MRFG35010 datasheet, MRFG35010 pinout, MRFG35010 application, or MRFG35010 equivalent, this device is selected for high-linearity, high-efficiency RF power amplification in 3.5 GHz licensed-band infrastructure-particularly where unmatched broadband operation, phase linearity, and group delay stability are critical to meet spectral mask and EVM requirements.
Technical Context
The MRFG35010 operates as a common-source GaAs PHEMT with fixed gate biasing capability and is optimized for single-supply 12 V operation. Its unmatched design requires external input/output matching networks referenced to 25 Ω, with source and load impedances specified per frequency (e.g., ZS = 4.1 − j15.8 Ω, ZL = 5.7 − j6.8 Ω at 3.55 GHz).
It supports both Class A (IDQ = 1000 mA) and Class AB (IDQ = 180 mA) biasing, delivering distinct S-parameter profiles and thermal performance: RθJC is 5.3 °C/W in Class A and 4.8 °C/W in Class AB, enabling scalable thermal management in compact PA modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| P1dB Output Power | 10 W at 3.55 GHz - enables 1 W average W-CDMA output with headroom for peak-to-average ratio handling |
| Power Gain | 10 dB typical at 3.55 GHz - reduces need for preceding driver stage gain, simplifying multistage PA architecture |
| Drain Efficiency | 30% at 1 W avg. output - lowers thermal load and DC power consumption in continuous-duty base station applications |
| ACPR | −42 dBc (W-CDMA, 5 MHz offset) - meets stringent adjacent channel leakage requirements for 3GPP-compliant transmitters |
| Operating Frequency | 3.4–3.6 GHz - targets licensed bands including 3.5 GHz CBRS and MMDS uplink/downlink allocations |
| VDSS Rating | 15 V - supports safe 12 V DC operation with margin against transient voltage spikes in RF PA rails |
| Thermal Resistance | 4.8 °C/W (Class AB) - allows direct mounting to heatsink with predictable junction temperature rise under 10 W dissipation |
Pinout & Package
MRFG35010 is housed in the NI-360HF metal-ceramic flanged package (Case 360D-02, Style 1), featuring a hermetically sealed lid, gold-plated copper flange for low-thermal-resistance mounting, and three solderable terminals compatible with wave or reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Gate | RF input control terminal | High-impedance Schottky gate requiring DC blocking and stable bias network; sensitive to ESD and overvoltage |
| 2. Drain | RF power output terminal | Carries high RF current and DC supply; must be DC-coupled to VDD and matched to 50 Ω via external network |
| 3. Source | RF/DC reference and return path | Connected directly to ground plane; serves as RF return for gate and drain paths; critical for stability and thermal conduction |
Key Features
| Feature | Design Value |
|---|---|
| GaAs PHEMT technology | Delivers high fT and fmax, enabling stable gain and efficiency above 3.5 GHz without harmonic suppression complexity |
| Unmatched broadband design | Eliminates integrated matching components, allowing custom impedance tuning for specific band, linearity, or efficiency trade-offs |
| Excellent phase linearity & group delay | Enables wideband modulation (e.g., 3.84 MCPS W-CDMA) without significant EVM degradation across 200 MHz bandwidth |
| RoHS-compliant packaging | NI-360HF meets lead-free assembly requirements while maintaining thermal and RF performance integrity |
| High reliability channel temperature rating | 175 °C max channel temperature with derating ensures >1 million hour MTTF in controlled base station thermal environments |
Applications
| Wireless Local Loop (WLL) Base Stations | UMTS Macrocell Driver Amplifiers |
|---|---|
Use Scenario: Fixed wireless access node operating in 3.5 GHz licensed spectrum, transmitting 64-channel W-CDMA signals with 8.5 dB PAR. IC Role / Device Role / Timing Role: Final-stage RF power amplifier FET delivering 1 W average output before antenna feed. Use Value: −42 dBc ACPR and 30% efficiency enable compliant spectral emission and reduced cooling requirements in outdoor cabinet deployments. |
Use Scenario: Driver stage in multi-carrier UMTS macrocell BTS, amplifying signal prior to final GaN PA stage. IC Role / Device Role / Timing Role: Linear Class AB RF power FET providing 10 dB gain and low distortion at 3.55 GHz. Use Value: High gain and phase linearity preserve signal fidelity across multiple carriers, minimizing intermodulation in dense urban RF environments. |
| MMDS Transmitter Modules | Point-to-Multipoint Broadband Access |
Use Scenario: 3.4–3.6 GHz MMDS uplink transmitter in rural broadband infrastructure, requiring stable output over temperature. IC Role / Device Role / Timing Role: Unmatched GaAs PHEMT power amplifier core biased in Class A for maximum linearity. Use Value: 5.3 °C/W thermal resistance and 150 °C max operating channel temperature ensure reliability in uncooled outdoor enclosures. |
Use Scenario: Subscriber unit or base station module in licensed 3.5 GHz point-to-multipoint systems serving enterprise customers. IC Role / Device Role / Timing Role: High-efficiency RF power FET supporting OFDM or SC-FDMA waveforms with dynamic back-off. Use Value: 10 W P1dB headroom accommodates burst-mode operation and maintains ACLR compliance during rapid power ramping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPD1009 | SiC-based GaN HEMT; 28 V operation; higher P1dB (20 W); lower gain (14 dB) | Targets higher-power macrocell final stages; requires redesigned bias and matching networks | Choose QPD1009 when upgrading to GaN for higher efficiency (>50%) and wider bandwidth beyond 3.6 GHz |
| MACOM MRF3001AN | LDMOS; 28 V operation; lower frequency range (1.8–2.2 GHz); higher P1dB (12 W) | Designed for PCS/IMT-2000 bands-not suitable for 3.5 GHz without significant gain roll-off | Select MRF3001AN only for legacy 2 GHz infrastructure reuse; not a drop-in replacement for MRFG35010's 3.4–3.6 GHz band |
Compared with QPD1009 and MRF3001AN, the MRFG35010 offers optimal balance of gain, linearity, and thermal behavior specifically at 3.5 GHz, making it uniquely suited for unmatched WLL/MMDS driver designs where GaAs PHEMT process advantages outweigh GaN's voltage scalability or LDMOS's low-frequency power density.
Availability
MRFG35010 is available at Aetrix Electronics and suitable for wireless local loop (WLL), UMTS driver amplifiers, MMDS transmitters, and point-to-multipoint broadband access systems requiring stable component supply and long-lifecycle support.
Supply support for MRFG35010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale Semiconductor in 2015 and continues to support legacy RF power products with documentation, application engineering, and qualified sources. NXP is a global leader in secure connectivity solutions for automotive, industrial, and communications markets.
The MRFG35010 belongs to NXP's legacy GaAs RF power transistor family, engineered specifically for high-linearity, high-efficiency operation in 3–4 GHz licensed-band infrastructure-emphasizing unmatched flexibility, thermal robustness, and W-CDMA spectral purity.
FAQ
What is the recommended gate bias voltage for MRFG35010 in Class AB operation?
The MRFG35010 exhibits a typical quiescent gate voltage (VGS(Q)) of −0.8 V at VDD = 12 V and IDQ = 180 mA. This value is confirmed in Table 3 of the datasheet and must be set using a stable, low-noise bias network with appropriate decoupling to prevent oscillation. For reliable operation, VGS should remain within −1.0 V to −0.5 V to maintain specified P1dB and ACPR performance in the MRFG35010.
Does MRFG35010 require external matching networks?
Yes, the MRFG35010 is an unmatched RF power FET and requires external input and output matching networks to achieve optimal gain, efficiency, and linearity. The datasheet provides series-equivalent source and load impedances (e.g., ZS = 4.1 − j15.8 Ω, ZL = 5.7 − j6.8 Ω at 3.55 GHz) referenced to 25 Ω, not 50 Ω, meaning matching must be designed accordingly. No internal matching is integrated into the MRFG35010 die or package.
What is the maximum allowable channel temperature for continuous operation of MRFG35010?
The MRFG35010 has a maximum channel temperature (Tch) rating of 175 °C, but Freescale specifies that reliable long-term operation requires keeping the channel temperature below 150 °C. This is enforced via thermal design using the published RθJC values (4.8 °C/W for Class AB) and case temperature monitoring. Exceeding 150 °C risks accelerated degradation and parametric shift in the MRFG35010.
Can MRFG35010 be used in Class A mode, and what are the key trade-offs?
Yes, the MRFG35010 supports Class A operation at IDQ = 1000 mA, as validated by Table 4 S-parameters and thermal data. Trade-offs include higher DC power consumption, lower drain efficiency (~23% vs. 30% in Class AB), and increased thermal load (RθJC = 5.3 °C/W). However, Class A yields superior linearity and broader small-signal bandwidth-making it suitable for ultra-low-distortion applications where the MRFG35010's phase linearity is prioritized over efficiency.
Is MRFG35010 RoHS compliant, and what does that mean for assembly?
Yes, the MRFG35010 is RoHS compliant per the datasheet footnote and Freescale's 2008 product declaration. This means all homogeneous materials contain ≤0.1 wt% lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. For assembly, the NI-360HF package supports lead-free reflow profiles (peak ≤260 °C), and the flange plating is compatible with Pb-free solder pastes-no special handling is required beyond standard GaAs ESD precautions for the MRFG35010.
MRFG35010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- NI-360HF
- Packaging:
- Tube
- Product Status:
- Obsolete
- Technology:
- pHEMT FET
- Configuration:
- -
- Frequency:
- 3.55GHz
- Gain:
- 10dB
- Voltage - Test:
- 12 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 130 mA
- Power - Output:
- 9W
- Voltage - Rated:
- 15 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- NI-360HF
MRFG35010 FAQ
1.How can I place an order for MRFG35010 through Aetrix?
Please submit a Request for Quotation (RFQ) for MRFG35010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MRFG35010 reliable?
The price and inventory of MRFG35010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MRFG35010 is usually 5 days.
3.What payment methods are accepted for MRFG35010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MRFG35010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MRFG35010?
MRFG35010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MRFG35010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MRFG35010?
For technical support, including MRFG35010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MRFG35010 requirements.
6.How does Aetrix verify that MRFG35010 is sourced from the original manufacturer or authorized distributors?
All MRFG35010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MRFG35010 meets industry standards.
7.What is the process for return or replacement of MRFG35010?
All MRFG35010 units undergo pre-shipment inspection (PSI). If there is an issue with MRFG35010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MRFG35010 part is unused and in its original packaging.
Return procedure for MRFG35010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MRFG35010 Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
