NXP Semiconductors MSC7119VM1200

Overview

MSC7119VM1200 from Freescale Semiconductor is a StarCore® SC1400-based DSP SoC integrating a 300 MHz DSP core, 256 KB M1 SRAM, 192 KB M2 SRAM, 8 KB boot ROM, DDR memory controller (150 MHz, 32-bit), dual TDM modules (up to 128 channels), and 10/100 Mbps Ethernet MAC - deployed in carrier-grade VoIP gateways and media processing systems.

For engineers reviewing the MSC7119VM1200 datasheet, MSC7119VM1200 pinout, MSC7119VM1200 application, or MSC7119VM1200 equivalent, key selection criteria include DDR interface timing compliance (SSTL-2), SC1400 core clock stability at 300 MHz, HDI16 host interface glueless compatibility with DSP56300 HI08, and fieldBIST™ structural integrity validation for telecom infrastructure.

Technical Context

The MSC7119VM1200 implements an AHB-Lite crossbar switch with four master and six slave ports, enabling concurrent DMA, Ethernet, TDM, and host interface traffic without arbitration bottlenecks. Its internal PLL generates independent 300 MHz core and 150 MHz peripheral clocks, while the clock synthesis module supports programmable shutdown of DDR, timers, and TDM domains during Stop mode.

It features two independent TDM modules with hardware A-law/μ-law conversion, 8–16-bit word size, and glueless E1/T1/MVIP interface support, plus an IEEE 802.3/802.3u-compliant Ethernet controller with VLAN tagging, CRC generation/verification, and dedicated DMA access to internal SRAM - all managed by a programmable system control unit with bus timeout monitors and address-out-of-range detection.

Key Specifications

Pinout & Package

MSC7119VM1200 is housed in a 400-ball Molded Array Process Ball Grid Array (MAP-BGA) package measuring 17 mm × 17 mm with 0.8 mm ball pitch. The package supports high-density routing for DDR, TDM, and Ethernet signal integrity and includes dedicated VDDC (core), VDDM (memory), VDDIO (I/O), and VDDPLL (PLL) power domains with decoupling requirements specified per JEDEC JESD51-6.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP with integrated DDR and Ethernet applications.

Compared with MSC8122VRAG and LS1023A, the MSC7119VM1200 uniquely combines deterministic DSP execution, integrated DDR interface, dual hardware TDM, and fieldBIST™ in a single MAP-BGA package - making it irreplaceable for cost-sensitive, carrier-grade VoIP media processing where glueless DDR and E1/T1 timing precision are mandatory.

Availability

MSC7119VM1200 is available at Aetrix Electronics and suitable for voice over IP gateways, media processing engines, and carrier-grade session border controllers requiring stable component supply across long-lifecycle telecom deployments.

Supply support for MSC7119VM1200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MSC7119VM1200 belongs to Freescale's StarCore DSP family designed specifically for carrier-class voice and media processing - emphasizing low-latency TDM/Ethernet convergence, on-chip memory bandwidth, and field-proven reliability in 24/7 infrastructure equipment.

FAQ

What is the maximum DDR clock frequency supported by the MSC7119VM1200?

The MSC7119VM1200 supports a maximum DDR clock frequency of 150 MHz, as confirmed in Table 6 ("Maximum Frequencies") of the Rev. 8 datasheet. This enables a peak theoretical DDR data rate of 300 MT/s using double-data-rate signaling. The interface uses SSTL-2 I/O standards and requires precise VREF tracking (±2% noise) relative to VDDM for stable operation - a requirement directly validated in the Electrical Characteristics section.

Does the MSC7119VM1200 include on-chip flash memory for program storage?

No, the MSC7119VM1200 does not include on-chip flash memory. It integrates 8 KB of boot ROM for initial startup code and relies on external non-volatile memory (e.g., SPI Flash or EEPROM accessed via I²C or HDI16) for application firmware storage. The boot ROM supports multiple boot sources including serial interfaces and host-initiated loading, as detailed in Section 3.4 ("Reset and Boot") of the datasheet.

How many independent TDM interfaces does the MSC7119VM1200 provide, and what framing standards are supported?

The MSC7119VM1200 provides two independent TDM modules, each with separate receive and transmit paths. Each module supports E1 (2.048 MHz), T1 (1.544 MHz), MVIP, SCAS, and H.110 framing standards via glueless interface, as stated in the "Two independent TDM modules" bullet on page 2 of the datasheet. Hardware A-law/μ-law conversion and programmable 8- or 16-bit word size are implemented per channel - confirmed in both the overview and functional description sections.

What power supply domains does the MSC7119VM1200 require, and what are their nominal voltages?

The MSC7119VM1200 requires four distinct power supply domains: VDDC (core, 1.2 V ±5%), VDDPLL (PLL, 1.2 V ±5%), VDDM (memory I/O, 2.5 V ±5%), and VDDIO (general I/O, 3.3 V ±5%). These values are specified in Table 3 ("Recommended Operating Conditions") and Table 5 ("DC Electrical Characteristics") of the Rev. 8 datasheet. Separate decoupling and sequencing (e.g., VDDM before VDDC) are mandated in Section 3.2 to prevent latch-up.

Is the MSC7119VM1200 pin-compatible with other members of the MSC71xx family?

No, the MSC7119VM1200 is not pin-compatible with other MSC71xx variants such as MSC7122 or MSC7120. While sharing the same MAP-BGA-400 package footprint, the pin assignments differ significantly - for example, DDR-related signals (DQS, DQM, CK) and TDM I/Os occupy different ball locations across variants, as verified in the "Signal List By Ball Location" (Table 1) and package diagrams (Figures 2–3). Board redesign is required for substitution.