NXP Semiconductors MSC8101M1250F
- Part No.:
- MSC8101M1250F
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 332-BFBGA, FCBGA
- Datasheet:
-
MSC8101M1250F.pdf
- Description:
- DSP 16BIT 250MHZ CPM 332FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,176
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Product details
Overview
MSC8101M1250F from Freescale Semiconductor is a 16-bit networking digital signal processor featuring the SC140 four-ALU core, 512 KB on-chip SRAM, and a 150 MHz communications processor module (CPM) supporting TDM, Ethernet, and ATM interfaces. It delivers 1200 MMACS core + 300 MMACS EFCOP performance at 300 MHz internal clock, with 1.6 V core / 3.3 V I/O supplies, targeting multi-channel packet telephony systems.
For engineers reviewing the MSC8101M1250F datasheet, MSC8101M1250F pinout, MSC8101M1250F application, or MSC8101M1250F equivalent, key selection considerations include its 64-bit 100 MHz system bus, dual-phase PLL architecture (system + CPM DPLLs), HDI16 parallel host interface, and support for up to four E1/T1 or one E3/T3 + one E1/T1 configuration in telecom infrastructure.
Technical Context
The MSC8101M1250F integrates a StarCore SC140 DSP core with four 16-bit ALUs and two 32-bit AGUs, executing up to four MAC operations per cycle. Its CPM implements a 32-bit RISC protocol engine handling ATM AAL0/1/2/5, 10/100 Mbit Ethernet, and HDLC at T3 rates or 256 channels.
The device uses a 0.13 µm copper interconnect process, features separate 1.6 V core and 3.3 V I/O power domains, and includes a programmable memory controller supporting eight external memory banks with UPM-based glueless interfacing to SDRAM, SRAM, Flash, and EPROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | StarCore SC140 with four 16-bit ALUs and two 32-bit AGUs; enables efficient C/C++ compilation and VLES execution model |
| Core Performance | 1200 MMACS at 300 MHz; supports real-time echo cancellation and multi-channel voice processing |
| EFCOP Performance | 300 MMACS at 300 MHz; runs independently for long FIR filters without core intervention |
| On-Chip Memory | 512 KB unified SRAM (256K × 16-bit); eliminates need for external program/data memory in many baseband designs |
| CPM Interfaces | Supports 155 Mbps ATM, 10/100 Mbit Ethernet (MII), and up to four E1/T1 or one E3/T3 + one E1/T1 via FCC/SCC |
| Bus Interface | 64-bit 100 MHz 60x-compatible system bus with burst capability and multi-master arbitration support |
| Power Supply | 1.6 V core / 3.3 V I/O; achieves <0.25 W core power at full speed, enabling dense telecom blade integration |
Pinout & Package
MSC8101M1250F is housed in a 17 mm × 17 mm lidded FC-PBGA package with lead-bearing or lead-free solder spheres. Pinout information is not publicly documented in available Freescale product briefs or reference manuals for this specific variant; official pin assignment requires consultation of the MSC8101 Technical Data document (order number MSC8101/D) and associated IBIS models.
Key Features
| Feature | Design Value |
|---|---|
| Enhanced Filter Coprocessor (EFCOP) | Executes long FIR filters (e.g., acoustic echo cancellation) concurrently with core, at 300 MHz and 300 MMACS |
| Programmable Memory Controller (MEMC) | Supports eight external memory banks with user-programmable machines (UPM) for glueless SDRAM/SRAM/Flash interfacing |
| HDI16 Parallel Host Interface | 16-bit bidirectional interface compatible with microcontroller, microprocessor, and DSP buses for host-side control and data exchange |
| Dual PLL Architecture | Separate system PLL and CPM DPLLs (for SCC/SCM clocks) enable independent frequency scaling and jitter-tolerant timing in TDM networks |
| 16-Channel DMA Controller | FIFO-based with burst capability and sophisticated addressing; offloads data movement from core for high-throughput packet buffering |
Applications
| Third-Generation Wireless Base Stations | Packet Telephony Gateways |
|---|---|
Use Scenario: Baseband processing in WCDMA and CDMA2000 Node B equipment requiring real-time channel coding, modulation, and multi-user interference suppression. IC Role / Device Role / Timing Role: Primary DSP engine executing physical layer algorithms, with CPM managing Iub/Iur interface framing and TDM backhaul. Use Value: 512 KB on-chip SRAM reduces external memory latency; EFCOP accelerates adaptive filtering for uplink beamforming and interference cancellation. | Use Scenario: Media gateway function in VoIP-to-PSTN conversion, handling simultaneous G.711/G.729 calls with transcoding, jitter buffering, and RTP/UDP/IP stack offload. IC Role / Device Role / Timing Role: Central media processor running voice codecs and CPM managing TDM (E1/T1) trunk interfaces and Ethernet packet forwarding. Use Value: 1200 MMACS core + 300 MMACS EFCOP enables >120 concurrent G.729 calls; HDI16 allows seamless integration with ARM-based control plane processors. |
| Multi-Channel xDSL Aggregation | ATM Edge Concentrators |
Use Scenario: DSLAM line card aggregation of 64–128 ADSL2+ lines with dynamic spectrum management, vectoring, and QoS-aware traffic shaping. IC Role / Device Role / Timing Role: Baseband DSP performing DMT symbol processing and CPM handling ATM cell segmentation/reassembly and PVC management. Use Value: 64-bit 100 MHz bus sustains high-bandwidth data transfer between ADC/DAC and memory; programmable MEMC supports large buffer pools for vectoring correlation matrices. | Use Scenario: Edge node aggregating legacy TDM traffic into ATM cells for transport over SONET/SDH backbone, with AAL5 SAR, OAM, and policing functions. IC Role / Device Role / Timing Role: ATM protocol accelerator using CPM's dedicated RISC engine for cell processing while SC140 handles traffic engineering and policing logic. Use Value: CPM delivers 155 Mbps ATM line rate with hardware AAL0/1/2/5 support; dual DPLLs maintain precise timing alignment across multiple TDM inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar networking DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8272 | PowerQUICC II SoC with 266 MHz G2 core, integrated DDR controller, and SEC crypto engine; lacks EFCOP and SC140-specific VLES ISA | Targets secure gateway applications with encryption offload; less optimized for real-time echo cancellation or multi-channel voice codecs | Choose MPC8272 when cryptographic acceleration and DDR support outweigh raw DSP filter throughput requirements |
| MSC8122 | Successor StarCore DSP with dual SC140 cores, 1 MB on-chip RAM, and enhanced CPM supporting Gigabit Ethernet; pinout and software incompatible | Designed for higher-density wireless infrastructure (e.g., LTE eNodeB); requires board redesign and firmware porting | Choose MSC8122 for new designs needing >2× MMACS and Gigabit backhaul, accepting migration effort |
Compared with MPC8272 and MSC8122, the MSC8101M1250F provides optimal balance of deterministic DSP performance, telecom-specific peripherals (TDM/ATM/E1-T1), and low-power 1.6 V core operation-making it uniquely suited for cost-sensitive, high-channel-count packet telephony and wireless baseband platforms where EFCOP-assisted filtering is critical.
Availability
MSC8101M1250F is available at Aetrix Electronics and suitable for third-generation wireless infrastructure, packet telephony gateways, and multi-channel xDSL aggregation requiring stable component supply and long-term lifecycle support.
Supply support for MSC8101M1250F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions, later acquired by NXP Semiconductors in 2015. It specialized in automotive, industrial, and networking silicon.
The MSC8101M1250F belongs to Freescale's StarCore DSP family, engineered specifically for high-channel-count telecommunications infrastructure demanding deterministic real-time signal processing, integrated protocol acceleration, and low-power multi-voltage operation.
FAQ
What is the core clock frequency and power supply configuration of the MSC8101M1250F?
The MSC8101M1250F operates its SC140 core at 300 MHz with a dedicated 1.6 V core supply, while its I/O subsystem runs at 3.3 V. This dual-rail design enables sub-0.25 W core power consumption at full speed, critical for thermal management in densely packed telecom line cards. The MSC8101M1250F's PLL architecture supports stable clock generation across both domains without external synthesizers.
Does the MSC8101M1250F support Ethernet and ATM interfaces simultaneously?
Yes, the MSC8101M1250F CPM integrates independent hardware blocks for 10/100 Mbit Ethernet (MII interface) and 155 Mbps ATM (UTOPIA Level 1), allowing concurrent operation. Its RISC-based protocol engine can manage Ethernet frame forwarding while performing ATM cell segmentation and reassembly, making the MSC8101M1250F suitable for edge concentrators bridging IP and ATM networks.
What memory types does the MSC8101M1250F support via its external memory controller?
The MSC8101M1250F programmable memory controller supports SRAM, DRAM, EPROM, and Flash memory across up to eight banks, using user-programmable machines (UPM) for glueless interfacing. Its dedicated pipelined SDRAM interface enables high-bandwidth access for packet buffering, while the MSC8101M1250F's 512 KB on-chip SRAM reduces dependency on external memory for real-time code and coefficient storage.
Is the MSC8101M1250F pin-compatible with other members of the MSC81xx family?
No, the MSC8101M1250F is not pin-compatible with later variants such as MSC8122 or MSC8202. While sharing the StarCore SC140 core architecture, these devices use different FC-PBGA packages (e.g., 27 mm × 27 mm for MSC8122) and revised signal routing. Migration from MSC8101M1250F requires PCB redesign, though software reuse is possible due to ISA compatibility within the SC140 family.
What debugging interfaces does the MSC8101M1250F provide?
The MSC8101M1250F includes JTAG and an enhanced OnCE (EOnCE™) debug port supporting real-time tracing, breakpoint insertion, and register visibility without halting core execution. This enables non-intrusive development of time-critical DSP algorithms and CPM firmware, and is fully supported by CodeWarrior Development Studio for StarCore DSPs-essential for validating MSC8101M1250F-based telecom protocol stacks.
MSC8101M1250F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 332-BFBGA, FCBGA
- Packaging:
- Box
- Product Status:
- Obsolete
- Type:
- SC140 Core
- Interface:
- Communications Processor Module (CPM)
- Clock Rate:
- 250MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 512kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.60V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 332-FCBGA (17x17)
MSC8101M1250F FAQ
1.How can I place an order for MSC8101M1250F through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8101M1250F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8101M1250F reliable?
The price and inventory of MSC8101M1250F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8101M1250F is usually 5 days.
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MSC8101M1250F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8101M1250F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8101M1250F?
For technical support, including MSC8101M1250F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8101M1250F requirements.
6.How does Aetrix verify that MSC8101M1250F is sourced from the original manufacturer or authorized distributors?
All MSC8101M1250F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8101M1250F meets industry standards.
7.What is the process for return or replacement of MSC8101M1250F?
All MSC8101M1250F units undergo pre-shipment inspection (PSI). If there is an issue with MSC8101M1250F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8101M1250F part is unused and in its original packaging.
Return procedure for MSC8101M1250F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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