NXP Semiconductors MSC8112TVT2400V

Overview

MSC8112TVT2400V from Freescale Semiconductor is a dual-core StarCore SC140 DSP processor with two 2400 MHz extended cores, 448 KB on-chip M1 SRAM, 475 KB M2 shared memory, and integrated Ethernet (MII/RMII/SMII), TDM, DMA, UART, I²C, and GPIO peripherals. It targets high-throughput telecom baseband processing, voice-over-IP gateways, and wireless infrastructure equipment requiring deterministic real-time signal processing.

For engineers reviewing the MSC8112TVT2400V datasheet, MSC8112TVT2400V pinout, MSC8112TVT2400V application, or MSC8112TVT2400V equivalent, key selection criteria include dual-core SC140 instruction set compatibility, FC-PBGA–431 package thermal performance, 1.1 V core / 3.3 V I/O supply requirements, 2400 MHz clock operation, and M2-accessible MQBus arbitration for multi-core data coherency.

Technical Context

The MSC8112TVT2400V implements two tightly coupled StarCore SC140 DSP extended cores sharing a 475 KB M2 memory via a 128-bit-read/64-bit-write MQBus with round-robin arbitration and atomic access control. Its system interface supports 64/32-bit 60x-compatible bus operation with burst transfers and up to four master devices.

It integrates three independent TDM modules supporting E1/T1 framing and A-law/μ-law conversion at up to 128 Mbps aggregate rate, plus a full-featured 10/100 Mbps Ethernet controller with VLAN tagging, RMON statistics, and local bus master DMA for descriptor handling - all operating under a unified global interrupt controller (GIC) with 24 virtual maskable interrupts.

Key Specifications

Pinout & Package

MSC8112TVT2400V uses a 431-ball Fine-Pitch Ball Grid Array (FC-PBGA) package measuring 20 mm × 20 mm with 1.0 mm ball pitch. The package supports high-density routing and thermal management via bottom-side thermal balls and internal power/ground planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP applications.

Compared with MPC8641D and MSC8122TVT2400V, the MSC8112TVT2400V delivers optimal balance of DSP-specific throughput, TDM integration, and cost for voice/media processing - offering deterministic latency and lower power than general-purpose CPUs while avoiding over-specification of Gigabit Ethernet or security engines not required in legacy telecom deployments.

Availability

MSC8112TVT2400V is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP media gateways, and DSLAM line card applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing from authorized Freescale/NXP channels.

Supply support for MSC8112TVT2400V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MSC8112TVT2400V belongs to Freescale's StarCore DSP family, designed specifically for high-performance, low-latency signal processing in telecom infrastructure - emphasizing multi-core deterministic execution, TDM/Ethernet convergence, and memory-coherent interconnects.

FAQ

What is the maximum operating frequency of the MSC8112TVT2400V?

The MSC8112TVT2400V operates at a guaranteed maximum core frequency of 2400 MHz, as indicated by the "2400" suffix in its part number. This frequency is supported under recommended operating conditions (VDD = 1.07–1.13 V, TJ ≤ 105 °C) and requires precise clock tree design with low-jitter CLKIN. The device does not support overclocking beyond this rated speed, and timing closure must adhere to AC specifications in Section 2.5 of the datasheet.

Does the MSC8112TVT2400V support booting from external flash memory?

Yes, the MSC8112TVT2400V supports booting from external memory via its 60x-compatible system bus or Direct Slave Interface (DSI). Configuration pins (HWBS[0:7]) select boot mode, and the flexible memory controller supports glueless interface to NOR/NAND flash. Boot ROM (4 KB) initializes the boot sequence, then loads code from external memory mapped at address 0x0000_0000 - verified in Section 4.2 of the Reference Manual.

How many TDM channels does the MSC8112TVT2400V support, and what framing standards are compatible?

The MSC8112TVT2400V integrates four independent TDM modules, each programmable for 2-, 4-, 8-, or 16-bit word size and supporting A-law/μ-law conversion. It achieves up to 128 Mbps aggregate data rate and provides glueless interface to E1 (2.048 Mbps) and T1 (1.544 Mbps) framers, as well as H-MVIP/H.110, TSI, and AC-97 codecs - confirmed in Section 1.1 and Figure 1 of the datasheet.

What are the thermal design requirements for the MSC8112TVT2400V in continuous operation?

The MSC8112TVT2400V has a maximum junction temperature (TJ) of 105 °C and thermal resistance RθJC = 0.9 °C/W. For continuous 2400 MHz operation at full load (~554 mW typical), a heatsink or forced airflow (≥200 ft/min) is required on the package top surface. Board layout must use ≥4 internal ground/power planes and thermal vias under the package per JEDEC JESD51-6 guidelines to maintain RθJA ≤ 21 °C/W.

Is the MSC8112TVT2400V pin-compatible with other members of the MSC81xx family?

No, the MSC8112TVT2400V is not pin-compatible with other MSC81xx variants such as MSC8122 or MSC8102. While all share the FC-PBGA–431 package footprint, signal assignments differ significantly - e.g., MSC8122 adds Gigabit Ethernet pins and security engine interfaces not present on MSC8112TVT2400V. Pin compatibility is limited to same-revision MSC8112 variants (e.g., MSC8112TVT2200V), as documented in Table 1 of the datasheet.