NXP Semiconductors MSC8122MP8000
- Part No.:
- MSC8122MP8000
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 431-BFBGA, FCBGA
- Datasheet:
-
MSC8122MP8000.pdf
- Description:
- DSP 16BIT 500MHZ MULTI 431FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSC8122MP8000 from Freescale Semiconductor is a quad-core 16-bit digital signal processor integrating four SC140 extended cores, 475 KB shared M2 SRAM, 224 KB per-core M1 SRAM, and hardware-accelerated TDM, Ethernet (MII/RMII/SMII), UART, and multi-channel DMA subsystems. It delivers 8000 MMACS at 500 MHz core frequency and targets wireless transcoding, packet telephony, and high-channel-density base station signal processing.
For engineers reviewing the MSC8122MP8000 datasheet, MSC8122MP8000 pinout, MSC8122MP8000 application, or MSC8122MP8000 equivalent, key selection considerations include its 431-ball FC-PBGA package, 500 MHz core clock with internal PLL, 4× TDM interfaces supporting up to 256 channels, IEEE 802.3-compliant 10/100 Mbps Ethernet MAC, and multi-master 60x-compatible system bus architecture.
Technical Context
The MSC8122MP8000 implements a tightly coupled multi-core architecture where each SC140 core operates at up to 500 MHz with dedicated 224 KB zero-wait-state M1 memory and 16 KB instruction cache. Cores share 475 KB M2 SRAM via the 128-bit read / 64-bit write MQBus with atomic access control and round-robin arbitration.
Its system-level integration includes a flexible eight-bank memory controller supporting SDRAM, Flash, and SRAM; a 16-channel time-multiplexed DMA engine servicing internal FIFOs and external peripherals; and four independent TDM modules with hardware A-law/μ-law conversion, configurable frame sync edge polarity, and up to 62.5 Mbps aggregate throughput per TDM at 500 MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Four SC140 extended 16-bit DSP cores with VLES instruction set and six-instruction-per-cycle execution capability. |
| Performance | 8000 MMACS total at 500 MHz core frequency - enables real-time processing of 256+ voice channels in baseband or transcoding applications. |
| On-Chip Memory | 224 KB M1 SRAM per core (896 KB total) + 475 KB shared M2 SRAM + 4 KB boot ROM - eliminates need for external program memory in many embedded DSP designs. |
| TDM Interfaces | Four independent TDM modules, each supporting up to 256 channels and 62.5 Mbps aggregate rate - directly interfaces with E1/T1 framers and MVIP/SCAS buses without glue logic. |
| Ethernet Interface | IEEE 802.3-compliant MAC with MII/RMII/SMII PHY support, jumbo frame (9.6 kB), VLAN tagging, and RMON statistics - enables integrated packet processing and backhaul in VoIP gateways. |
| System Bus | 64/32-bit 60x-compatible local/system bus with burst transfers, slave access, and up to four master arbitration - allows seamless host-DSP co-processing and external memory expansion. |
| Package | 431-ball FC-PBGA, 20 mm × 20 mm, 0.8 mm pitch, lead-free or lead-bearing - supports high I/O density and thermal performance for telecom line cards. |
Pinout & Package
MSC8122MP8000 is housed in a 431-ball Flip-Chip Plastic Ball-Grid Array (FC-PBGA) package with 0.8 mm pitch and 20 mm × 20 mm footprint. Power domains include 1.1–1.2 V core supply and 3.3 V I/O supply. Pin functions are organized across multiple banks supporting DSI, system bus, TDM, Ethernet, JTAG, GPIO, and clock/reset domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.1–1.2 V supply for SC140 cores and internal logic - requires low-noise regulation due to high-frequency switching current. |
| VDD_IO | I/O power supply | 3.3 V supply for all digital I/O including TDM, Ethernet PHY interface, and system bus - compatible with standard LVTTL signaling. |
| CLKIN | Reference clock input | Differential or single-ended 25–50 MHz crystal or oscillator input feeding internal PLL - determines core/bus clock frequencies via programmable dividers/multipliers. |
| DSI[63:0] | Direct Slave Interface data bus | 32/64-bit synchronous/asynchronous slave port allowing external host CPU direct access to M1/M2 memories and peripherals - enables host-offloaded boot and runtime configuration. |
| TDM_TXD[3:0] | TDM transmit data lines | Four independent serial data outputs for TDM modules - each supports programmable word size (2–16 bit), MSB/LSB-first, and frame sync edge polarity. |
| MII_TXD[3:0] | Ethernet MII transmit data | 4-bit nibble-wide transmit path for 10/100 Mbps MII interface - connects directly to external PHY without level-shifting or timing compensation. |
| JTAG_TCK/TMS/TDI/TDO | IEEE 1149.1 boundary scan interface | Standard test and debug port supporting real-time emulation (EOnCE), core halt/resume, and register/memory access - essential for multi-core DSP development and validation. |
Key Features
| Feature | Design Value |
|---|---|
| Quad SC140 Core Architecture | Four independent 16-bit DSP cores sharing M2 memory via MQBus - enables parallel task partitioning across voice, signaling, and packet processing workloads. |
| Hardware TDM Acceleration | Four TDM modules with on-the-fly A-law/μ-law conversion and 256-channel support - offloads codec processing from CPU cores, reducing software overhead by >40% in VoIP applications. |
| Integrated Ethernet MAC | Full-duplex 10/100 Mbps MAC with VLAN, jumbo frame, and pattern matching - eliminates need for external switch controller in media gateway front-end designs. |
| Multi-Mode Memory Controller | Eight-bank controller supporting SDRAM, Flash, SRAM, and custom peripherals with RMW parity and atomic access - simplifies BOM by removing external memory interface logic. |
| Real-Time Debug Infrastructure | EOnCE with core-level breakpoints, trace buffers, and synchronized multi-core halt - enables deterministic debugging of inter-core communication and timing-critical signal paths. |
Applications
| Wireless Base Station Transcoder | VoIP Media Gateway |
|---|---|
|
Use Scenario: Real-time transcoding between AMR-WB, G.729, and G.711 codecs across 128+ concurrent voice channels in macrocell BTS. IC Role / Device Role / Timing Role: Primary DSP engine executing fixed-point signal processing kernels with deterministic cycle counts per frame; provides TDM-to-packet bridging via integrated Ethernet and DMA. Use Value: Achieves 8000 MMACS at 500 MHz to sustain 20 μs frame processing latency while maintaining <1.5 W core power dissipation - enabling higher channel density per board slot. |
Use Scenario: Session border controller aggregating SIP-based VoIP traffic from PSTN gateways and IP endpoints in enterprise PBX systems. IC Role / Device Role / Timing Role: Central packet processing unit handling RTP payload de-jittering, echo cancellation, and header compression using shared M2 memory and multi-channel DMA. Use Value: Integrated MII/RMII/SMII PHY interface and VLAN-aware MAC reduce external component count by 3 ICs versus discrete MAC+PHY+switch solutions. |
| Packet Telephony Gateway | High-Density TDM Multiplexer |
|
Use Scenario: Carrier-grade T1/E1-to-Ethernet gateway consolidating 32 E1 links (2016 voice channels) into IP backbone with QoS tagging and policing. IC Role / Device Role / Timing Role: Multi-core scheduler distributing TDM ingress/egress, packet assembly/disassembly, and classification across four SC140 cores with synchronized timer interrupts. Use Value: Four independent TDM modules with sliding-window addressing and broadcast CS enable glueless connection to multiple framers - cutting PCB layout complexity by 35%. |
Use Scenario: Telecom central office equipment performing time-slot assignment, CAS/CCS signaling extraction, and HDLC framing across 256 TDM channels. IC Role / Device Role / Timing Role: Hardware-accelerated TDM controller managing frame sync generation, channel buffering, and A-law conversion - relieves CPU cores from bit-level timing-critical tasks. Use Value: On-chip 256-channel TDM buffer with programmable receive/transmit thresholds and watermark interrupts reduces external FIFO requirements by 16 chips per device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156MPA800B | Octa-core StarCore DSP with 10000 MMACS at 500 MHz, 1 MB shared L2 cache, and PCIe interface - no integrated Ethernet MAC or TDM. | Targets higher-throughput packet processing (e.g., LTE layer-1 acceleration) but requires external PHY and TDM framer. | Select when raw computational throughput exceeds 8000 MMACS and PCIe host interface is required over integrated TDM/Ethernet. |
| TI TMS320C6455ZTZ | Single-core C64x+ DSP delivering 8000 MMACS at 1 GHz, 1 MB L2 cache, EMIF, and PCI - lacks multi-core coherence, integrated TDM, or Ethernet MAC. | Suited for monolithic algorithm execution (e.g., radar FFT) but cannot natively distribute TDM channel processing across cores. | Select for legacy C6000 software compatibility or when single-threaded deterministic latency is prioritized over channel scalability. |
Compared with MSC8122MP8000, MSC8156MPA800B offers higher core count and PCIe but removes integrated TDM/Ethernet, increasing BOM cost and design complexity for telecom edge applications; TMS320C6455ZTZ provides identical MMACS rating but lacks hardware TDM acceleration and multi-core memory coherency, limiting scalable voice channel deployment.
Availability
MSC8122MP8000 is available at Aetrix Electronics and suitable for wireless base station transcoders, VoIP media gateways, and packet telephony gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for telecom infrastructure programs.
Supply support for MSC8122MP8000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MSC8122MP8000 belongs to Freescale's StarCore DSP family, engineered specifically for high-channel-density, low-latency signal processing in wireless infrastructure and packet telephony equipment.
FAQ
What is the maximum operating frequency of the MSC8122MP8000?
The MSC8122MP8000 operates at a maximum core frequency of 500 MHz, delivering 8000 MMACS total across its four SC140 cores. This speed is achieved using an internal PLL that generates the core clock from a 25–50 MHz reference input. The 500 MHz rating is validated for the MP8000 speed grade and requires proper thermal management and 1.1–1.2 V core supply regulation. MSC8122MP8000 must be operated within its specified voltage and temperature ranges to maintain timing compliance.
Does the MSC8122MP8000 include integrated Ethernet physical layer support?
No, the MSC8122MP8000 integrates only the Ethernet MAC layer compliant with IEEE 802.3, supporting MII, RMII, and SMII interfaces. It requires an external PHY device for physical layer signaling (e.g., 10/100BASE-TX). The MAC provides full-duplex flow control, VLAN tagging, jumbo frames up to 9.6 kB, and RMON statistics - all accessible via the local bus or DMA. MSC8122MP8000 does not contain analog PHY circuitry or magnetics drivers.
How is memory organized in the MSC8122MP8000?
The MSC8122MP8000 features a hierarchical memory architecture: 224 KB of zero-wait-state M1 SRAM per SC140 core (896 KB total), 475 KB of shared M2 SRAM accessible by all cores via the MQBus, and 4 KB of bootstrap ROM. M1 is core-private with atomic access support; M2 supports coherent multi-core access with round-robin arbitration. External memory is managed through an eight-bank controller supporting SDRAM, Flash, and SRAM. MSC8122MP8000 uses this structure to minimize inter-core contention while maximizing bandwidth for TDM and packet processing.
Can the MSC8122MP8000 be used as a slave device controlled by an external host processor?
Yes, the MSC8122MP8000 includes a 32/64-bit Direct Slave Interface (DSI) that operates exclusively as a slave under external host control. The DSI supports synchronous/asynchronous accesses, burst transfers, byte-enable granularity, sliding window addressing, and chip ID decoding - enabling a host CPU to directly read/write M1/M2 memories and configure peripherals. This mode is commonly used for bootloading, runtime reconfiguration, and host-assisted debugging in systems where MSC8122MP8000 serves as a coprocessor.
What debug capabilities does the MSC8122MP8000 provide for multi-core development?
The MSC8122MP8000 supports IEEE 1149.1 JTAG and enhanced on-chip emulation (EOnCE), enabling real-time, non-intrusive debugging of all four SC140 cores simultaneously. Features include core-halt synchronization, breakpoint/watchpoint triggering across cores, trace buffer capture of instruction streams, and memory/register access during run-time. These capabilities are integral to CodeWarrior IDE toolchain support and allow deterministic validation of inter-core messaging, semaphore usage, and shared-memory race conditions in MSC8122MP8000-based designs.
MSC8122MP8000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 431-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC140 Core
- Interface:
- DSI, Ethernet, RS-232
- Clock Rate:
- 500MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.436MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 431-FCPBGA (20x20)
MSC8122MP8000 FAQ
1.How can I place an order for MSC8122MP8000 through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8122MP8000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8122MP8000 reliable?
The price and inventory of MSC8122MP8000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8122MP8000 is usually 5 days.
3.What payment methods are accepted for MSC8122MP8000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8122MP8000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8122MP8000?
MSC8122MP8000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8122MP8000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8122MP8000?
For technical support, including MSC8122MP8000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8122MP8000 requirements.
6.How does Aetrix verify that MSC8122MP8000 is sourced from the original manufacturer or authorized distributors?
All MSC8122MP8000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8122MP8000 meets industry standards.
7.What is the process for return or replacement of MSC8122MP8000?
All MSC8122MP8000 units undergo pre-shipment inspection (PSI). If there is an issue with MSC8122MP8000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8122MP8000 part is unused and in its original packaging.
Return procedure for MSC8122MP8000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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