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NXP Semiconductors MSC8122TMP6400V
- Part No.:
- MSC8122TMP6400V
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 431-BFBGA, FCBGA
- Datasheet:
-
MSC8122TMP6400V.pdf
- Description:
- DSP 16BIT 400MHZ MULTI 431FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MSC8122TMP6400V from NXP Semiconductors (formerly Freescale) is a quad-core StarCore SC140 DSP processor with 1436 KB on-chip M1 SRAM, 475 KB M2 memory, 4 KB boot ROM, and integrated Ethernet, TDM, DMA, UART, I²C, GPIO, and timer subsystems. It operates at up to 640 MHz core frequency with 1.2 V core supply and supports 3.3 V I/O. It targets high-channel-density voice/data processing in telecom infrastructure equipment.
For engineers reviewing the MSC8122TMP6400V datasheet, MSC8122TMP6400V pinout, MSC8122TMP6400V application, or MSC8122TMP6400V equivalent, key selection criteria include multi-core deterministic real-time signal processing capability, glueless TDM/Ethernet peripheral integration, FC-PBGA-431 package thermal performance, and support for synchronous/asynchronous DSI host interface with 32/64-bit data width and sliding-window addressing.
Technical Context
The MSC8122TMP6400V implements four independent StarCore SC140 DSP extended cores, each with 16-way 16 KB instruction cache, 224 KB private M1 SRAM, programmable interrupt controller (PIC), local interrupt controller (LIC), and low-power Wait/Stop modes. Core clocking is derived from an internal PLL configured at reset via hardware strap signals.
It features a 128-bit-wide MQBus interconnecting all four cores to 475 KB shared M2 memory, supporting atomic access and round-robin arbitration. The system includes a flexible memory controller with three UPMs, GPCM, SDRAM machine, and eight external memory banks - plus a 64-bit system bus and 32/64-bit Direct Slave Interface (DSI) with chip ID decoding and broadcast write capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Four StarCore SC140 DSP extended cores, each with 224 KB M1 SRAM (1436 KB total), 16-way 16 KB ICache, and 4-entry write buffer. |
| Memory Subsystem | 475 KB M2 RAM accessible via 128-bit MQBus; 4 KB boot ROM; flexible memory controller supporting SDRAM, SRAM, Flash, and IPBus peripherals. |
| Maximum Core Frequency | 640 MHz - confirmed by TMP6400V suffix per Freescale ordering guide; requires 1.16–1.24 V VDD at extended temperature range. |
| Interface Support | 60x-compatible 64/32-bit system bus; 32/64-bit DSI with sliding window mode and chip ID decoding; MII/RMII/SMII Ethernet; four TDM modules (128 Mbps aggregate). |
| Power & Thermal | 1.2 V core supply (1.16–1.24 V @ 640 MHz); 3.3 V I/O (3.135–3.465 V); junction-to-case thermal resistance 0.9 °C/W; FC-PBGA-431, 20 mm × 20 mm. |
| Peripherals | 16-channel DMA controller; UART (6.25 Mbps); I²C boot interface; 32 GPIO; two 16-timer modules; eight hardware semaphores; global interrupt controller (GIC) with 32 virtual maskable interrupts. |
Pinout & Package
MSC8122TMP6400V is housed in a 431-ball Fine-Pitch Ball Grid Array (FC-PBGA) package measuring 20 mm × 20 mm with 1.0 mm ball pitch. The package supports high-density routing and thermal dissipation via bottom-side thermal pad and exposed die attach area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (multiple balls) | Core & PLL power supply | 1.2 V nominal supply for SC140 cores and internal PLL; must be decoupled per Figure 33; voltage tolerance ±0.06 V at 640 MHz operation. |
| VDDH (multiple balls) | I/O power supply | 3.3 V supply for all digital I/O including DSI, system bus, TDM, Ethernet, GPIO; specified 3.135–3.465 V; supports 3.3 V LVTTL/LVCMOS levels. |
| CLKIN / CLKOUT | Reference clock input / buffered output | Accepts external crystal or clock source (up to 100 MHz); CLKOUT provides feedback for PLL lock verification and system synchronization. |
| HA[31:0], HD[63:0] | System address/data bus | 64-bit multiplexed address/data bus (HA = high address, HD = data); supports burst transfers, multi-master arbitration, and glueless memory interfacing. |
| DSI[63:0], DSI_SYNC | Direct Slave Interface signals | 32/64-bit slave port enabling external host direct access to internal M1/M2 memories and peripherals; DSISYNC enables synchronous DSI timing mode. |
| TDMxTDAT/TDMxRDAT | TDM channel data I/O | Four independent TDM ports with programmable word size (2/4/8/16-bit); support A-law/μ-law conversion; interface directly to E1/T1 framers and AC-97 codecs. |
Key Features
| Feature | Design Value |
|---|---|
| Quad SC140 DSP cores with shared M2 memory | Enables parallel real-time voice/data channel processing across 4 independent execution units while maintaining coherent data access via atomic MQBus operations. |
| Glueless TDM interface with hardware A-law/μ-law | Eliminates external codec translation logic; supports up to 128 Mbps aggregate TDM bandwidth across four channels for VoIP gateways and media gateways. |
| Multi-mode DSI with chip ID decoding & broadcast | Allows single host to manage multiple MSC8122 devices using one chip select line and simultaneous register writes - critical for DSP farm scalability. |
| Integrated 10/100 Mbps Ethernet MAC with RMON | Provides full-duplex MII/RMII/SMII connectivity with VLAN tagging, jumbo frame support, CRC offload, and descriptor-based DMA - reduces host CPU overhead in packet-processing systems. |
| Flexible memory controller with 8 banks & UPM support | Enables direct connection to diverse memory types (SDRAM, SRAM, Flash, PROM) without glue logic; UPM programming allows custom timing for legacy or non-standard devices. |
Applications
| Voice over IP Gateway | Media Gateway Controller |
|---|---|
|
Use Scenario: Aggregating and transcoding hundreds of concurrent VoIP calls between PSTN and SIP networks. IC Role / Device Role / Timing Role: Primary signal processing engine executing echo cancellation, jitter buffering, packetization, and codec conversion across four SC140 cores. Use Value: 640 MHz sustained core throughput and 1436 KB on-chip M1 SRAM enable real-time processing of >256 G.711 channels without external memory latency penalties. |
Use Scenario: Centralized media resource function (MRF) in IMS networks handling conferencing, IVR, and tone generation. IC Role / Device Role / Timing Role: Multi-core DSP platform managing time-critical TDM-to-packet bridging, DTMF detection, and audio mixing with sub-100 µs interrupt latency. Use Value: Four independent TDM modules with hardware A-law/μ-law conversion eliminate need for external codec ICs, reducing BOM cost and board space. |
| Wireless Base Station Controller | Industrial Protocol Gateway |
|
Use Scenario: Processing baseband signals and protocol stacks in small-cell LTE/5G NR remote radio units (RRUs). IC Role / Device Role / Timing Role: Real-time DSP coprocessor handling channel estimation, FFT, filtering, and Layer 1 PHY acceleration alongside ARM host. Use Value: 64-bit system bus and DSI interface allow tight coupling with host processor for low-latency control-plane/data-plane handoff in split-architecture deployments. |
Use Scenario: Bridging legacy fieldbus protocols (e.g., PROFIBUS, Modbus) to Ethernet/IP or MQTT in industrial edge controllers. IC Role / Device Role / Timing Role: Deterministic protocol stack accelerator with UART, I²C, GPIO, and Ethernet MAC - offloading real-time messaging from main MCU. Use Value: Integrated UART (6.25 Mbps) and I²C boot interface simplify firmware updates and sensor/actuator communication without external level shifters or bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156AMP1000B | Higher-performance StarCore SC3850 core (1 GHz), 2 MB L2 cache, 10 Gbps RapidIO, but larger 27 mm × 27 mm PBGA-676 package. | Targeted at macro base stations and high-end media servers requiring >2× compute density and serial interconnect. | Select when >1 GHz sustained throughput, cache-coherent multi-core, or RapidIO backplane is required - not drop-in compatible due to pinout and power delivery differences. |
| TMS320C6678ACYPA | OCTET-core C66x VLIW DSP (1.25 GHz/core), 4 MB L2, 2x SRIO, 2x PCIe; 3.3 V I/O but 1.0 V core; different memory map and interrupt architecture. | Optimized for radar, imaging, and software-defined radio where VLIW parallelism outperforms scalar DSP in FFT/filter-heavy workloads. | Choose for floating-point-intensive algorithms or when TI ecosystem toolchain (Code Generation Tools, SYS/BIOS) is mandated - requires full hardware and software redesign. |
Compared with MSC8122TMP6400V, the MSC8156 offers higher peak throughput but demands more PCB area and power delivery complexity, while the TMS320C6678 delivers superior floating-point performance at the cost of deterministic fixed-point latency and architectural divergence from StarCore toolchains.
Availability
MSC8122TMP6400V is available at Aetrix Electronics and suitable for voice gateway, media server, and wireless infrastructure applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and telecom OEMs.
Supply support for MSC8122TMP6400V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MSC8122 belongs to NXP's StarCore DSP family designed specifically for carrier-grade voice and multimedia processing in telecom infrastructure - emphasizing deterministic real-time performance, multi-channel TDM integration, and low-latency host interfacing.
FAQ
What is the maximum operating frequency supported by the MSC8122TMP6400V?
The MSC8122TMP6400V is rated for operation up to 640 MHz, as indicated by the "TMP6400V" suffix in the part number per Freescale's MSC8122 ordering information. This frequency requires VDD between 1.16 V and 1.24 V and junction temperature maintained within –40°C to +105°C. At this speed, the device delivers sustained 640 MIPS per core with full cache and memory subsystem utilization.
Does the MSC8122TMP6400V support booting from external memory?
Yes, the MSC8122TMP6400V supports multiple boot sources including external memory (via system bus or DSI), external host (through DSI), UART, TDM, and I²C EEPROM. Boot mode is selected at reset using hardware strapping pins (HWBS[7:0]), and the 4 KB on-chip boot ROM contains initialization code that loads the application image based on the configured boot path.
How many TDM channels does the MSC8122TMP6400V support, and what data rates are achievable?
The MSC8122TMP6400V integrates four independent TDM modules, each configurable for 2-, 4-, 8-, or 16-bit word size and supporting hardware A-law/μ-law companding. Aggregate data rate across all channels reaches 128 Mbps, enabling direct glueless interface to E1 (2.048 Mbps) and T1 (1.544 Mbps) framers, H-MVIP/H.110 devices, and AC-97 audio codecs.
What package type and thermal characteristics apply to the MSC8122TMP6400V?
The MSC8122TMP6400V uses a 431-ball FC-PBGA package measuring 20 mm × 20 mm with 1.0 mm ball pitch. Its thermal resistance is characterized as RθJC = 0.9 °C/W (junction-to-case) and RθJA = 21 °C/W (junction-to-ambient) under 200 ft/min airflow, enabling reliable operation at 640 MHz in telecom chassis with forced convection cooling.
Is the MSC8122TMP6400V pin-compatible with other members of the MSC81xx family?
No, the MSC8122TMP6400V is not pin-compatible with other MSC81xx variants such as MSC8156 or MSC8126. While sharing the StarCore architecture and functional blocks, each device has distinct pin assignments, power domain partitioning, and ball-out mapping - confirmed by separate FC-PBGA-431 layouts in their respective datasheets and incompatible power sequencing requirements.
MSC8122TMP6400V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 431-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- SC140 Core
- Interface:
- DSI, Ethernet, RS-232
- Clock Rate:
- 400MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.436MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 431-FCPBGA (20x20)
MSC8122TMP6400V FAQ
1.How can I place an order for MSC8122TMP6400V through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8122TMP6400V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8122TMP6400V reliable?
The price and inventory of MSC8122TMP6400V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8122TMP6400V is usually 5 days.
3.What payment methods are accepted for MSC8122TMP6400V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8122TMP6400V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8122TMP6400V?
MSC8122TMP6400V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8122TMP6400V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8122TMP6400V?
For technical support, including MSC8122TMP6400V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8122TMP6400V requirements.
6.How does Aetrix verify that MSC8122TMP6400V is sourced from the original manufacturer or authorized distributors?
All MSC8122TMP6400V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8122TMP6400V meets industry standards.
7.What is the process for return or replacement of MSC8122TMP6400V?
All MSC8122TMP6400V units undergo pre-shipment inspection (PSI). If there is an issue with MSC8122TMP6400V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8122TMP6400V part is unused and in its original packaging.
Return procedure for MSC8122TMP6400V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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