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NXP Semiconductors MSC8122TVT6400V
- Part No.:
- MSC8122TVT6400V
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 431-BFBGA, FCBGA
- Datasheet:
-
MSC8122TVT6400V.pdf
- Description:
- IC DSP QUAD 16B 400MHZ 431FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,411
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Product details
Overview
MSC8122TVT6400V from NXP Semiconductors (formerly Freescale) is a quad-core StarCore SC140 DSP processor with 1436 KB on-chip M1 SRAM, 475 KB M2 memory, integrated Ethernet MAC (10/100 Mbps), four TDM interfaces, and a 64-bit system bus. It operates at up to 640 MHz core frequency and targets baseband processing in wireless infrastructure equipment.
For engineers reviewing the MSC8122TVT6400V datasheet, MSC8122TVT6400V pinout, MSC8122TVT6400V application, or MSC8122TVT6400V equivalent, key selection criteria include multi-core deterministic real-time signal processing capability, glueless interface support for SDRAM and E1/T1 framers, DSI slave host access, and thermal performance under sustained 400–640 MHz operation in FC-PBGA-431 packages.
Technical Context
The MSC8122TVT6400V integrates four independent StarCore SC140 DSP extended cores, each with 224 KB dedicated M1 SRAM, 16-way 16 KB instruction cache, and low-power Wait/Stop modes. Its MQBus interconnect operates at core frequency with 128-bit read/64-bit write bandwidth and atomic M2 memory access arbitration across all four cores.
It features a flexible 60x-compatible system bus (32/64-bit data, 32-bit address), Direct Slave Interface (DSI) supporting synchronous/asynchronous 32/64-bit transfers with sliding window addressing, and a memory controller with three UPMs, GPCM, and page-mode SDRAM support across eight external memory banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Four StarCore SC140 DSP extended cores, each with 224 KB M1 SRAM (1436 KB total) |
| Memory | 475 KB M2 RAM for critical data buffering; 4 KB boot ROM |
| System Bus | 60x-compatible, 32/64-bit data width, 32-bit address, multi-master capable with burst transfers |
| DSI Interface | 32/64-bit slave host interface with 21–25 bit addressing, sliding window mode, chip ID decoding |
| Ethernet | 10/100 Mbps MII/RMII/SMII MAC with full/half-duplex, VLAN tagging, RMON statistics, and local bus DMA |
| TDM Modules | Four independent TDM controllers, programmable word size (2–16 bit), A-law/μ-law conversion, up to 128 Mbps aggregate rate |
| Operating Frequency | Up to 640 MHz core clock (confirmed by part suffix '6400V') |
| Package | FC-PBGA-431, 20 mm × 20 mm, 1.27 mm ball pitch |
Pinout & Package
MSC8122TVT6400V uses a 431-ball Fine-Pitch Ball Grid Array (FC-PBGA) package measuring 20 mm × 20 mm with 1.27 mm ball pitch. The package supports high-density routing and thermal dissipation via bottom-side thermal balls and internal power/ground planes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VDDH | Core & I/O supply rails | Dual-rail operation: VDD = 1.14–1.26 V (core/PLL), VDDH = 3.135–3.465 V (I/O); decoupling required per JEDEC guidelines |
| CLKIN / CLKOUT | External clock input / buffered output | Accepts 1–100 MHz differential or single-ended clock; CLKOUT provides feedback for PLL lock verification |
| HA[31:0] / HD[63:0] | Address & data bus signals | 32-bit multiplexed address/data bus (HA/HD) supporting 64-bit wide transfers via time-multiplexing and byte enables |
| DSI[63:0] / DSISYNC | Direct Slave Interface data & sync | Configurable 32/64-bit DSI port enabling external host direct access to internal M1/M2 memories without CPU intervention |
| ETHRX_CLK / ETHTX_CLK | Ethernet PHY clock interface | Provides 25/2.5 MHz clocks for MII/RMII; supports SMII with shared clock domain and reduced pin count |
| TDMxTSYN / TDMxRCLK | TDM frame sync & receive clock | Four independent TDM ports with hardware-based A-law/μ-law conversion; supports E1/T1 framer glueless interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Quad-core deterministic execution | Four independent SC140 cores with local interrupt controllers (LIC), programmable interrupt controller (PIC), and global interrupt controller (GIC) enable synchronized real-time signal processing across multiple radio channels |
| Multi-level memory hierarchy | 1436 KB on-chip M1 SRAM + 475 KB M2 RAM + external SDRAM support via flexible memory controller ensures low-latency access for FFT, filtering, and channelization tasks |
| Glueless peripheral integration | Integrated Ethernet MAC, UART, I²C, GPIO, timers, and TDM modules eliminate external logic, reducing BOM cost and PCB area in wireless baseband designs |
| Power-aware architecture | Wait and Stop low-power modes, dynamic voltage scaling support, and per-core clock gating reduce active power consumption during idle or partial-load operation |
| Scalable interconnect | MQBus with round-robin arbitration and atomic M2 access enables coherent multi-core data sharing without software locks or cache coherency overhead |
Applications
| Wireless Base Station Transceiver | VoIP Media Gateway |
|---|---|
Use Scenario: Real-time processing of 64+ simultaneous CDMA/WCDMA/LTE uplink/downlink channels in macrocell BTS. IC Role / Device Role / Timing Role: Primary baseband processor executing channel coding, modulation, equalization, and RF interface timing control. Use Value: Quad-core parallelism delivers deterministic sub-100 µs latency for symbol-level processing; integrated TDM and Ethernet enable backhaul and fronthaul connectivity. | Use Scenario: Converting PSTN voice streams to IP packets across 256 concurrent VoIP sessions in carrier-grade media gateways. IC Role / Device Role / Timing Role: Central DSP engine performing echo cancellation, transcoding (G.711/G.729), jitter buffering, and packet assembly with precise RTP timestamping. Use Value: Hardware A-law/μ-law conversion and 128 Mbps TDM throughput eliminate external codec ICs; DSI allows host CPU to manage session state while MSC8122 handles real-time audio path. |
| Small Cell Radio Unit | Industrial Wireless Sensor Hub |
Use Scenario: Compact LTE/5G NR pico/femtocell unit requiring integrated PHY layer processing and L1/L2 stack acceleration. IC Role / Device Role / Timing Role: Baseband SoC handling OFDM modulation/demodulation, MIMO processing, and MAC layer scheduling in real time. Use Value: 640 MHz operation and 1436 KB on-chip SRAM sustain >200 Mbps throughput; FC-PBGA-431 package meets space-constrained thermal requirements. | Use Scenario: Aggregating and preprocessing time-synchronized sensor data (vibration, temperature, acoustic) from 32+ industrial nodes before forwarding via Ethernet. IC Role / Device Role / Timing Role: Deterministic edge-processing node performing FFT, spectral analysis, anomaly detection, and timestamped packet generation. Use Value: Four TDM ports interface directly to sensor ADCs/DACs; Ethernet MAC with VLAN tagging enables secure, prioritized data transport in factory networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156TVT1000V | Higher-performance StarCore SC3850 core (1 GHz), 2 MB L2 cache, enhanced security engine, but larger 27 mm × 27 mm PBGA-676 package | Targets next-gen massive MIMO and millimeter-wave base stations requiring higher compute density and cryptographic acceleration | Select when >1 GHz sustained throughput and hardware AES/SHA are required; verify PCB redesign for larger footprint and thermal management |
| TMS320C6455ZTZ | Single-core C64x+ DSP (1.2 GHz), 1 MB L2 cache, no integrated Ethernet MAC or TDM, requires external PHY and framer ICs | Suitable for non-telecom DSP tasks like imaging or radar where multi-channel TDM/Ethernet integration is unnecessary | Choose for cost-sensitive, single-threaded applications where external interface components are acceptable; not drop-in compatible due to different bus architecture and pinout |
Compared with MSC8122TVT6400V, the MSC8156TVT1000V offers higher clock speed and security features but demands more board space and power, while the TMS320C6455ZTZ provides raw single-core performance at lower system integration-neither matches the MSC8122TVT6400V's balanced combination of quad-core determinism, integrated telecom peripherals, and compact FC-PBGA packaging.
Availability
MSC8122TVT6400V is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP gateway, and industrial sensor hub applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for MSC8122TVT6400V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and communications markets.
The MSC8122TVT6400V belongs to NXP's StarCore DSP family, designed specifically for high-throughput, low-latency baseband processing in wireless infrastructure equipment including macrocells, small cells, and media gateways.
FAQ
What is the maximum operating frequency supported by the MSC8122TVT6400V?
The MSC8122TVT6400V is rated for operation up to 640 MHz, as indicated by the '6400' suffix in its part number. This frequency applies to each of the four StarCore SC140 DSP cores under recommended operating conditions (VDD = 1.16–1.24 V, TJ ≤ 90°C). Performance validation is based on Freescale's Rev. 16 datasheet and confirmed through AC timing specifications for core-internal paths and MQBus arbitration.
Does the MSC8122TVT6400V include an integrated Ethernet MAC?
Yes, the MSC8122TVT6400V integrates a full-featured 10/100 Mbps Ethernet MAC supporting MII, RMII, and SMII physical layer interfaces. It includes CRC generation/verification, VLAN tag insertion, jumbo frame support, RMON statistics, and local bus master DMA for descriptor and buffer access-enabling direct connection to PHY devices without external MAC logic.
How many TDM interfaces does the MSC8122TVT6400V provide, and what are their capabilities?
The MSC8122TVT6400V provides four independent TDM modules, each supporting programmable word sizes (2, 4, 8, or 16 bits), hardware A-law/μ-law companding, and aggregate data rates up to 128 Mbps. These interfaces offer glueless connectivity to E1/T1 framers and H-MVIP/H.110 devices, making them suitable for telephony and wireless baseband timing-critical applications.
What package type and dimensions does the MSC8122TVT6400V use?
The MSC8122TVT6400V uses a 431-ball Fine-Pitch Ball Grid Array (FC-PBGA) package measuring 20 mm × 20 mm with 1.27 mm ball pitch. Mechanical drawings and thermal characteristics for this package are documented in Section 5 of the Freescale MSC8122 Rev. 16 datasheet, including RθJA = 26°C/W (natural convection) and RθJC = 0.9°C/W.
Can the MSC8122TVT6400V operate in low-power modes, and which ones are supported?
Yes, the MSC8122TVT6400V supports two low-power processing modes: Wait mode (IDDW ≈ 3753 mA typical) and Stop mode (IDDS ≈ 2903 mA typical), both defined in the DC Electrical Characteristics section of the datasheet. These modes disable core clocks while preserving register and memory contents, enabling rapid wake-up for event-driven processing in energy-constrained infrastructure deployments.
MSC8122TVT6400V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 431-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- SC140 Core
- Interface:
- DSI, Ethernet, RS-232
- Clock Rate:
- 400MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1.436MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 431-FCPBGA (20x20)
MSC8122TVT6400V FAQ
1.How can I place an order for MSC8122TVT6400V through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8122TVT6400V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8122TVT6400V reliable?
The price and inventory of MSC8122TVT6400V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8122TVT6400V is usually 5 days.
3.What payment methods are accepted for MSC8122TVT6400V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8122TVT6400V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8122TVT6400V?
MSC8122TVT6400V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8122TVT6400V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8122TVT6400V?
For technical support, including MSC8122TVT6400V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8122TVT6400V requirements.
6.How does Aetrix verify that MSC8122TVT6400V is sourced from the original manufacturer or authorized distributors?
All MSC8122TVT6400V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8122TVT6400V meets industry standards.
7.What is the process for return or replacement of MSC8122TVT6400V?
All MSC8122TVT6400V units undergo pre-shipment inspection (PSI). If there is an issue with MSC8122TVT6400V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8122TVT6400V part is unused and in its original packaging.
Return procedure for MSC8122TVT6400V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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