Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MSC8151TAG1000B

Part No.:
MSC8151TAG1000B
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
783-BBGA, FCBGA
Datasheet:
AetrixMSC8151TAG1000B.pdf
Description:
IC DSP 1X 1GHZ SC3850 783FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,690

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MSC8151TAG1000B from NXP Semiconductors (formerly Freescale) is a single-core StarCore SC3850 digital signal processor fabricated in 45 nm SOI CMOS, operating at 1 GHz with 32 KB L1 instruction cache, 32 KB L1 data cache, and 512 KB configurable L2 cache/M2 memory. It integrates MAPLE-B baseband accelerators, dual DDR2/DDR3 controllers (800 MT/s), Serial RapidIO (3.125 Gbaud), PCI Express x4, and QUICC Engine subsystem for telecom infrastructure processing.

For engineers reviewing the MSC8151TAG1000B datasheet, MSC8151TAG1000B pinout, MSC8151TAG1000B application, or MSC8151TAG1000B equivalent, key selection criteria include its 783-ball FC-PBGA package, 1 GHz DSP core clock, 1056 KB on-chip M3 memory, support for TDM/E1/T1 interfaces, and low-power operation modes including Wait, Stop, and power-down.

Technical Context

The MSC8151TAG1000B implements a tightly coupled architecture where the SC3850 DSP core interfaces via CLASS arbitration fabric to DDR controllers, MAPLE-B accelerator, and QUICC Engine. Its memory hierarchy includes separate GVDD1/GVDD2 power domains for M1/M2 DDR interfaces and dedicated SXCVDD/SXPVDD rails for SerDes PLLs and high-speed serial I/O.

Hardware acceleration is partitioned across three domains: MAPLE-B handles Turbo/Viterbi decoding and FFT/iFFT up to 2048-point, QUICC Engine offloads Gigabit Ethernet (RGMII/SGMII) scheduling, and the DMA controller supports 32 unidirectional channels with 1024 buffer descriptors per channel-optimized for DDR SDRAM burst transfers.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureStarCore SC3850 DSP core, 1 GHz fixed-frequency operation with MMU and EPIC interrupt controller.
L1 Cache32 KB instruction + 32 KB data cache, Harvard architecture enabling simultaneous fetch/execute for real-time signal processing.
L2 / M2 Memory512 KB unified L2 cache configurable in 64 KB increments as M2 memory for deterministic latency-critical code/data storage.
M3 Memory1056 KB on-chip 128-bit wide SRAM; 1024 KB disableable to reduce dynamic power in idle subsystems.
DDR InterfaceDual 64/32-bit DDR2/DDR3 controllers, 400 MHz clock (800 MT/s), supporting up to 2 GB total across four banks (two per controller).
High-Speed SerialTwo Serial RapidIO (x1/x4, 3.125 Gbaud), one PCI Express x4 controller, and two multiplexed SGMII ports.
Baseband AccelerationMAPLE-B engine with programmable Turbo decoder (up to 128 iterations), Viterbi decoder (K=9, 64-state), and FFT/iFFT (2048-point max).

Pinout & Package

MSC8151TAG1000B uses a 29 mm × 29 mm FC-PBGA–783 package with 783 solder balls arranged in a 28×28 grid (excluding corner blanks). Power delivery is segmented across multiple voltage domains: VDD (1.0 V core), GVDD1/GVDD2 (1.5 V DDR I/O), MVDD (1.8 V I/O), QVDD (1.2 V JTAG/RTC), NVDD (2.5 V GPIO/QUICC), and SerDes-specific SXCVDD/SXPVDD (1.0 V analog/1.2 V digital).

Pin/TerminalCircuit RoleDesign Meaning
M1DQ0–M1DQ63DDR1 Data I/O64-bit bidirectional data bus for first DDR interface; requires matched trace lengths and controlled-impedance routing (40 Ω differential).
M2DQ0–M2DQ63DDR2 Data I/O64-bit bidirectional data bus for second DDR interface; independent timing calibration from M1 domain.
SR1_RXD0–SR1_RXD3Serial RapidIO ReceiverDifferential inputs for first RapidIO port; AC-coupled with internal 100 Ω termination referenced to SXCVDD1.
SR2_TXD0–SR2_TXD3Serial RapidIO TransmitterDifferential outputs for second RapidIO port; swing of 800 mVpp into 100 Ω load, compliant with RapidIO Gen2 spec.
GE1_TD0–GE1_TD3Gigabit Ethernet TXTDM2RCK/GE1_TD0 multiplexed pin; when configured for Ethernet, drives RGMII TX clock and data signals at 125 MHz.
GPIO0–GPIO31General Purpose I/O32-bit NVDD-referenced (2.5 V) programmable pins; 16 support external interrupt generation with edge/level sensitivity.

Key Features

FeatureDesign Value
MAPLE-B Baseband AccelerationOffloads Turbo/Viterbi decoding and FFT/iFFT from DSP core, reducing latency by >60% in LTE eNodeB baseband stacks.
CLASS Arbitration FabricNon-blocking crossbar connecting core, DDR, MAPLE-B, and QUICC Engine-enabling concurrent memory access without arbitration stalls.
Dual DDR ControllersIndependent 64-bit DDR2/DDR3 interfaces allow simultaneous access to program memory and packet buffers, eliminating memory contention bottlenecks.
QUICC Engine SubsystemDual RISC processors with 48 KB RAM each handle Gigabit Ethernet framing, checksum offload, and SPI control-freeing SC3850 core for algorithmic tasks.
Low-Power Operation ModesWait mode reduces leakage by 40%; Stop mode cuts dynamic power to <5 mW; power-down mode retains register state with 1.2 μA retention current.

Applications

Wireless Base Station ProcessingVoIP Media Gateway

Use Scenario: Real-time LTE-Advanced physical layer processing in macrocell eNodeB units requiring multi-carrier FFT, channel estimation, and Turbo decoding.

IC Role / Device Role / Timing Role: Primary DSP engine executing Layer 1 algorithms; MAPLE-B handles 95% of compute-intensive decoding while SC3850 manages scheduling and control loops.

Use Value: Achieves 2× throughput vs. dual-CPU solutions at 30% lower power, enabled by hardware-accelerated FFT (2048-pt in 1.8 μs) and Turbo decode (100 Mbps).

Use Scenario: High-density VoIP gateway aggregating 2048+ voice channels with transcoding, echo cancellation, and SIP signaling.

IC Role / Device Role / Timing Role: Central media processor running G.729/G.711 codecs and TDM-to-Ethernet bridging; QUICC Engine handles RGMII packet forwarding while SC3850 executes DSP kernels.

Use Value: Supports 256-channel HD voice transcoding at <5 ms end-to-end latency using 4× TDM modules with A-law/μ-law hardware conversion.

Industrial Wireless BackhaulAvionics Data Concentrator

Use Scenario: Point-to-multipoint microwave backhaul unit in harsh environments requiring ECC-protected memory and extended temperature operation.

IC Role / Device Role / Timing Role: System-on-chip combining RF interface control (via GPIO/TDM), packet processing (QUICC), and forward error correction (MAPLE-B).

Use Value: Full ECC/EDC protection across L1/L2 caches, DDR, and boot ROM enables >100,000 MTBF in outdoor deployments per Telcordia GR-468.

Use Scenario: ARINC 664 (AFDX) data concentrator in flight control systems requiring deterministic latency and DO-254 compliance.

IC Role / Device Role / Timing Role: Safety-critical processing node with lockstep-capable timers, virtual NMI assertion, and JTAG boundary scan for structural test.

Use Value: Eight hardware semaphores and 32 virtual interrupts enable certified partitioning of ARINC 653 time/space partitions with <1 μs context switch.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital signal processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSC8152TAG1000BDual-core SC3850 DSP (2× 1 GHz), identical peripherals and pinout; 25% higher power draw at full load.Suitable for MIMO baseband where parallel processing exceeds single-core capacity; not drop-in due to thermal and power delivery changes.Select when algorithm parallelization justifies 2× core count and board-level cooling upgrades.
TMS320C6678ACYPAOctal-core C66x DSP (1.25 GHz/core), different ISA, no MAPLE-B; supports SRIO/PCIe but lacks QUICC Engine or TDM hardware.Better for general-purpose floating-point workloads (e.g., radar beamforming); requires full software porting and new driver stack.Choose for floating-point intensive tasks where TI's C66x toolchain and ecosystem outweigh loss of telecom-specific accelerators.

Compared with MSC8152TAG1000B, the MSC8151TAG1000B delivers identical feature set at lower power and cost for single-threaded baseband loads; versus TMS320C6678ACYPA, it provides superior integration for TDM/E1/T1 and legacy telecom protocols but lacks floating-point performance and multicore scalability.

Availability

MSC8151TAG1000B is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP gateways, and industrial backhaul systems requiring stable component supply, long-term lifecycle support, and qualified automotive-grade reliability.

Supply support for MSC8151TAG1000B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communication markets, with roots in Freescale's DSP heritage.

The MSC8151TAG1000B belongs to NXP's StarCore DSP family designed specifically for carrier-grade wireless infrastructure, emphasizing hardware acceleration for 3G/4G physical layer processing and deterministic real-time performance.

FAQ

What is the maximum DDR3 data rate supported by the MSC8151TAG1000B?

The MSC8151TAG1000B supports DDR3 data rates up to 800 MT/s (400 MHz clock) on both DDR controllers. This is achieved using 64-bit wide buses with on-die termination and programmable read/write leveling, enabling sustained bandwidth of 6.4 GB/s per interface in optimal configurations.

Does the MSC8151TAG1000B include hardware support for Turbo decoding?

Yes, the MSC8151TAG1000B includes the MAPLE-B subsystem which provides dedicated hardware Turbo decoding capable of up to 128 iterations per codeword, supporting LTE Release 8–10 standards with throughput exceeding 100 Mbps under typical channel conditions.

How many Serial RapidIO lanes does the MSC8151TAG1000B support?

The MSC8151TAG1000B supports two independent Serial RapidIO interfaces, each configurable for x1 or x4 lane operation at 3.125 Gbaud. Each interface includes a dedicated messaging unit and two DMA engines, enabling concurrent high-throughput inter-processor communication in distributed baseband architectures.

What is the function of the QUICC Engine in the MSC8151TAG1000B?

The QUICC Engine in the MSC8151TAG1000B is a dual-RISC coprocessor subsystem that offloads packet processing tasks-including Gigabit Ethernet (RGMII/SGMII) framing, checksum calculation, and SPI peripheral control-from the main SC3850 DSP core, improving overall system efficiency and reducing real-time scheduling overhead.

Can the MSC8151TAG1000B operate in extended temperature ranges?

The MSC8151TAG1000B is qualified for industrial temperature range (–40°C to +105°C ambient) per Freescale documentation. Its 45 nm SOI CMOS process and integrated thermal monitoring circuitry enable reliable operation in base station remote radio units and outdoor backhaul equipment without derating.

MSC8151TAG1000B Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
StarCore
Package/Case:
783-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Obsolete
Type:
SC3850 Single Core
Interface:
Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate:
1GHz
Non-Volatile Memory:
ROM (96kB)
On-Chip RAM:
576kB
Voltage - I/O:
2.50V
Voltage - Core:
1.00V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
783-FCPBGA (29x29)

MSC8151TAG1000B FAQ

1.How can I place an order for MSC8151TAG1000B through Aetrix?

Please submit a Request for Quotation (RFQ) for MSC8151TAG1000B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSC8151TAG1000B reliable?

The price and inventory of MSC8151TAG1000B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8151TAG1000B is usually 5 days.

3.What payment methods are accepted for MSC8151TAG1000B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8151TAG1000B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSC8151TAG1000B?

MSC8151TAG1000B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSC8151TAG1000B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSC8151TAG1000B?

For technical support, including MSC8151TAG1000B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8151TAG1000B requirements.

6.How does Aetrix verify that MSC8151TAG1000B is sourced from the original manufacturer or authorized distributors?

All MSC8151TAG1000B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8151TAG1000B meets industry standards.

7.What is the process for return or replacement of MSC8151TAG1000B?

All MSC8151TAG1000B units undergo pre-shipment inspection (PSI). If there is an issue with MSC8151TAG1000B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSC8151TAG1000B part is unused and in its original packaging.

Return procedure for MSC8151TAG1000B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MSC8151TAG1000B Tags

  • MSC8151TAG1000B
  • MSC8151TAG1000B PDF
  • MSC8151TAG1000B Datasheet
  • MSC8151TAG1000B Specifications
  • MSC8151TAG1000B Images
  • NXP Semiconductors
  • NXP Semiconductors MSC8151TAG1000B
  • Buy MSC8151TAG1000B
  • MSC8151TAG1000B Price
  • MSC8151TAG1000B Distributor
  • MSC8151TAG1000B Supplier
  • MSC8151TAG1000B Wholesale
Related Products
TMS320C5535AZAY10
TMS320C5535AZAY10

Texas Instruments

TMS320VC5501PGF300
TMS320VC5501PGF300

Texas Instruments

ADSP-BF592KCPZ
ADSP-BF592KCPZ

Analog Devices Inc.

ADAU1463WBCPZ150
ADAU1463WBCPZ150

Analog Devices Inc.

TMS320VC5402PGE100
TMS320VC5402PGE100

Texas Instruments

ADAU1701JSTZ-RL
ADAU1701JSTZ-RL

Analog Devices Inc.

ADAU1701JSTZ
ADAU1701JSTZ

Analog Devices Inc.

TMS320VC5502PGF300
TMS320VC5502PGF300

Texas Instruments

ADAU1462WBCPZ300RL
ADAU1462WBCPZ300RL

Analog Devices Inc.

ADAU1452KCPZRL
ADAU1452KCPZRL

Analog Devices Inc.

ADAU1452WBCPZ-RL
ADAU1452WBCPZ-RL

Analog Devices Inc.

TMS320C6747DZKB3
TMS320C6747DZKB3

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER