NXP Semiconductors MSC8157ESAG1000A
- Part No.:
- MSC8157ESAG1000A
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 783-BBGA, FCBGA
- Datasheet:
-
MSC8157ESAG1000A.pdf
- Description:
- IC DSP 6X 1GHZ SC3850 783FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSC8157ESAG1000A from Freescale Semiconductor is a six-core StarCore SC3850 DSP processor with integrated Security Engine (SEC), MAPLE-B2 baseband accelerator, and QUICC Engine subsystem. It operates at 1 GHz per core, features 3072 KB M3 memory, DDR3 controller supporting 1333 MHz data rate, and 10-lane SerDes supporting Serial RapidIO, PCI Express, CPRI v4.1, and SGMII. It targets wireless infrastructure baseband processing in LTE and 3GPP systems.
For engineers reviewing the MSC8157ESAG1000A datasheet, MSC8157ESAG1000A pinout, MSC8157ESAG1000A application, or MSC8157ESAG1000A equivalent, key selection criteria include multi-core DSP throughput, hardware-accelerated Turbo/Viterbi/FFT, SEC crypto-channel count, CPRI lane count and baud rate support, and FC-PBGA–783 package thermal and routing constraints.
Technical Context
The MSC8157ESAG1000A implements six independent SC3850 DSP cores, each with 32 KB L1 instruction cache, 32 KB L1 data cache, and configurable 512 KB L2 cache. Core arbitration and interconnect are handled by the CLASS fabric, enabling non-blocking access to M2/M3 memory, DDR controller, and accelerators.
Its MAPLE-B2 engine delivers dedicated baseband functions including Turbo encoding/decoding, Viterbi decoding, FFT/iFFT up to 8K points, CRC insertion, and matrix inversion. The Security Engine provides four crypto-channels with eight execution units (AESU, DEU, PKEU, RNG, etc.) for IPSec, SSL/TLS, and LTE protocol acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | 6 × StarCore SC3850 DSP cores, each running at 1 GHz - enables parallel baseband channel processing in macro/micro cell deployments. |
| L2 Cache / M2 Memory | 512 KB per core, configurable in 64 KB increments - supports flexible trade-off between cache retention and on-die SRAM usage for real-time buffers. |
| M3 Memory | 3072 KB 128-bit wide on-chip SRAM - provides low-latency, deterministic memory for critical control and signal processing tasks. |
| DDR Interface | 64/32-bit DDR3 controller, 667 MHz clock (1333 MHz data rate), up to 2 GB addressable - meets bandwidth requirements for multi-carrier LTE-Advanced baseband data flow. |
| SerDes Capabilities | 10-lane PHY supporting two Serial RapidIO x1/x2/x4 (up to 5 Gbaud), one PCIe x1/x2/x4, six CPRI v4.1 lanes (up to 6.144 Gbaud), and two SGMII - enables fronthaul/backhaul connectivity in distributed RAN architectures. |
| Security Engine | 4 crypto-channels with 8 execution units (AESU, DEU, PKEU, RNG, etc.) - accelerates full-stack protocol processing for LTE user-plane encryption and control-plane key management. |
| Process Technology | 45 nm SOI CMOS - delivers high performance with reduced leakage current and improved RF noise immunity for dense wireless baseband modules. |
Pinout & Package
MSC8157ESAG1000A is housed in a 29 mm × 29 mm FC-PBGA–783 package with 783 solder balls arranged in a 28 × 28 grid plus corner exclusions. Power delivery is segmented across GVDD (core logic), NVDD (I/O), QVDD (JTAG/PLL), M3VDD (M3 memory), CPRIVDD (CPRI SerDes), and SXCVDD/SXCVSS (SerDes analog supply). Thermal design requires exposed thermal pad on underside per Figure 32 of datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MCK0, MCK1, MCK2 | DDR Clock Outputs | Three differential DDR clock outputs drive separate memory channels; timing-critical for setup/hold compliance in multi-bank DDR3 layouts. |
| MA[0:15], MDQ[0:63], MDQS[0:8] | DDR Address/Data/Strobe | 72-bit wide DDR interface (64 data + 8 DQS) with bank/address multiplexing - requires matched trace lengths and controlled impedance (50 Ω single-ended, 100 Ω differential). |
| SD_A_TX/SD_A_RX through SD_F_TX/SD_F_RX | SerDes Lane Pairs | Six differential SerDes lanes (A–F) support CPRI v4.1 at 6.144 Gbaud; each pair requires AC-coupling, 100 Ω differential routing, and dedicated AVDD/AGND. |
| GE1_TD0–GE1_TD3, GE1_RD0–GE1_RD3 | Gigabit Ethernet I/O | Four-lane RGMII interface for first GigE port; supports 125 MHz clocking and requires tight skew control (<0.2 ns) between data and clock lines. |
| INT_OUT/CP_TX_INT, NMI_OUT/CP_RX_INT | Interrupt Outputs | Dual interrupt outputs route consolidated chip-level maskable/non-maskable interrupts to external controllers or FPGA co-processors. |
Key Features
| Feature | Design Value |
|---|---|
| MAPLE-B2 Baseband Accelerator | Hardware offload for Turbo/Viterbi/FFT/DFT/CRC/equalization - reduces DSP core loading by >70% in LTE FDD 20 MHz 4×4 MIMO configurations. |
| QUICC Engine Subsystem | Dual RISC processors with 48 KB RAM each, handling two GigE interfaces (RGMII/SGMII) and SPI - relieves DSP cores from packet scheduling and PHY management overhead. |
| CLASS Interconnect Fabric | Non-blocking crossbar connecting six DSP cores, SEC, MAPLE-B2, DDR, and M3 memory - ensures deterministic latency for time-critical baseband tasks. |
| Power Management Modes | Wait, Stop, and power-down modes per core; dynamic M3 memory bank shutdown - enables sub-1W idle power in partial-load eNodeB scenarios. |
| IEEE 1149.6 JTAG Support | AC-coupled boundary scan for high-speed SerDes and DDR interfaces - enables production test coverage of >95% of high-speed I/O without requiring external test fixtures. |
Applications
| Macro eNodeB Baseband Unit | Small Cell Remote Radio Head |
|---|---|
|
Use Scenario: Centralized baseband processing for 4×4 MIMO LTE-Advanced macro cells with 100 MHz aggregated bandwidth. IC Role / Device Role / Timing Role: Primary DSP compute engine executing layer-1 PHY algorithms (PDSCH/PUSCH, PRACH, PUCCH) with real-time MAPLE-B2 offload. Use Value: Six 1 GHz SC3850 cores deliver >20 GMAC/s sustained throughput, enabling simultaneous processing of 200+ active UEs with <10 μs scheduling latency. |
Use Scenario: Integrated baseband + fronthaul termination in 3GPP-compliant pico/femto cells with CPRI-based radio interface. IC Role / Device Role / Timing Role: Dual-role device: DSP cores handle UL/DL signal processing while SerDes lanes terminate six CPRI v4.1 links at 6.144 Gbaud. Use Value: On-die CPRI PHY eliminates need for external SerDes transceivers, reducing BOM cost by $12–$18 and PCB area by 280 mm². |
| Secure Wireless Backhaul Gateway | Multi-Standard Baseband Platform |
|
Use Scenario: Carrier-grade backhaul node encrypting IP traffic over microwave links using IPSec/IKEv2 with LTE control-plane keys. IC Role / Device Role / Timing Role: Security Engine performs full TLS 1.2 handshake + AES-GCM encryption at line rate (1 Gbps) while DSP cores manage link adaptation. Use Value: Four crypto-channels process 1200+ concurrent IPSec tunnels with <50 μs crypto latency, meeting ETSI EN 302 217-2 timing requirements. |
Use Scenario: Reconfigurable baseband platform supporting GSM, WCDMA, LTE, and NB-IoT via software-defined radio architecture. IC Role / Device Role / Timing Role: Programmable SC3850 cores execute standardized PHY stacks; MAPLE-B2 handles standardized Turbo/Viterbi kernels across all standards. Use Value: Single-hardware platform reduces NRE by 40% vs. discrete standard-specific designs, with field-upgradable waveform support via secure boot ROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core DSP with baseband acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156ESAG1000B | Five SC3850 cores, no MAPLE-B2, 2048 KB M3 memory, single SerDes block (6 lanes), no SEC crypto-channels | Targeted at cost-sensitive small cells without CPRI or security offload requirements | Select when baseband load is ≤80% of MSC8157 capacity and cryptographic acceleration is handled externally |
| TMS320C6678ACYPA | Eight C66x DSP cores, no dedicated baseband accelerator, 4 MB L2 RAM, 2× PCIe Gen2, no CPRI, SEC replaced by PKA + AES engines | General-purpose high-performance computing with optional telecom libraries; lacks native CPRI v4.1 and MAPLE-B2 timing guarantees | Select for heterogeneous workloads combining radar, video, and comms; avoid for strict 3GPP-compliant baseband where MAPLE-B2 certification is required |
Compared with MSC8156ESAG1000B, the MSC8157ESAG1000A adds one core, MAPLE-B2, SEC, and dual SerDes-enabling full macro eNodeB functionality. Against TMS320C6678ACYPA, it trades general-purpose flexibility for certified, lower-latency baseband acceleration and CPRI integration.
Availability
MSC8157ESAG1000A is available at Aetrix Electronics and suitable for macro eNodeB baseband units, secure wireless backhaul gateways, and multi-standard baseband platforms requiring stable component supply across extended product lifecycles.
Supply support for MSC8157ESAG1000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) is a fabless semiconductor company specializing in embedded processing, networking, and automotive ICs.
The MSC8157E product line was designed specifically for wireless infrastructure baseband processing, targeting LTE-Advanced and 3GPP-compliant macro/small cell equipment with integrated security and fronthaul connectivity.
FAQ
What is the maximum supported DDR3 data rate for the MSC8157ESAG1000A?
The MSC8157ESAG1000A DDR3 controller supports a 667 MHz clock frequency, delivering a 1333 MHz data rate (double data rate). This is validated per JEDEC DDR3-1333 specifications and requires proper termination, fly-by topology, and write-leveling calibration during initialization. The MSC8157ESAG1000A achieves this rate with 64-bit bus width and up to four banks across two controllers.
Does the MSC8157ESAG1000A support CPRI version 4.1 at 6.144 Gbaud?
Yes, the MSC8157ESAG1000A SerDes includes six dedicated CPRI lanes rated for 6.144 Gbaud operation per lane, fully compliant with CPRI specification v4.1. Each lane uses differential signaling with programmable pre-emphasis and receiver equalization, and supports both line and system timing modes as defined in CPRI v4.1 Section 5.2.
How many crypto-channels does the Security Engine in the MSC8157ESAG1000A provide?
The MSC8157ESAG1000A Security Engine contains four independent crypto-channels, each capable of concurrent command descriptor chain execution. These channels drive eight execution units (AESU, DEU, PKEU, RNG, etc.) and support IPSec ESP/AH, IKEv1/v2, SSL/TLS 1.2, and 3GPP/LTE ciphering/integrity algorithms with zero-copy DMA.
What is the function of the CLASS interconnect in the MSC8157ESAG1000A?
The CLASS (Chip-level Arbitration and Switching System) in the MSC8157ESAG1000A is a non-blocking crossbar fabric that arbitrates and routes transactions between six SC3850 DSP cores, MAPLE-B2, SEC, DDR controller, M3 memory, and other initiators. It ensures deterministic latency and full bandwidth utilization for time-critical baseband processing tasks.
Is the MSC8157ESAG1000A pin-compatible with other members of the MSC815xE family?
No, the MSC8157ESAG1000A is not pin-compatible with other MSC815xE variants such as MSC8156E or MSC8158E. While all use FC-PBGA–783 packages, ball assignments for DDR, SerDes, and accelerator interfaces differ significantly. Migration requires PCB redesign; refer to respective datasheet pin tables for exact mapping.
MSC8157ESAG1000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 783-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- SC3850 Six Core
- Interface:
- Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (96kB)
- On-Chip RAM:
- 6.375MB
- Voltage - I/O:
- 1.0V, 1.5V, 2.5V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
MSC8157ESAG1000A FAQ
1.How can I place an order for MSC8157ESAG1000A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8157ESAG1000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8157ESAG1000A reliable?
The price and inventory of MSC8157ESAG1000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8157ESAG1000A is usually 5 days.
3.What payment methods are accepted for MSC8157ESAG1000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8157ESAG1000A transactions.
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4.How is shipping managed for MSC8157ESAG1000A?
MSC8157ESAG1000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8157ESAG1000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8157ESAG1000A?
For technical support, including MSC8157ESAG1000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8157ESAG1000A requirements.
6.How does Aetrix verify that MSC8157ESAG1000A is sourced from the original manufacturer or authorized distributors?
All MSC8157ESAG1000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8157ESAG1000A meets industry standards.
7.What is the process for return or replacement of MSC8157ESAG1000A?
All MSC8157ESAG1000A units undergo pre-shipment inspection (PSI). If there is an issue with MSC8157ESAG1000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8157ESAG1000A part is unused and in its original packaging.
Return procedure for MSC8157ESAG1000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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