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NXP Semiconductors MSC8157SAG1000A

Part No.:
MSC8157SAG1000A
Manufacturer:
NXP Semiconductors
Category:
DSP (Digital Signal Processors)
Package:
783-BBGA, FCBGA
Datasheet:
AetrixMSC8157SAG1000A.pdf
Description:
IC DSP 6X 1GHZ SC3850 783FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,455

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Product details

Overview

MSC8157SAG1000A from NXP Semiconductors (formerly Freescale) is a six-core StarCore SC3850 DSP processor designed for baseband signal processing in wireless infrastructure. It integrates six 1 GHz DSP cores, 3072 KB M3 memory, DDR3 controller supporting up to 2 GB at 1333 MHz data rate, MAPLE-B2 baseband accelerator, and dual Gigabit Ethernet via QUICC Engine. Used in 4G LTE eNodeB and CPRI-based remote radio units.

For engineers reviewing the MSC8157SAG1000A datasheet, MSC8157SAG1000A pinout, MSC8157SAG1000A application, or MSC8157SAG1000A equivalent, key selection considerations include its 783-ball FC-PBGA package, 10-lane SerDes supporting Serial RapidIO/PCIe/CPRI/SGMII, 45 nm SOI process, and integrated hardware accelerators for Turbo/Viterbi/FFT/CRC.

Technical Context

The MSC8157SAG1000A implements a chip-level arbitration and switching system (CLASS) enabling non-blocking interconnect between six DSP cores, MAPLE-B2, DDR controller, and M3 memory. Its memory subsystem includes configurable 512 KB L2 cache per core (usable as M2 memory), 3072 KB shared M3 SRAM (2048 KB power-gatable), and 96 KB boot ROM.

Its high-speed serial interface uses a single 10-lane SerDes PHY multiplexed across two Serial RapidIO x1/x2/x4 links (up to 5 Gbaud), one PCIe x1/x2/x4 controller, six CPRI lanes (up to 6.144 Gbaud), and two SGMII interfaces. The QUICC Engine subsystem offloads Ethernet packet handling with dual RISC processors and 48 KB RAM.

Key Specifications

ParameterValue and Actual Design Meaning
CoresSix SC3850 DSP cores at 1 GHz - enables parallel baseband processing for multi-carrier LTE.
L2 Cache / M2 Memory512 KB per core, configurable in 64 KB increments - supports flexible memory mapping for real-time algorithm partitioning.
M3 Memory3072 KB 128-bit wide SRAM, 2048 KB power-gatable - provides low-latency shared data storage with dynamic power optimization.
DDR Interface64/32-bit bus, DDR3 support up to 667 MHz clock (1333 MHz data rate), 2 GB max capacity - meets bandwidth demands of high-throughput baseband data transfer.
SerDes Capability10-lane PHY supporting two Serial RapidIO (5 Gbaud), PCIe x4, six CPRI (6.144 Gbaud), two SGMII - consolidates fronthaul/backhaul and inter-processor connectivity into one physical layer.
MAPLE-B2 AccelerationTurbo/Viterbi decoding, FFT/iFFT, CRC, equalization, matrix inversion - offloads computationally intensive physical-layer functions from DSP cores.
Process Technology45 nm SOI CMOS - delivers high performance with reduced leakage and improved RF noise immunity for wireless applications.

Pinout & Package

MSC8157SAG1000A is housed in a 29 mm × 29 mm FC-PBGA–783 package with 783 I/O balls arranged in a 28×28 grid plus corner exclusions. Power delivery is segmented across multiple voltage domains: GVDD (core logic), NVDD (I/O), QVDD (JTAG/debug), VDD (general logic), M3VDD (M3 memory), CPRIVDD (CPRI SerDes), SXCVDD/SXCVSS (SerDes analog), and SXPVDD/SXPVSS (SerDes digital).

Pin/TerminalCircuit RoleDesign Meaning
MCK0, MCK1, MCK2DDR clock outputsDrive DDR3 memory interface timing; three independent clocks support multi-bank or multi-controller configurations.
MA[0:15], MDQ[0:63], MDQS[0:8], MWE, MRAS, MCS[0:1], MBA[0:2]DDR address/data/controlFull 64-bit DDR3 bus with DQS strobes, bank/address/command signals - implements JEDEC-compliant DDR3 interface up to 1333 MT/s.
SD_A_TX/SD_A_RX through SD_F_TX/SD_F_RXSerDes lane pairsTwelve differential SerDes lanes (six pairs) assigned to CPRI, SGMII, or RapidIO - each pair requires matched trace length and controlled impedance routing.
GE1_TD0–TD3, GE1_RD0–RD3, GE1_TX_CTL, GE1_RX_CTLGigabit Ethernet interface (Port 1)RGMII/SGMII-capable 4-lane TX/RX data + control signals - connects directly to PHY without external MAC logic.
GPIO0–GPIO31General-purpose I/O32 programmable pins, 16 configurable as external interrupts - used for board control, status monitoring, and boot configuration (e.g., RCW_LSEL[0:3]).

Key Features

FeatureDesign Value
CLASS interconnect fabricNon-blocking arbitration between six DSP cores, MAPLE-B2, DDR, and M3 memory - eliminates bus contention and ensures deterministic latency for real-time processing.
MAPLE-B2 baseband engineDedicated hardware acceleration for Turbo/Viterbi decoding, FFT/iFFT, CRC, and channel equalization - reduces DSP core loading by >70% for typical LTE physical-layer workloads.
QUICC Engine subsystemDual RISC processors with 48 KB instruction RAM and 48 KB multi-master RAM - handles full Gigabit Ethernet packet scheduling and framing independently of DSP cores.
Power management modesWait, Stop, and power-down modes per core plus global M3 memory gating - enables dynamic power scaling down to sub-watt idle states in burst-traffic scenarios.
JTAG IEEE 1149.6 complianceAC-coupled boundary-scan support for high-speed SerDes lanes - allows production test and debug of high-frequency interfaces without requiring dedicated test access ports.

Applications

Wireless Base Station Fronthaul4G LTE eNodeB Baseband Unit

Use Scenario: Connecting remote radio heads (RRH) to centralized baseband units via CPRI over fiber.

IC Role / Device Role / Timing Role: MSC8157SAG1000A serves as the primary baseband processor, managing CPRI frame assembly/disassembly, IQ data buffering, and real-time synchronization using its six DSP cores and six CPRI SerDes lanes.

Use Value: Enables deterministic <10 µs latency for CPRI transport while maintaining full 6.144 Gbaud line rate across all six lanes - critical for TDD synchronization and MIMO antenna coordination.

Use Scenario: Real-time Layer 1 processing in macrocell eNodeB systems supporting up to 20 MHz bandwidth and 4×4 MIMO.

IC Role / Device Role / Timing Role: MSC8157SAG1000A executes OFDM modulation/demodulation, channel estimation, and turbo decoding using MAPLE-B2 accelerators and six SC3850 cores operating in lockstep or distributed mode.

Use Value: Delivers >10 GOPS sustained compute throughput with ECC-protected L2/M3 memory - meets 3GPP Release 8–10 physical-layer requirements at sub-5W thermal envelope.

Small Cell Backhaul GatewayMulti-Standard Radio Platform

Use Scenario: Aggregating traffic from multiple pico/femtocells and forwarding to core network via Serial RapidIO or PCIe.

IC Role / Device Role / Timing Role: MSC8157SAG1000A acts as a packet-processing gateway, using QUICC Engine for Ethernet bridging and CLASS fabric to route RapidIO packets between DSP cores and DDR memory.

Use Value: Supports concurrent 1 Gbps Ethernet ingress/egress and 10 Gbps Serial RapidIO uplink - eliminates need for external switch fabric in compact small cell deployments.

Use Scenario: Supporting GSM, WCDMA, and LTE waveforms on a single hardware platform via software-defined radio architecture.

IC Role / Device Role / Timing Role: MSC8157SAG1000A hosts waveform-specific firmware partitions across its six cores, with MAPLE-B2 reconfigured per standard for Viterbi (GSM), Turbo (LTE), or convolutional (WCDMA) decoding.

Use Value: Reduces BOM count by consolidating three radio standards into one SoC - lowers PCB area by >35% versus discrete DSP+FPGA solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-core DSP baseband applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS320C6678AZHSAEight C66x DSP cores at 1.25 GHz, no integrated MAPLE-B2 or CPRI SerDes; uses SRIO/PCIe only.Requires external FPGA or ASIC for CPRI/physical-layer acceleration; better suited for general-purpose DSP tasks than wireless-specific baseband.Select when algorithm portability to TI C6000 toolchain is required and CPRI is handled externally.
LS1046ASE8MQBQuad ARM Cortex-A72 cores, no DSP acceleration, no MAPLE-B2; includes DPAA2 for packet processing but no baseband engines.Targets control-plane and L2/L3 packet forwarding in vRAN; lacks hardware support for Layer 1 PHY functions like FFT or Turbo decode.Select for CU/DU split architectures where baseband is offloaded to dedicated accelerators and MSC8157SAG1000A is replaced by a control-processor SoC.

Compared with TMS320C6678AZHSA and LS1046ASE8MQB, the MSC8157SAG1000A uniquely integrates wireless-specific hardware accelerators (MAPLE-B2), CPRI-optimized SerDes, and a non-blocking CLASS interconnect - making it irreplaceable for fully integrated, low-latency, single-chip LTE/WCDMA/GSM baseband designs.

Availability

MSC8157SAG1000A is available at Aetrix Electronics and suitable for wireless infrastructure, 4G/5G baseband development, and CPRI fronthaul equipment requiring stable component supply and long-term industrial lifecycle support.

Supply support for MSC8157SAG1000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division and later merged with Freescale. It focuses on secure connectivity solutions for automotive, industrial, IoT, and communications markets.

The MSC8157SAG1000A belongs to NXP's StarCore DSP family, engineered specifically for high-performance, low-power wireless baseband processing in macrocell, small cell, and RRH applications - emphasizing integration of PHY acceleration, memory hierarchy, and fronthaul interfaces.

FAQ

What is the maximum DDR3 data rate supported by the MSC8157SAG1000A?

The MSC8157SAG1000A supports a DDR3 interface clocked at up to 667 MHz, delivering an effective data rate of 1333 MT/s on a 64-bit or 32-bit bus. This is confirmed in Section 3.2 (Recommended Operating Conditions) and Table 3-1 of the Rev. 3 datasheet, and enables sustained bandwidth of ~10.6 GB/s for baseband data buffering and exchange between DSP cores and external memory.

Does the MSC8157SAG1000A include hardware support for CPRI protocol layers?

Yes, the MSC8157SAG1000A integrates six dedicated CPRI controllers within its SerDes subsystem, supporting line rates up to 6.144 Gbaud per lane (CPRI v4.1). These controllers handle 8B/10B encoding/decoding, frame alignment, and CRC generation/checking in hardware - eliminating the need for FPGA-based CPRI termination in RRH and BBU designs.

How many independent SerDes protocols can operate simultaneously on the MSC8157SAG1000A?

The MSC8157SAG1000A's 10-lane SerDes PHY supports concurrent operation of two Serial RapidIO interfaces (x4 each), one PCIe x4 link, six CPRI lanes, and two SGMII interfaces - all multiplexed on the same physical lanes. Protocol allocation is configured at boot via RCW settings, and lane sharing is managed by the SerDes configuration registers documented in Chapter 5 of the reference manual.

What is the role of the CLASS interconnect in the MSC8157SAG1000A architecture?

The CLASS (Chip-level Arbitration and Switching System) is a non-blocking crossbar fabric that arbitrates and routes transactions between the six SC3850 DSP cores, MAPLE-B2 engine, DDR controller, M3 memory, and other initiators/targets. It ensures deterministic latency and full bandwidth utilization - critical for real-time baseband processing where memory access conflicts would otherwise degrade throughput or cause jitter.

Can the MSC8157SAG1000A execute boot code from SPI flash without external configuration?

Yes, the MSC8157SAG1000A supports direct boot from SPI flash via its integrated boot ROM and configurable boot interface. Boot mode is selected using GPIO pins (e.g., RCW_LSEL[0:3]) during reset, and the device loads initial firmware from SPI, I2C, Ethernet, or Serial RapidIO - enabling standalone startup without host processor intervention.

MSC8157SAG1000A Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
StarCore
Package/Case:
783-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Type:
SC3850 Six Core
Interface:
Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate:
1GHz
Non-Volatile Memory:
ROM (96kB)
On-Chip RAM:
6.375MB
Voltage - I/O:
1.0V, 1.5V, 2.5V
Voltage - Core:
1.00V
Operating Temperature:
0°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
783-FCPBGA (29x29)

MSC8157SAG1000A FAQ

1.How can I place an order for MSC8157SAG1000A through Aetrix?

Please submit a Request for Quotation (RFQ) for MSC8157SAG1000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSC8157SAG1000A reliable?

The price and inventory of MSC8157SAG1000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8157SAG1000A is usually 5 days.

3.What payment methods are accepted for MSC8157SAG1000A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8157SAG1000A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSC8157SAG1000A?

MSC8157SAG1000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSC8157SAG1000A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSC8157SAG1000A?

For technical support, including MSC8157SAG1000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8157SAG1000A requirements.

6.How does Aetrix verify that MSC8157SAG1000A is sourced from the original manufacturer or authorized distributors?

All MSC8157SAG1000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8157SAG1000A meets industry standards.

7.What is the process for return or replacement of MSC8157SAG1000A?

All MSC8157SAG1000A units undergo pre-shipment inspection (PSI). If there is an issue with MSC8157SAG1000A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSC8157SAG1000A part is unused and in its original packaging.

Return procedure for MSC8157SAG1000A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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