NXP Semiconductors MSC8157TVT1000A
- Part No.:
- MSC8157TVT1000A
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 783-BBGA, FCBGA
- Datasheet:
-
MSC8157TVT1000A.pdf
- Description:
- IC DSP 6-CORE DGTL 783FCBGA
- Quantity:
- Payment:

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Product details
Overview
MSC8157TVT1000A from NXP Semiconductors (formerly Freescale) is a six-core StarCore SC3850 DSP processor operating at 1 GHz, integrating 512 KB configurable L2 cache per core, 3072 KB on-chip M3 memory, dual Gigabit Ethernet via QUICC Engine, and MAPLE-B2 baseband acceleration for Turbo/Viterbi/FFT processing - deployed in wireless infrastructure baseband units requiring real-time signal processing.
For engineers reviewing the MSC8157TVT1000A datasheet, MSC8157TVT1000A pinout, MSC8157TVT1000A application, or MSC8157TVT1000A equivalent, key selection considerations include DDR3 controller support (64/32-bit, 1333 MT/s), Serial RapidIO x4 @ 5 Gbaud, CPRI v4.1 lane count (6 lanes up to 6.144 Gbaud), and 783-ball FC-PBGA package thermal and routing constraints.
Technical Context
The MSC8157TVT1000A implements six independent SC3850 DSP cores with MMU, EPIC interrupt controller, and ECC/EDC-protected memory subsystems. Its CLASS arbitration fabric enables non-blocking communication between cores, MAPLE-B2 accelerators, DDR controller, and high-speed SerDes targets.
MAPLE-B2 provides dedicated hardware acceleration for LTE/WCDMA physical layer functions including Turbo decoding (up to 100 Mbps), Viterbi decoding (QPSK/16QAM), 2K–16K FFT/iFFT, CRC insertion, and matrix inversion - with runtime disable capability to reduce dynamic power consumption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Six SC3850 DSP cores @ 1 GHz, each with 32 KB L1 I-cache, 32 KB L1 D-cache |
| L2 Cache / M2 Memory | 512 KB unified L2 cache per core, configurable in 64 KB increments as M2 memory |
| M3 Memory | 3072 KB on-die 128-bit wide SRAM; 2048 KB power-gatable |
| DDR Interface | DDR3 controller supporting 64/32-bit bus, 667 MHz clock (1333 MT/s), up to 2 GB across 4 banks |
| High-Speed SerDes | 10-lane PHY supporting two Serial RapidIO x1/x2/x4 @ 5 Gbaud, one PCIe x1/x2/x4, six CPRI v4.1 lanes @ 6.144 Gbaud, two SGMII |
| QUICC Engine | Dual RISC processors with 48 KB multi-master RAM, two Gigabit Ethernet interfaces (RGMII/SGMII), SPI, offloading protocol stack tasks |
| Process Technology | 45 nm SOI CMOS, enabling low-power standby and power-down modes with optimized voltage domains |
Pinout & Package
MSC8157TVT1000A uses a 29 mm × 29 mm FC-PBGA–783 package with 783 solder balls arranged in a 28×28 grid plus corner exclusions. Power delivery is segmented across GVDD (core logic), NVDD (I/O), QVDD (JTAG/debug), M3VDD (M3 memory), CPRIVDD (CPRI SerDes), SXCVDD/SXCVSS (SerDes analog), and SXPVDD/SXPVSS (SerDes digital).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MCK0, MCK1, MCK2 | DDR Clock Outputs | Three differential DDR clock pairs driving external memory; require matched trace length and termination |
| MA[0:15], MDQ[0:63], MDQS[0:8] | DDR Address/Data/Strobe | 64-bit data bus + 16-bit address/command bus with 9-byte strobes; supports DDR3 timing closure at 1333 MT/s |
| SD_A_TX/SD_A_RX – SD_F_TX/SD_F_RX | CPRI SerDes Lanes | Six bidirectional CPRI v4.1 lanes (each 6.144 Gbaud); use SXCVDD/SXCVSS and SXPVDD/SXPVSS power domains |
| GE1_TD0–GE1_TD3, GE1_RD0–GE1_RD3 | Gigabit Ethernet PHY Interface | RGMII signals for first Ethernet port; requires 1.5 V NVDD supply and impedance-controlled 50 Ω traces |
| TCK, TMS, TDO, TDI, TRST, PORESET | JTAG Debug Interface | IEEE 1149.6-compliant boundary-scan and debug access; operates at QVDD (1.2 V) |
Key Features
| Feature | Design Value |
|---|---|
| MAPLE-B2 Baseband Acceleration | Hardware Turbo decoder (100 Mbps), Viterbi decoder (QPSK/16QAM), 2K–16K FFT/iFFT, CRC, equalization - reduces DSP core load by >70% in LTE eNodeB baseband stacks |
| CLASS Non-blocking Fabric | Chip-level arbitration system enabling concurrent access to M3 memory, DDR, MAPLE-B2, and SerDes without priority starvation or deadlock |
| Power-Gated M3 Memory | 2048 KB of 3072 KB M3 SRAM can be disabled dynamically, reducing active power by up to 180 mW under partial workload conditions |
| Multi-Standard SerDes Flexibility | Single 10-lane PHY multiplexed across Serial RapidIO, PCIe, CPRI, and SGMII - eliminates need for discrete SerDes ICs in wireless BBU designs |
| QUICC Engine Offload | Dual RISC processors handle Ethernet MAC/PHY framing, TCP/IP checksum, and SPI control - freeing DSP cores for computationally intensive PHY-layer algorithms |
Applications
| Wireless Base Station Baseband Unit | LTE Advanced eNodeB Digital Front-End |
|---|---|
Use Scenario: Real-time processing of up to 8x8 MIMO LTE-A signals in macrocell base stations. IC Role / Device Role / Timing Role: Primary baseband processor executing Layer 1 PHY algorithms (PDSCH/PUSCH, PRACH, synchronization) with MAPLE-B2 offloading Turbo/Viterbi. Use Value: Achieves 3.2 Gbps aggregate throughput with deterministic sub-10 μs latency for symbol-level processing using six 1 GHz SC3850 cores and hardware accelerators. |
Use Scenario: Digital front-end for remote radio heads (RRH) connected via CPRI fronthaul. IC Role / Device Role / Timing Role: CPRI v4.1 fronthaul interface controller and IQ sample preprocessor before DAC/ADC conversion. Use Value: Six integrated CPRI lanes at 6.144 Gbaud eliminate external SerDes, reduce PCB area by 35%, and maintain <100 ns inter-lane skew for coherent MIMO operation. |
| Small Cell Baseband Processing | WCDMA HSPA+ NodeB Transceiver |
Use Scenario: Compact indoor/outdoor small cell unit supporting 2x2 MIMO and carrier aggregation. IC Role / Device Role / Timing Role: Integrated baseband SoC handling channel coding, modulation, and OFDMA resource mapping. Use Value: On-chip 3072 KB M3 memory stores full frame buffers for 20 MHz bandwidth; DDR3 controller supports burst-mode access for low-latency IQ data streaming. |
Use Scenario: Dual-carrier HSPA+ NodeB supporting 42 Mbps DL and 11 Mbps UL. IC Role / Device Role / Timing Role: WCDMA physical layer accelerator with Viterbi (1/2, 1/3) and Turbo decoding, combined with RAKE receiver correlation. Use Value: MAPLE-B2 delivers 2.1 Gbps Turbo decode throughput and 1.8 Gbps Viterbi decode - meeting 3GPP TS 25.212 timing requirements for Category 24 UE support. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core DSP baseband applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156TVT1000B | Four SC3850 cores (vs. six), 2048 KB M3 memory (vs. 3072 KB), same MAPLE-B2, identical SerDes and DDR3 support | Targeted at lower-capacity pico/femtocell deployments; lacks headroom for 8x8 MIMO or dual-band LTE-A | Select when total algorithmic load fits within four cores and memory footprint remains ≤2 GB; reduces BOM cost by ~18% |
| TMS320C6678ACYPA | Eight C66x DSP cores @ 1.25 GHz, no integrated MAPLE-B2, supports SRIO/PCIe/Ethernet but no CPRI, 4 MB L2 shared cache | Requires external FPGA or ASIC for Turbo/Viterbi; better suited for radar, imaging, or general-purpose DSP where CPRI is absent | Choose for non-wireless applications needing higher raw FLOPS or when CPRI integration is unnecessary; mandates external acceleration for 3GPP PHY layers |
Compared with MSC8157TVT1000A, the MSC8156TVT1000B offers reduced core count and memory for cost-sensitive small cells, while the TMS320C6678ACYPA trades integrated wireless acceleration for broader programmability and higher per-core clock speed - making it suitable only when CPRI and MAPLE-B2 are not required.
Availability
MSC8157TVT1000A is available at Aetrix Electronics and suitable for wireless infrastructure baseband units, LTE-Advanced eNodeB digital front-ends, and WCDMA HSPA+ NodeB transceivers requiring stable component supply across extended product lifecycles.
Supply support for MSC8157TVT1000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full support for the MSC8157 family, delivering high-performance signal processing solutions for communications, automotive, and industrial markets.
The MSC8157 belongs to NXP's StarCore DSP portfolio, designed specifically for wireless infrastructure baseband processing - integrating tightly coupled accelerators, memory subsystems, and fronthaul interfaces to meet 3GPP-defined latency and throughput requirements.
FAQ
What is the maximum DDR3 data rate supported by the MSC8157TVT1000A?
The MSC8157TVT1000A supports a DDR3 data rate of 1333 MT/s (667 MHz clock) on a 64-bit or 32-bit bus. This enables sustained memory bandwidth up to 10.6 GB/s, sufficient for real-time buffering of multiple 20 MHz LTE carriers with MIMO processing. The controller complies with JEDEC DDR3L standards and supports on-die termination and write leveling calibration.
Does the MSC8157TVT1000A include hardware support for CPRI v4.1?
Yes, the MSC8157TVT1000A integrates six dedicated CPRI v4.1 controllers capable of 6.144 Gbaud line rates per lane. Each lane supports both transmit and receive paths with built-in 8b/10b encoding, elastic buffer compensation, and fronthaul timing recovery - eliminating the need for external CPRI PHYs in RRH and BBU designs.
How many SerDes protocols can be concurrently active on the MSC8157TVT1000A?
The MSC8157TVT1000A's 10-lane SerDes PHY supports concurrent operation of two Serial RapidIO interfaces (x4 each), one PCIe x4 link, six CPRI lanes, and two SGMII ports - but only specific combinations are electrically feasible due to shared PLLs and power domains. Valid concurrent configurations include: (1) two SRIO x4 + two SGMII, or (2) one PCIe x4 + six CPRI + two SGMII.
What is the role of the CLASS arbitration system in the MSC8157TVT1000A?
The CLASS (Chip-level Arbitration and Switching System) in the MSC8157TVT1000A provides full-fabric, non-blocking interconnect between all initiators (six DSP cores, DMA, QUICC Engine, MAPLE-B2) and targets (M3 memory, DDR controller, configuration registers). It ensures deterministic latency and prevents resource starvation during peak traffic, critical for real-time wireless PHY processing.
Can the MAPLE-B2 accelerators in the MSC8157TVT1000A be disabled independently?
Yes, individual MAPLE-B2 processing engines (Turbo decoder, Viterbi decoder, FFT unit, etc.) can be powered down via register writes without affecting other accelerators or DSP cores. This dynamic power gating allows fine-grained energy optimization - for example, disabling Turbo decode during idle frames while retaining Viterbi and CRC units for control channel monitoring.
MSC8157TVT1000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 783-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC3850 Six Core
- Interface:
- Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (96kB)
- On-Chip RAM:
- 6.375MB
- Voltage - I/O:
- 1.0V, 1.5V, 2.5V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
MSC8157TVT1000A FAQ
1.How can I place an order for MSC8157TVT1000A through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8157TVT1000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8157TVT1000A reliable?
The price and inventory of MSC8157TVT1000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8157TVT1000A is usually 5 days.
3.What payment methods are accepted for MSC8157TVT1000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8157TVT1000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8157TVT1000A?
MSC8157TVT1000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8157TVT1000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8157TVT1000A?
For technical support, including MSC8157TVT1000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8157TVT1000A requirements.
6.How does Aetrix verify that MSC8157TVT1000A is sourced from the original manufacturer or authorized distributors?
All MSC8157TVT1000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8157TVT1000A meets industry standards.
7.What is the process for return or replacement of MSC8157TVT1000A?
All MSC8157TVT1000A units undergo pre-shipment inspection (PSI). If there is an issue with MSC8157TVT1000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8157TVT1000A part is unused and in its original packaging.
Return procedure for MSC8157TVT1000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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