My Inquiry
My Account
NXP Semiconductors MSC8251SAG1000B
- Part No.:
- MSC8251SAG1000B
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 783-BBGA, FCBGA
- Datasheet:
-
MSC8251SAG1000B.pdf
- Description:
- IC DSP 1X 1GHZ SC3850 783FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,265
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSC8251SAG1000B from NXP Semiconductors (formerly Freescale) is a single-core, 1 GHz programmable StarCore SC3850 DSP optimized for medical imaging, aerospace radar processing, defense signal intelligence, and high-precision test equipment. It delivers 8000 MMACS sustained performance, integrates dual DDR2/DDR3 controllers (800 MHz data rate), two Serial RapidIO® interfaces (3.125 Gbaud), and a QUICC Engine subsystem for offloaded packet processing.
For engineers reviewing the MSC8251SAG1000B datasheet, MSC8251SAG1000B pinout, MSC8251SAG1000B application, or MSC8251SAG1000B equivalent, key selection criteria include real-time TDM channel count (4× multi-channel), CLASS fabric arbitration bandwidth (50 Gbps aggregate), L2 cache size (512 KB), and FC-PBGA-783 package compatibility with MSC825x/MSC815x families.
Technical Context
The MSC8251SAG1000B implements a fully programmable SC3850 DSP core at 1 GHz in 45 nm SOI CMOS, delivering 40% higher MMACS/MHz than competing DSPs. Its CLASS interconnect fabric coordinates concurrent access to M2 (512 KB L2), M3 (1056 KB on-chip RAM), DDR controllers, and configuration registers among the DSP core, QUICC Engine, and DMA engine.
Two independent RISC-based QUICC Engine cores operate up to 500 MHz, each supporting Gigabit Ethernet (RGMII/SGMII), SPI, and hardware-accelerated packet classification. The HSSI subsystem multiplexes SerDes lanes across Serial RapidIO (x1/x4), PCI Express (x1/x2/x4), and SGMII, enabling flexible high-speed I/O routing without external switches.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | StarCore SC3850 DSP, single-core, 1 GHz clock, 8000 MMACS sustained throughput |
| Memory Subsystem | 512 KB L2 cache + 1056 KB on-chip M3 RAM + dual DDR2/DDR3 controllers (32/64-bit, 800 MHz data rate) |
| High-Speed Interfaces | 2× Serial RapidIO (3.125 Gbaud, x1/x4), 1× PCIe (x1/x2/x4), 2× SGMII/RGMII, 4× TDM (each supports 8 E1 channels) |
| Interconnect Fabric | CLASS bus with 50 Gbps aggregate bandwidth, arbitrated access to memory and peripherals |
| QUICC Engine | Dual RISC cores @ 500 MHz, independent packet processing for Ethernet, SPI, and protocol offload |
| Package & Process | FC-PBGA-783 (29 mm × 29 mm), 45 nm Silicon-on-Insulator (SOI) technology |
Pinout & Package
MSC8251SAG1000B is housed in a 29 mm × 29 mm, 783-ball Fine-Pitch Ceramic Ball Grid Array (FC-PBGA) package with 1.0 mm ball pitch. Thermal and mechanical specifications comply with JEDEC MO-270AB. Pin assignment validated per MSC8251FS Rev 1 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_CLK0/1 | DDR interface clock output | Differential clock pair driving DDR2/DDR3 SDRAM at 400 MHz (800 Mbps data rate) |
| RAPIDIO_TX[3:0]/RX[3:0] | Serial RapidIO SerDes lanes | Four differential pairs per port supporting x4 operation at 3.125 Gbaud |
| PCIe_REFCLK+/− | PCI Express reference clock input | 100 MHz differential reference for PCIe PHY compliance and jitter tolerance |
| TDM0_CLK/TDM0_FS | TDM interface timing signals | Frame sync and bit clock for first TDM port supporting 8 E1 (2.048 Mbps) channels |
| JTAG_TCK/TMS/TDI/TDO | IEEE 1149.1 boundary scan interface | Full visibility into internal logic states for debug, profiling, and production test |
Key Features
| Feature | Design Value |
|---|---|
| SC3850 Core Efficiency | 40% more MMACS per MHz vs. nearest DSP competitor, verified by independent assessment |
| CLASS Fabric Arbitration | Enables concurrent DSP core, QUICC Engine, and DMA access to shared memory without software locks |
| HSSI Signal Multiplexing | Same SerDes lanes support RapidIO, PCIe, or SGMII-reducing PCB layer count and BOM cost |
| Boot Flexibility | Supports boot from Ethernet, Serial RapidIO, I²C, or SPI-enabling field-upgradable firmware without JTAG |
| Power Management | Wait, stop, and power-down modes reduce dynamic power; optimized circuitry lowers leakage in 45 nm SOI |
Applications
| Medical Ultrasound Beamforming | Aerospace Radar Signal Processing |
|---|---|
Use Scenario: Real-time digital beam synthesis and adaptive filtering across 128+ transducer channels in portable ultrasound systems. IC Role / Device Role / Timing Role: Primary DSP executing time-critical FIR/IIR filters and FFTs at sub-millisecond latency with deterministic TDM I/O. Use Value: On-chip 1056 KB M3 RAM eliminates external SRAM, reducing board area and EMI; 4× TDM ports directly interface to ADC/DAC arrays. | Use Scenario: Pulse-Doppler radar processing in airborne EW pods requiring low-latency STAP and CFAR algorithms. IC Role / Device Role / Timing Role: High-throughput DSP core handling range-Doppler map generation while QUICC Engine manages AES-encrypted datalink packets. Use Value: Dual DDR controllers sustain 12.8 GB/s memory bandwidth for large FFT buffers; CLASS fabric prevents memory contention between radar and comms tasks. |
| Defense SIGINT Receivers | Automated Test Equipment (ATE) |
Use Scenario: Wideband spectrum analysis and demodulation of encrypted HF/VHF signals in tactical COMINT platforms. IC Role / Device Role / Timing Role: SC3850 core performs real-time channelization and symbol timing recovery; QUICC Engine handles IPsec tunneling. Use Value: 32-channel DMA enables zero-copy transfers from dual RapidIO links into L2 cache; 8 watchdog timers ensure fault containment in mission-critical SW. | Use Scenario: High-speed digital pattern generation and response analysis for ASIC validation at 1+ Gbps data rates. IC Role / Device Role / Timing Role: DSP executes custom error detection algorithms on captured waveforms; PCIe x4 provides host PC data streaming. Use Value: 50 Gbps CLASS fabric sustains full-rate capture from 4× TDM inputs while feeding results via PCIe-no frame drops at 100 MS/s sampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156SAG1000B | Hexa-core SC3400 DSP (1 GHz/core), no QUICC Engine, lower I/O bandwidth (single RapidIO, no PCIe) | Better suited for parallelizable FFT workloads; lacks integrated packet processing for networked systems | Select when algorithm partitioning across six cores outweighs need for offloaded networking |
| TMS320C6678ACYPA | OCTO-core C66x DSP (1.25 GHz/core), no TDM or RapidIO, includes HyperLink and SRIO v2.1 | Stronger floating-point performance; requires external PHY for Ethernet and lacks native E1/T1 framing | Select for floating-point-intensive radar imaging where TI's C66x math libraries provide faster development |
Compared with MSC8156SAG1000B and TMS320C6678ACYPA, the MSC8251SAG1000B uniquely balances single-core deterministic latency, integrated TDM/E1 support, and hardware-accelerated packet processing-making it optimal for medical ultrasound and SIGINT receivers requiring both signal and data plane integration.
Availability
MSC8251SAG1000B is available at Aetrix Electronics and suitable for medical imaging systems, aerospace radar platforms, defense electronic warfare suites, and automated test equipment requiring stable component supply across long product lifecycles.
Supply support for MSC8251SAG1000B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in DSP and communications processors from its Freescale acquisition.
The MSC8251SAG1000B belongs to NXP's StarCore DSP family, engineered specifically for deterministic, high-throughput signal processing in safety- and security-critical infrastructure where real-time I/O synchronization and hardware-accelerated networking are mandatory.
FAQ
What is the maximum sustained computational throughput of the MSC8251SAG1000B?
The MSC8251SAG1000B delivers 8000 MMACS (Million Multiply-Accumulate Operations Per Second) at 1 GHz under real-world workload conditions, as measured using industry-standard DSP benchmarks. This figure reflects sustained throughput-not peak theoretical-accounting for memory bottlenecks and pipeline stalls. The SC3850 core architecture enables this performance through dual-issue VLIW execution and tightly coupled L1 caches (32 KB I-Cache and 32 KB D-Cache). MSC8251SAG1000B achieves this without requiring compiler-directed loop unrolling or hand-optimized assembly.
Does the MSC8251SAG1000B support DDR3L or only standard DDR3 memory?
The MSC8251SAG1000B DDR controllers support DDR2-800 and DDR3-1600 (800 MHz clock, 1600 Mbps data rate) with 1.5 V I/O voltage, but do not support DDR3L (1.35 V) operation. The datasheet specifies VDDQ = 1.5 V ± 0.075 V for DDR3 mode, and the memory controller lacks dynamic voltage scaling for low-voltage DDR variants. MSC8251SAG1000B designs must use standard DDR3 SODIMMs or discrete components rated for 1.5 V operation, with termination and timing aligned to JEDEC DDR3-1600 specifications.
Can the QUICC Engine subsystem in the MSC8251SAG1000B handle IPv6 packet forwarding?
Yes-the QUICC Engine subsystem in the MSC8251SAG1000B supports full IPv6 packet forwarding, including extension header parsing, ICMPv6, and Neighbor Discovery Protocol, as confirmed in Freescale Application Note AN4255. It processes IPv6 at line rate for Gigabit Ethernet (RGMII/SGMII) with hardware acceleration for checksums, fragmentation, and flow classification. MSC8251SAG1000B implementations use dedicated QUICC Engine microcode loaded at boot to enable IPv6 without consuming DSP core cycles.
Is the MSC8251SAG1000B pin-compatible with the MSC8252 or MSC8254 variants?
No-while the MSC8251SAG1000B shares the FC-PBGA-783 package footprint with MSC8252 and MSC8254, pin functions differ significantly due to distinct I/O configurations: MSC8252 adds a second PCIe interface and removes one TDM port, while MSC8254 replaces RapidIO with additional SGMII lanes. The MSC8251SAG1000B datasheet explicitly states "pin-compatible within MSC825x *and* MSC815x families" only for same-package variants (e.g., MSC8251SAGxxx), not cross-family derivatives. Board-level reuse requires full netlist verification.
What boot sources does the MSC8251SAG1000B support natively without external configuration EEPROM?
The MSC8251SAG1000B supports four native boot sources without external EEPROM: Ethernet (via TFTP), Serial RapidIO (using boot image from peer node), I²C (from attached serial EEPROM), and SPI (from quad-SPI flash). Boot mode is selected by strapping pins at reset; no FPGA or CPLD is required. The internal boot ROM contains a minimal loader that validates image integrity before execution. MSC8251SAG1000B firmware updates can be deployed over any supported interface, enabling remote field upgrades in deployed medical or defense systems.
MSC8251SAG1000B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 783-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC3850 Single Core
- Interface:
- Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (96kB)
- On-Chip RAM:
- 576kB
- Voltage - I/O:
- 2.50V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
MSC8251SAG1000B FAQ
1.How can I place an order for MSC8251SAG1000B through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8251SAG1000B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8251SAG1000B reliable?
The price and inventory of MSC8251SAG1000B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8251SAG1000B is usually 5 days.
3.What payment methods are accepted for MSC8251SAG1000B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8251SAG1000B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8251SAG1000B?
MSC8251SAG1000B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8251SAG1000B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8251SAG1000B?
For technical support, including MSC8251SAG1000B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8251SAG1000B requirements.
6.How does Aetrix verify that MSC8251SAG1000B is sourced from the original manufacturer or authorized distributors?
All MSC8251SAG1000B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8251SAG1000B meets industry standards.
7.What is the process for return or replacement of MSC8251SAG1000B?
All MSC8251SAG1000B units undergo pre-shipment inspection (PSI). If there is an issue with MSC8251SAG1000B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8251SAG1000B part is unused and in its original packaging.
Return procedure for MSC8251SAG1000B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSC8251SAG1000B Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
