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NXP Semiconductors MSC8252TAG1000B
- Part No.:
- MSC8252TAG1000B
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 783-BBGA, FCBGA
- Datasheet:
-
MSC8252TAG1000B.pdf
- Description:
- IC DSP 2X 1GHZ SC3850 783FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,166
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Product details
Overview
MSC8252TAG1000B from NXP Semiconductors (formerly Freescale) is a dual-core StarCore SC3850 digital signal processor operating at 1 GHz per core, featuring 32 KB L1 instruction and data caches, 512 KB configurable L2 cache, two DDR2/DDR3 controllers supporting up to 2 GB total memory, and integrated QUICC Engine for offloading Gigabit Ethernet processing. It targets high-performance telecom infrastructure baseband processing.
For engineers reviewing the MSC8252TAG1000B datasheet, MSC8252TAG1000B pinout, MSC8252TAG1000B application, or MSC8252TAG1000B equivalent, key selection criteria include dual-DSP throughput, DDR2/DDR3 interface timing compliance, Serial RapidIO 3.125 Gbaud support, TDM channel count, and power sequencing requirements for 45 nm SOI CMOS operation.
Technical Context
The MSC8252TAG1000B implements two independent StarCore SC3850 DSP cores with MMU, EPIC, and ECC/EDC-protected memory subsystems. Its CLASS arbitration fabric enables non-blocking communication between cores, M2/M3 memories, DDR controllers, and high-speed serial interfaces.
It integrates five PLLs-including three global and two Serial RapidIO-specific units-supporting differential clock inputs and precise jitter control. The device uses separate voltage domains (VDD, GVDD1, GVDD2, QVDD, NVDD, SXCVDD1/2, SXPVDD1/2) with defined ramp-up sequencing and dedicated power supply filtering for SerDes and DDR I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual StarCore SC3850 DSP cores, each running at 1 GHz with full MMU and debug support. |
| L1 Cache | 32 KB instruction + 32 KB data per core, enabling deterministic real-time execution. |
| L2 / M2 Memory | 512 KB unified cache configurable in 64 KB increments as on-chip M2 memory. |
| DDR Interface | Two independent controllers supporting DDR2/DDR3 at 400 MHz clock (800 Mbps data rate), 64/32-bit bus, up to 2 GB total capacity across four banks. |
| High-Speed Serial | Two Serial RapidIO 1x/4x ports at 3.125 Gbaud, one PCI Express x4/x2/x1 controller, and two multiplexed SGMII interfaces. |
| TDM Support | Four independent TDM modules, each supporting up to 62.5 Mbps, 2–16-bit word size, and A-law/μ-law conversion for E1/T1 framer interfacing. |
| Process Technology | 45 nm Silicon-on-Insulator (SOI) CMOS, enabling low-power operation with multiple standby modes (Wait, Stop, power-down). |
Pinout & Package
MSC8252TAG1000B is housed in a 783-ball Fine-Pitch Ball Grid Array (FC-PBGA) package measuring 29 mm × 29 mm, with 1.0 mm ball pitch and standard JEDEC thermal and mechanical specifications for high-density BGA routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M1DQ0–M1DQ63, M2DQ0–M2DQ63 | DDR1/DDR2 Data I/O | 64-bit bidirectional data lines per DDR interface with DQS strobes and DM masking for reliable high-speed SDRAM signaling. |
| M1CK0/M1CK2, M2CK0/M2CK2 | DDR Clock Outputs | Differential clock outputs driving DDR memory clocks at up to 400 MHz; require matched trace lengths and AC coupling. |
| SR1_TXD0–SR1_TXD3, SR2_TXD0–SR2_TXD3 | Serial RapidIO Transmitter | LVDS-compatible high-speed serial outputs supporting 3.125 Gbaud; each pair requires controlled impedance and on-die termination. |
| SR1_RXD0–SR1_RXD3, SR2_RXD0–SR2_RXD3 | Serial RapidIO Receiver | Differential LVDS inputs with internal reference biasing; support AC-coupled or DC-coupled configurations per SerDes PLL domain. |
| GE1_TD0–GE1_TD3, GE2_TD0–GE2_TD3 | Gigabit Ethernet TDM/Ethernet I/O | Multi-function pins supporting RGMII/SGMII physical layer signaling or TDM time-slot mapping; share I/O voltage domain NVDD. |
| VDD, GVDD1, GVDD2, QVDD, NVDD, SXCVDD1/2, SXPVDD1/2 | Power Supply Inputs | Eight distinct voltage domains requiring independent regulation, sequencing, and decoupling per datasheet Section 3.1 and Table 2. |
Key Features
| Feature | Design Value |
|---|---|
| Dual SC3850 DSP Cores | Enables parallel baseband processing for multi-carrier wireless standards (e.g., LTE, WiMAX) without inter-core contention via CLASS fabric. |
| QUICC Engine Subsystem | Offloads Gigabit Ethernet packet scheduling and framing from DSP cores, freeing >300 MIPS for signal processing tasks. |
| Four Independent TDM Modules | Supports simultaneous E1/T1 trunk aggregation (up to 256 channels per module) with hardware A-law/μ-law conversion for legacy telecom interface. |
| Class-Level Arbitration & Switching System (CLASS) | Provides deterministic, non-blocking bandwidth allocation among cores, DDR, M3 memory, and serial interfaces-critical for real-time latency guarantees. |
| Boot ROM + Flexible Boot Options | 96 KB on-chip boot ROM plus support for Ethernet, Serial RapidIO, I²C, and SPI boot sources-enabling field firmware recovery and secure remote updates. |
Applications
| Wireless Base Station Baseband Processing | VoIP Media Gateway |
|---|---|
Use Scenario: Real-time modulation/demodulation, channel coding, and MIMO processing for multi-carrier LTE-Advanced base stations. IC Role / Device Role / Timing Role: Primary signal processing engine executing Layer 1 PHY algorithms with sub-100 ns interrupt latency and deterministic DDR access. Use Value: Dual 1 GHz SC3850 cores deliver >3200 MIPS aggregate performance while CLASS arbitration ensures predictable memory bandwidth for concurrent RF and control plane tasks. | Use Scenario: Converting PSTN voice streams to VoIP packets across hundreds of concurrent E1/T1 trunks in carrier-class media gateways. IC Role / Device Role / Timing Role: TDM-to-packet bridge with hardware A-law/μ-law conversion, DMA-accelerated packet assembly, and QUICC Engine-managed Ethernet egress. Use Value: Four TDM modules handle up to 1024 voice channels; integrated DDR controllers buffer packetized voice with zero-copy DMA transfers to Gigabit Ethernet. |
| Small Cell Remote Radio Unit (RRU) | Industrial Protocol Gateway |
Use Scenario: Compact, low-power remote radio unit performing digital pre-distortion (DPD), crest factor reduction (CFR), and CPRI fronthaul processing. IC Role / Device Role / Timing Role: Real-time DSP accelerator with low-latency SerDes interfaces for CPRI over SGMII and DDR3-based DPD coefficient storage. Use Value: 45 nm SOI process enables <2.5 W typical active power; two SGMII links provide 2.5 Gbps fronthaul connectivity with hardware timestamping support. | Use Scenario: Bridging legacy industrial protocols (e.g., T1/E1 teleprotection, HDLC) to modern IP-based SCADA networks in substations. IC Role / Device Role / Timing Role: Deterministic protocol converter using TDM modules for bitstream alignment and QUICC Engine for HDLC frame parsing and TCP/IP encapsulation. Use Value: Hardware timers and virtual interrupts ensure sub-millisecond response to fault signals; ECC/EDC protection guarantees data integrity in electromagnetic harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156TAG1000B | Single SC3400 core (1 GHz), no QUICC Engine, single DDR controller, no Serial RapidIO, smaller 529-ball PBGA package. | Suitable for cost-sensitive, lower-throughput baseband or voice processing where dual-core parallelism and high-speed serial I/O are unnecessary. | Select when system-level performance requirements are ≤1600 MIPS and SerDes/PCIe connectivity is not required. |
| LS1046A | Quad ARM Cortex-A72 application processor (1.6 GHz), no DSP acceleration, integrated DPAA2 for packet processing, DDR4 support, no TDM hardware. | Targets control-plane and packet-forwarding workloads in SD-WAN or edge compute-not real-time signal processing. | Choose for Linux-based control software stacks requiring rich OS support, not for hard real-time DSP algorithm execution. |
Compared with MSC8156TAG1000B and LS1046A, the MSC8252TAG1000B uniquely combines dual StarCore DSPs, hardware TDM, QUICC Engine offload, and Serial RapidIO-making it irreplaceable for telecom baseband and legacy circuit-switched voice gateway designs requiring deterministic low-latency signal processing.
Availability
MSC8252TAG1000B is available at Aetrix Electronics and suitable for wireless infrastructure, VoIP media gateways, and industrial protocol conversion requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MSC8252TAG1000B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets.
The MSC8252TAG1000B belongs to NXP's StarCore DSP family, designed specifically for high-throughput, low-latency baseband and packet-processing applications in telecom infrastructure equipment.
FAQ
What is the maximum DDR3 data rate supported by the MSC8252TAG1000B?
The MSC8252TAG1000B supports DDR3 at a 400 MHz clock frequency, delivering an effective 800 Mbps data rate per pin. This is confirmed in Section 2.6 (AC Timing Characteristics) of the Rev. 8 datasheet, with timing parameters validated for 64-bit wide interfaces across two independent DDR controllers.
Does the MSC8252TAG1000B include on-chip boot ROM, and what boot interfaces does it support?
Yes, the MSC8252TAG1000B includes 96 KB of on-chip boot ROM. It supports multiple boot interfaces including Ethernet, Serial RapidIO, I²C, and SPI-enabling flexible factory programming and field firmware recovery without external flash dependency.
How many Serial RapidIO lanes does the MSC8252TAG1000B support, and at what speed?
The MSC8252TAG1000B supports two independent Serial RapidIO interfaces, each capable of 1x or 4x lane operation at up to 3.125 Gbaud. Each interface includes its own dedicated PLL and DMA units, as specified in the "High-speed serial interface" feature list of the Rev. 8 datasheet.
What is the function of the CLASS subsystem in the MSC8252TAG1000B?
The CLASS (Chip-level arbitration and switching system) in the MSC8252TAG1000B provides full-fabric, non-blocking arbitration between the two SC3850 cores, DDR controllers, M2/M3 memories, and high-speed serial interfaces. It ensures deterministic latency and bandwidth allocation critical for real-time telecom processing.
Is the MSC8252TAG1000B pin-compatible with other members of the MSC82xx family?
No, the MSC8252TAG1000B is not pin-compatible with other MSC82xx devices such as the MSC8254 or MSC8256. Its 783-ball FC-PBGA package, power domain layout (e.g., separate SXCVDD1/2, SXPVDD1/2), and SerDes pin assignments are unique to this variant, as shown in Tables 1–2 and Figure 3 of the Rev. 8 datasheet.
MSC8252TAG1000B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 783-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC3850 Dual Core
- Interface:
- Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (96kB)
- On-Chip RAM:
- 576kB
- Voltage - I/O:
- 2.50V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
MSC8252TAG1000B FAQ
1.How can I place an order for MSC8252TAG1000B through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8252TAG1000B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8252TAG1000B reliable?
The price and inventory of MSC8252TAG1000B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8252TAG1000B is usually 5 days.
3.What payment methods are accepted for MSC8252TAG1000B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8252TAG1000B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8252TAG1000B?
MSC8252TAG1000B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8252TAG1000B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8252TAG1000B?
For technical support, including MSC8252TAG1000B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8252TAG1000B requirements.
6.How does Aetrix verify that MSC8252TAG1000B is sourced from the original manufacturer or authorized distributors?
All MSC8252TAG1000B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8252TAG1000B meets industry standards.
7.What is the process for return or replacement of MSC8252TAG1000B?
All MSC8252TAG1000B units undergo pre-shipment inspection (PSI). If there is an issue with MSC8252TAG1000B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8252TAG1000B part is unused and in its original packaging.
Return procedure for MSC8252TAG1000B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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