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NXP Semiconductors MSC8254TAG1000B
- Part No.:
- MSC8254TAG1000B
- Manufacturer:
- NXP Semiconductors
- Category:
- DSP (Digital Signal Processors)
- Package:
- 783-BBGA, FCBGA
- Datasheet:
-
MSC8254TAG1000B.pdf
- Description:
- IC DSP 4X 1GHZ SC3850 783FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,569
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Product details
Overview
The MSC8254TAG1000B from NXP Semiconductors (formerly Freescale) is a high-performance, four-core StarCore SC3850 DSP SoC targeting medical imaging, aerospace, defense, and advanced test & measurement systems. It integrates four 1 GHz programmable DSP cores, dual DDR2/DDR3 controllers (64-bit, 800 MHz data rate), two Serial RapidIO® interfaces (x1/x4, 3.125 Gbaud), PCI Express® x1/x2/x4, and a dual-RISC QUICC Engine subsystem for offloaded packet processing.
For engineers reviewing the MSC8254TAG1000B datasheet, MSC8254TAG1000B pinout, MSC8254TAG1000B application, or MSC8254TAG1000B equivalent, key selection considerations include its 32,000 MMACS peak performance, FC-PBGA-783 package with 29×29 mm footprint, CLASS fabric arbitration, 1056 KB on-chip M3 memory, and support for boot via Ethernet, Serial RapidIO, I²C, or SPI.
Technical Context
The MSC8254TAG1000B implements a tightly coupled multicore architecture with four independent SC3850 DSP cores-each with 32 KB L1 instruction and 32 KB L1 data cache-and unified 512 KB L2 cache (M2 memory). Its CLASS interconnect fabric manages concurrent access to M2/M3 memory, DDR controllers, and configuration registers across multiple masters including DSP cores and QUICC Engine.
It features a dual-RISC QUICC Engine subsystem operating up to 500 MHz, supporting two Gigabit Ethernet MACs (RGMII/SGMII), and a high-speed serial interface (HSSI) with two x4 SerDes ports enabling flexible multiplexing of Serial RapidIO, PCI Express, and SGMII signals-all while maintaining deterministic latency for real-time signal processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Speed | Four SC3850 DSP cores, each up to 1 GHz (8000 MMACS/core, 32,000 MMACS total) |
| Memory Interface | Dual DDR2/DDR3 controllers, 64/32-bit bus, 800 MHz data rate (400 MHz clock), supports SODIMMs up to 2 GB per controller |
| High-Speed I/O | Two Serial RapidIO® (x1/x4, 3.125 Gbaud), one PCI Express® (x1/x2/x4), two SGMII, two RGMII |
| On-Chip Memory | 1056 KB M3 memory + 512 KB L2 cache (M2), plus 32 KB L1 I-cache and 32 KB L1 D-cache per core |
| Interconnect Fabric | CLASS fabric with arbitration for DSP cores, QUICC Engine, DDR controllers, and configuration registers |
| Process & Package | CMOS 45 nm SOI technology in 29 × 29 mm FC-PBGA-783 package |
| Power Management | Wait, stop, and power-down low-power standby modes with optimized on-die power circuitry |
Pinout & Package
MSC8254TAG1000B is housed in a 783-ball Fine-Pitch Column Grid Array (FC-PBGA) package with 29 mm × 29 mm body size and 1.0 mm ball pitch. Pin functions are defined by ball position and grouped into dedicated banks for DDR, RapidIO/PCIe/SGMII, TDM, QUICC Engine, and core-peripheral interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A12, B1–B12, etc. (DDR bank) | DDR2/DDR3 address/data/control | 64-bit bidirectional data bus, differential clocks, ODT, and command/address lines for high-bandwidth memory access |
| E1–E16, F1–F16 (HSSI bank) | Serial RapidIO / PCIe / SGMII lanes | Multiplexed SerDes transceivers supporting x1/x4 RapidIO, x1/x2/x4 PCIe, or dual SGMII with shared reference clocks |
| G1–G10, H1–H10 (TDM bank) | TDM interface signals | Four independent multi-channel TDM ports, each supporting up to 8 E1/T1 streams with frame sync and clock recovery |
| J1–J8, K1–K8 (QUICC Engine) | RGMII/SGMII/GbE MAC interface | Dual Gigabit Ethernet physical layer interface with configurable RGMII or SGMII signaling |
| L1–L6, M1–M6 (JTAG/Debug) | JTAG Test Access Port | IEEE 1149.1-compliant boundary scan for debug, profiling, and production test |
Key Features
| Feature | Design Value |
|---|---|
| Four SC3850 DSP cores | Delivers 32,000 MMACS peak performance with 40% higher efficiency per MHz than competing DSPs |
| CLASS interconnect fabric | Enables concurrent, low-latency access to shared memory and peripherals without software arbitration overhead |
| Dual DDR2/DDR3 controllers | Supports up to 4 GB system memory with 50 Gbps aggregate bandwidth across two 64-bit buses |
| QUICC Engine subsystem | Offloads packet processing at up to 500 MHz, freeing DSP cores for algorithm-intensive tasks |
| HSSI with signal multiplexing | Reduces PCB layer count by sharing SerDes resources across RapidIO, PCIe, and SGMII protocols |
Applications
| Medical Imaging Systems | Aerospace Avionics |
|---|---|
Use Scenario: Real-time beamforming and image reconstruction in ultrasound and MRI systems requiring deterministic latency and high parallel throughput. IC Role / Device Role / Timing Role: Primary signal processing SoC executing time-critical DSP algorithms across four synchronized cores with hardware-accelerated memory access. Use Value: Enables sub-millisecond processing cycles and integration of >1024-channel sensor data without external co-processors. | Use Scenario: Radar signal processing and electronic warfare (EW) jamming waveform generation in airborne platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: Multicore DSP engine performing pulse compression, Doppler filtering, and adaptive beam steering using dedicated TDM and RapidIO interfaces. Use Value: Achieves 32,000 MMACS within 29×29 mm footprint while meeting DO-254 design assurance requirements via JTAG traceability. |
| Defense Communications | Advanced Test Equipment |
Use Scenario: Secure, high-throughput satellite communications modems handling multiple waveforms (e.g., MIL-STD-188-110, Link 16) simultaneously. IC Role / Device Role / Timing Role: Baseband processor managing channel coding, modulation/demodulation, and encryption/decryption across four cores with QUICC Engine handling protocol stack offload. Use Value: Supports >1 Gbps encrypted throughput with deterministic jitter control via CLASS fabric and dual DDR bandwidth. | Use Scenario: High-resolution arbitrary waveform generators and spectrum analyzers requiring real-time FFT, filtering, and pattern recognition. IC Role / Device Role / Timing Role: Core computation engine executing multi-stage digital downconversion (DDC), windowed FFT, and statistical analysis with low-latency DMA transfers. Use Value: Delivers 128k-point FFT in <50 µs using L2 cache and pipelined SC3850 execution units, reducing instrument measurement cycle time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSC8156TAG1000B | Same SC3850 core architecture but dual-core (16,000 MMACS), single DDR controller, no PCIe, reduced TDM count (2 vs. 4) | Targeted at cost-sensitive radar front-ends and mid-tier comms where full MSC8254TAG1000B bandwidth is unnecessary | Select when system-level throughput requirements fall below 25 Gbps and PCIe connectivity is not required |
| LS1046ASE8MQB | ARM Cortex-A72 quad-core (not DSP-optimized), no CLASS fabric, no TDM, lacks QUICC Engine, uses DDR4 instead of DDR2/3 | Suitable for Linux-based network appliances and control-plane processing-not for real-time signal processing or legacy TDM infrastructure | Choose only for non-DSP workloads involving packet forwarding, virtualization, or general-purpose embedded OS deployment |
Compared with MSC8156TAG1000B and LS1046ASE8MQB, the MSC8254TAG1000B uniquely delivers deterministic DSP performance with integrated TDM, RapidIO, and QUICC Engine-making it irreplaceable for latency-critical, multi-protocol signal processing in regulated domains like defense and medical imaging.
Availability
MSC8254TAG1000B is available at Aetrix Electronics and suitable for medical imaging systems, aerospace avionics, defense communications equipment, and advanced test & measurement instruments requiring stable component supply across extended product lifecycles.
Supply support for MSC8254TAG1000B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and communication infrastructure markets.
The MSC8254TAG1000B belongs to NXP's StarCore DSP portfolio, engineered specifically for deterministic, high-throughput signal processing in safety- and mission-critical applications where real-time latency, multi-protocol I/O, and radiation-tolerant design margins matter.
FAQ
What is the maximum operating frequency of the MSC8254TAG1000B DSP cores?
The MSC8254TAG1000B features four SC3850 DSP cores, each capable of operating at up to 1 GHz. This frequency enables 8000 MMACS per core and a total device performance of 32,000 MMACS. The core speed is validated under specified thermal and voltage conditions per the MSC8254FS datasheet, and actual sustained frequency depends on board-level thermal design and power delivery stability.
Does the MSC8254TAG1000B support DDR3 memory, and what are the interface specifications?
Yes, the MSC8254TAG1000B supports both DDR2 and DDR3 SDRAM via two independent controllers. Each controller provides a 32-bit or 64-bit data bus running at up to 800 MHz data rate (400 MHz clock), supporting SODIMMs and up to 2 GB per controller. The interface complies with JEDEC DDR2/DDR3 standards and includes on-die termination and programmable timing parameters.
Is the MSC8254TAG1000B pin-compatible with other devices in the MSC825x family?
Yes, the MSC8254TAG1000B is explicitly designed for pin compatibility with all MSC825x and MSC815x DSP devices. This allows scalable migration across performance tiers-e.g., from dual-core MSC8156 to quad-core MSC8254-without PCB redesign. Ball mapping, power domains, and critical interface assignments remain consistent across the compatible family.
What boot options does the MSC8254TAG1000B support?
The MSC8254TAG1000B supports multiple boot sources including Ethernet, Serial RapidIO, I²C, and SPI. Boot mode is selected via strapping pins at power-on reset. The internal boot ROM initializes the device and loads firmware from the chosen interface, enabling flexible field updates and secure remote provisioning in deployed systems.
What development tools are officially supported for the MSC8254TAG1000B?
NXP provides the CodeWarrior DSP Development Studio for MSC8254TAG1000B, including an Eclipse-based IDE, C/C++ compiler with inline assembly, multicore debugger, royalty-free RTOS, profiler, and software simulator. Hardware evaluation is supported via the MSC8156ADS development board and MSC8156EVM, both compatible with MSC8254TAG1000B due to pin and register-level compatibility.
MSC8254TAG1000B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- StarCore
- Package/Case:
- 783-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- SC3850 Quad Core
- Interface:
- Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (96kB)
- On-Chip RAM:
- 576kB
- Voltage - I/O:
- 2.50V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 783-FCPBGA (29x29)
MSC8254TAG1000B FAQ
1.How can I place an order for MSC8254TAG1000B through Aetrix?
Please submit a Request for Quotation (RFQ) for MSC8254TAG1000B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSC8254TAG1000B reliable?
The price and inventory of MSC8254TAG1000B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSC8254TAG1000B is usually 5 days.
3.What payment methods are accepted for MSC8254TAG1000B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSC8254TAG1000B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSC8254TAG1000B?
MSC8254TAG1000B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSC8254TAG1000B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSC8254TAG1000B?
For technical support, including MSC8254TAG1000B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSC8254TAG1000B requirements.
6.How does Aetrix verify that MSC8254TAG1000B is sourced from the original manufacturer or authorized distributors?
All MSC8254TAG1000B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSC8254TAG1000B meets industry standards.
7.What is the process for return or replacement of MSC8254TAG1000B?
All MSC8254TAG1000B units undergo pre-shipment inspection (PSI). If there is an issue with MSC8254TAG1000B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSC8254TAG1000B part is unused and in its original packaging.
Return procedure for MSC8254TAG1000B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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