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Texas Instruments MSP430F1610IRTDR

Part No.:
MSP430F1610IRTDR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F1610IRTDR.pdf
Description:
IC MCU 16BIT 32KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,966

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Product details

Overview

MSP430F1610IRTDR from Texas Instruments is an ultralow-power 16-bit mixed-signal microcontroller featuring 32KB+256B flash memory, 5KB RAM, dual 12-bit DACs, a 12-bit ADC with internal reference and autoscan, two 16-bit timers (Timer_A3 and Timer_B7), three-channel DMA, and dual USARTs supporting UART/SPI/I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and portable instrumentation.

For engineers reviewing the MSP430F1610IRTDR datasheet, MSP430F1610IRTDR pinout, MSP430F1610IRTDR application, or MSP430F1610IRTDR equivalent, key selection criteria include its 5KB RAM for large C-stack applications, 64-pin QFN (RTD) package with 48 I/O pins, extended RAM addressing capability, and dual-serial interface support for multi-protocol connectivity in space-constrained designs.

Technical Context

The MSP430F1610IRTDR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and high code efficiency. Its architecture integrates a digitally controlled oscillator (DCO) that supports wake-up from LPM4 in under 6 μs, and supports five low-power modes optimized for extended battery life in portable measurement systems.

It features two independent USART modules: USART0 supports UART, SPI, and I²C modes; USART1 supports UART and SPI only. The device includes a hardware multiplier (MPY/MPYS/MAC/MACS), SVS with programmable level detection, brownout detection, and JTAG-based debugging via Embedded Emulation Module (EEM).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture 16-bit RISC CPU with 16 general-purpose registers and constant generators; enables efficient C compilation and deterministic real-time execution.
Flash Memory 32KB main + 256B information memory; supports in-system programming via JTAG or BSL, enabling field firmware updates without external voltage.
RAM 5KB total (3KB extended + 2KB mirrored); supports large data buffers and deep C-call stacks for complex sensor fusion or communication protocols.
ADC 12-bit SAR ADC with 8 channels, internal reference, sample-and-hold, and autoscan; achieves <10 μs conversion time for high-speed analog monitoring.
DAC Dual 12-bit voltage-output DACs (DAC0/DAC1) with synchronization; enables precise analog waveform generation or bias control in closed-loop systems.
Timers Timer_A3 (3 capture/compare registers) and Timer_B7 (7 capture/compare-with-shadow registers); supports PWM, input capture, quadrature decoding, and synchronized multi-channel timing.
Power Modes Active mode (330 μA @ 1 MHz, 2.2 V), LPM4 (0.2 μA RAM retention); five software-selectable low-power modes with sub-6-μs wake-up latency.

Pinout & Package

Package: 64-pin QFN (RTD), 9 mm × 9 mm, 0.5 mm pitch, exposed thermal pad connected to DVSS.

Pin/Terminal Circuit Role Design Meaning
RST/NMI Reset / Nonmaskable Interrupt Input Active-low reset initiation and NMI event handling; also triggers bootstrap loader when held during power-up.
P1.0/TACLK Timer_A Clock Input External clock source for Timer_A; enables precise timing independent of system clocks.
P2.6/ADC12CLK/DMAE0 ADC Conversion Clock / DMA Trigger Configurable clock source for ADC12; also serves as external trigger for DMA channel 0, enabling autonomous analog-to-memory transfers.
P3.1/SIMO0/SDA USART0 SPI MOSI / I²C Data Shared function pin: SPI master-out/slave-in or I²C bidirectional data line; supports multi-protocol peripheral interfacing on same pin.
P3.3/UCLK0/SCL USART0 SPI Clock / I²C Clock Shared function pin: SPI clock output or I²C serial clock; allows flexible protocol selection without PCB redesign.
P5.7/TBOUTH/SVSOUT Timer_B Output High-Z Control / SVS Output Drives all Timer_B PWM outputs to high-impedance state; also outputs SVS comparator result for system-level fault signaling.
P6.6/A6/DAC0 Analog Input / DAC0 Output Configurable as ADC input channel A6 or DAC0 voltage output; enables shared analog resource usage in mixed-signal signal chains.
P6.7/A7/DAC1/SVSIN Analog Input / DAC1 Output / SVS Input Triple-function pin: ADC input A7, DAC1 output, or SVS reference input; supports integrated analog monitoring and control with minimal pin count.

Key Features

Feature Design Value
Dual USART with Protocol Flexibility USART0 supports UART/SPI/I²C; USART1 supports UART/SPI - enables concurrent communication with diverse peripherals (e.g., I²C sensors + UART host) without external logic.
Extended RAM Addressing 5KB RAM with 3KB extended and 2KB mirrored regions - eliminates bank-switching overhead in C-based applications requiring large local variables or heap allocation.
Hardware Multiplier MPY/MPYS/MAC/MACS instructions execute in one cycle - accelerates math-intensive tasks like FFT, PID control, or sensor calibration without consuming CPU cycles.
Integrated Analog Subsystem 12-bit ADC + dual 12-bit DACs + comparator + internal reference - supports closed-loop analog control (e.g., current regulation, voltage trimming) using only one IC.
Ultrafast Low-Power Wake-Up Wake from LPM4 to active mode in <6 μs - meets stringent real-time response requirements in duty-cycled sensor nodes while preserving energy efficiency.
Secure Flash Programming Bootstrap loader with user-defined password protection and security fuse - prevents unauthorized firmware access or reverse engineering in deployed devices.

Applications

Portable Gas Sensor Node Industrial Temperature Controller

Use Scenario: Battery-powered handheld gas detector with electrochemical sensor, OLED display, and Bluetooth LE interface.

IC Role / Device Role / Timing Role: Central controller managing sensor excitation, 12-bit ADC sampling, DAC-based reference biasing, and dual USART communication (UART to BLE module, SPI to display driver).

Use Value: 5KB RAM accommodates real-time gas concentration algorithms and BLE stack; ultralow standby current (1.1 μA) extends battery life to >2 years on coin cell.

Use Scenario: DIN-rail mounted temperature regulator using RTD/thermistor inputs, 4–20 mA output, and HART communication.

IC Role / Device Role / Timing Role: Mixed-signal controller performing precision RTD resistance measurement (12-bit ADC + internal ref), PID computation (hardware multiplier), and 4–20 mA loop control (dual DAC + comparator).

Use Value: Dual 12-bit DACs generate precise current-setting voltage; Timer_B7 provides synchronized PWM for isolated DC-DC converter driving the 4–20 mA loop.

Smart Water Meter Interface Medical Pulse Oximeter Front-End

Use Scenario: Ultrasonic water meter with flow calculation, tamper detection, and NB-IoT modem interface.

IC Role / Device Role / Timing Role: Primary MCU acquiring ultrasonic transit-time measurements (ADC), computing flow rate (hardware multiplier), and managing NB-IoT modem via USART1 (UART) and display via USART0 (SPI).

Use Value: Three-channel DMA autonomously transfers ADC samples to RAM while CPU sleeps; wake-up on timer interrupt ensures accurate 1-second flow integration intervals.

Use Scenario: Wearable pulse oximeter with red/IR LED drivers, photodiode amplifier, and Bluetooth HCI interface.

IC Role / Device Role / Timing Role: Analog front-end controller synchronizing LED drive (Timer_A PWM), photodiode signal acquisition (ADC with autoscan), and ambient light rejection (comparator + DAC feedback).

Use Value: Dual DACs generate matched reference voltages for transimpedance amplifier offset cancellation; 12-bit ADC autoscan sequences across multiple gain stages for dynamic range optimization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixed-signal microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430F1611IRTDR 48KB flash, 10KB RAM, identical peripherals and pinout Better suited for applications requiring larger firmware image or deeper data logging buffers Select when firmware size exceeds 32KB or RAM demand exceeds 5KB; no hardware change required.
MSP430F169IPM 60KB flash, 2KB RAM, 64-pin QFP (PM), lacks extended RAM addressing Higher code density needed, but lower RAM requirement and board-level preference for QFP assembly Choose for legacy QFP-based designs or where flash capacity is critical but RAM needs are ≤2KB; requires PCB layout change.

Compared with MSP430F1610IRTDR, the MSP430F1611IRTDR offers double the RAM for data-intensive tasks without altering footprint, while the MSP430F169IPM trades RAM flexibility for maximum flash capacity in through-hole-compatible packaging - enabling scalable firmware development across product tiers.

Availability

MSP430F1610IRTDR is available at Aetrix Electronics and suitable for portable instrumentation, industrial process monitoring, and medical wearable designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant QFN packaging.

Supply support for MSP430F1610IRTDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of expertise in low-power microcontroller innovation.

The MSP430F161x product line was designed specifically for ultralow-power mixed-signal applications demanding high analog integration, extended battery life, and deterministic real-time performance - especially in sensor-based portable and industrial systems.

FAQ

What is the maximum operating frequency of the MSP430F1610IRTDR?

The MSP430F1610IRTDR does not specify a maximum system clock frequency in its datasheet; instead, it guarantees full functionality across its 1.8 V to 3.6 V supply range with a 125-ns instruction cycle time - implying reliable operation up to at least 8 MHz. Actual achievable frequency depends on supply voltage and temperature, and the DCO can be calibrated to meet application-specific timing requirements without external crystal dependency. The MSP430F1610IRTDR supports both internal DCO and external crystals (XT1/XT2) for clock sources.

Does the MSP430F1610IRTDR support I²C communication?

Yes, the MSP430F1610IRTDR supports I²C communication exclusively through USART0, which can be configured in I²C mode using pins P3.1 (SDA) and P3.3 (SCL). USART1 does not support I²C. The I²C interface includes standard start/stop condition generation, address matching, and interrupt-driven data transfer - confirmed in the functional block diagram and terminal functions table for MSP430F161x devices. This capability enables direct connection to I²C sensors and EEPROMs without external level shifters.

How many I/O pins does the MSP430F1610IRTDR provide?

The MSP430F1610IRTDR provides 48 general-purpose I/O pins across Ports P1–P6, as explicitly stated in the device description and confirmed by the pin designation diagrams for MSP430F161x. All 48 pins support interrupt capability, and most are multiplexed with peripheral functions including ADC inputs, timer capture/compare, USART signals, and DAC outputs. The 64-pin QFN (RTD) package allocates dedicated power, ground, crystal, and JTAG pins outside this I/O count.

What is the purpose of the extended RAM addressing feature in the MSP430F1610IRTDR?

The extended RAM addressing in the MSP430F1610IRTDR provides 3KB of non-mirrored RAM space (01900h–024FFh) in addition to 2KB of mirrored RAM (01100h–018FFh), enabling flat memory access for large data structures without bank switching. This design eliminates software overhead in C applications requiring >2KB of contiguous RAM - such as buffering multiple ADC channels, implementing TCP/IP stacks, or storing calibration tables. The MSP430F1610IRTDR's 5KB total RAM is explicitly allocated across these regions in the memory organization table.

Can the MSP430F1610IRTDR perform simultaneous ADC and DAC operations?

Yes, the MSP430F1610IRTDR supports concurrent ADC and DAC operation: its 12-bit ADC and dual 12-bit DACs operate independently and can be triggered synchronously via Timer_B or asynchronously via software. The ADC12CLK pin (P2.6) can serve as a DMA trigger, allowing automatic data transfer from ADC results to memory while DAC outputs are updated via separate registers - enabling real-time closed-loop control loops without CPU intervention. This capability is documented in the functional block diagram and terminal functions table.

MSP430F1610IRTDR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430x1xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
32KB (32K x 8 + 256B)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
5K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F1610IRTDR FAQ

1.How can I place an order for MSP430F1610IRTDR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F1610IRTDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F1610IRTDR reliable?

The price and inventory of MSP430F1610IRTDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F1610IRTDR is usually 5 days.

3.What payment methods are accepted for MSP430F1610IRTDR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F1610IRTDR transactions.

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4.How is shipping managed for MSP430F1610IRTDR?

MSP430F1610IRTDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F1610IRTDR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F1610IRTDR?

For technical support, including MSP430F1610IRTDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F1610IRTDR requirements.

6.How does Aetrix verify that MSP430F1610IRTDR is sourced from the original manufacturer or authorized distributors?

All MSP430F1610IRTDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F1610IRTDR meets industry standards.

7.What is the process for return or replacement of MSP430F1610IRTDR?

All MSP430F1610IRTDR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F1610IRTDR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F1610IRTDR part is unused and in its original packaging.

Return procedure for MSP430F1610IRTDR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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