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Texas Instruments MSP430F2013QRSATEP
- Part No.:
- MSP430F2013QRSATEP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 16-VQFN Exposed Pad
- Datasheet:
-
MSP430F2013QRSATEP.pdf
- Description:
- IC MCU 16BIT 2KB FLASH 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:208
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Product details
Overview
MSP430F2013QRSATEP from Texas Instruments is an ultra-low-power mixed-signal microcontroller featuring a 16-bit RISC CPU, 2KB flash + 256B information memory, 128B RAM, integrated 16-bit sigma-delta ADC with differential PGA inputs and internal reference, Universal Serial Interface (USI) supporting SPI/I²C, and Timer_A with two capture/compare registers. It operates from 1.8 V to 3.6 V and targets battery-powered sensor front ends and standalone RF sensing nodes.
For engineers reviewing the MSP430F2013QRSATEP datasheet, MSP430F2013QRSATEP pinout, MSP430F2013QRSATEP application, or MSP430F2013QRSATEP equivalent, key selection criteria include its extended temperature range (–40°C to 125°C), radiation-tolerant EP-grade qualification, Spy-Bi-Wire debug interface, ultra-low standby current (0.5 µA), and QFN-16 package with analog/digital supply separation (DVCC/AVCC, DVSS/AVSS).
Technical Context
The MSP430F2013QRSATEP implements a digitally controlled oscillator (DCO) with factory-calibrated frequencies up to 16 MHz (±1%), enabling sub-1 µs wake-up from LPM4. Its basic clock module supports ACLK from 32-kHz crystal or internal VLO, MCLK for CPU, and SMCLK for peripherals - all configurable via BCSCTL1/2/3 and DCOCTL registers.
Peripherals are memory-mapped and fully accessible via standard 16-bit instructions: SD16_A uses dedicated control registers (SD16CTL, SD16CCTL0) and conversion memory (SD16MEM0); USI operates in synchronous mode with programmable clock polarity/phase; Timer_A2 provides dual CCRs with interrupt-capable capture/compare and PWM generation on P1.0–P1.6 pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generators; 62.5-ns instruction cycle at 16 MHz |
| Memory | 2KB main flash + 256B information flash + 128B RAM; supports in-system programming via Spy-Bi-Wire |
| ADC | 16-bit sigma-delta SD16_A with differential PGA inputs, internal 1.2-V reference, and up to 105°C characterization |
| Low-Power Modes | Five software-selectable modes; LPM4 draws 0.1 µA (RAM retention) and wakes in <1 µs via DCO |
| Operating Voltage | 1.8 V to 3.6 V supply range; flash programming requires ≥2.2 V |
| Temperature Range | –40°C to +125°C extended operating range; qualified for defense/aerospace/medical applications |
| Clock Sources | Internal DCO (calibrated at 1/8/12/16 MHz), 32-kHz crystal (XIN/XOUT), internal VLO, and external digital clock |
Pinout & Package
Package: 16-pin QFN (RSA), 4 mm × 4 mm, exposed thermal pad (connected to DVSS). Pinout validated per TI SLAS774A datasheet Figure 1 and Table 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TACLK/ACLK/A0+ | Timer_A clock input / ACLK output / ADC channel 0 positive input | Enables timer synchronization to external signal or crystal; provides analog input path with programmable gain |
| P1.1/TA0/A0−/A4+ | Timer_A capture/compare 0 / ADC A0 negative / A4 positive input | Supports differential measurement on A0 or single-ended on A4; TA0 output drives external circuitry |
| P1.2/TA1/A1+/A4− | Timer_A capture/compare 1 / ADC A1 positive / A4 negative input | Enables second differential pair or complementary A4 channel; TA1 output usable for PWM or timing signals |
| P1.3/VREF/A1− | Reference voltage input/output / ADC A1 negative input | Accepts external reference or outputs internal 1.2-V reference; completes A1 differential pair |
| RST/NMI/SBWTDIO | Reset/non-maskable interrupt / Spy-Bi-Wire data I/O | Single-pin debug interface for programming and emulation; NMI triggers on rising edge independent of GIE |
| TEST/SBWTCK | Spy-Bi-Wire test clock input | Dedicated clock for JTAG/SBW programming; tied high during normal operation to disable test mode |
| DVCC / AVCC | Digital and analog power supplies | Separate 1.8–3.6 V rails reduce noise coupling; AVCC must be ≥ DVCC and filtered for ADC accuracy |
| DVSS / AVSS | Digital and analog ground references | Independent ground planes required; QFN thermal pad must connect to DVSS for thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Brownout detector | Integrated POR/BOR circuit ensures reliable reset across full 1.8–3.6 V range; no external components needed |
| On-chip emulation logic | Spy-Bi-Wire interface enables full-speed debugging and flash programming using only RST and TEST pins |
| Ultra-low power consumption | Active mode: 220 µA at 1 MHz/2.2 V; LPM3 (VLO): 0.5 µA; LPM4 (RAM retention): 0.1 µA |
| Programmable code protection | Security fuse prevents unauthorized readout of flash contents; blown permanently via JTAG command |
| Factory-calibrated DCO | Four DCO frequencies (1/8/12/16 MHz) calibrated to ±1% at 25°C; stored in flash segment A for runtime loading |
| Extended product lifecycle | Controlled baseline, single assembly/test/fab site, extended PCN support, and full traceability per MIL-PRF-38535 Class V |
Applications
| Wireless Sensor Node Front End | Harsh-Environment Data Logger |
|---|---|
Use Scenario: Standalone RF sensor node capturing temperature, pressure, or strain in oil/gas downhole tools or aerospace avionics bays. IC Role / Device Role / Timing Role: Primary controller executing sensor acquisition, sigma-delta ADC conversion, USI-based SPI communication with RF transceiver, and low-power state management. Use Value: Sub-1 µs wake-up and 0.1 µA LPM4 current extend battery life to years; 125°C rating enables operation without active cooling. |
Use Scenario: Embedded environmental monitor in military vehicle ECUs or satellite subsystems requiring long-term unattended logging. IC Role / Device Role / Timing Role: Time-triggered data acquisition engine using Timer_A interrupts, SD16_A for precision analog reads, and flash storage of timestamped samples. Use Value: Factory-trimmed DCO eliminates need for external crystal; brownout detection ensures integrity during voltage sags in mobile platforms. |
| Medical Implantable Sensor Interface | Defense-Grade Battery Management Unit |
Use Scenario: Miniaturized physiological sensor (e.g., glucose or ECG) where size, power, and reliability are critical. IC Role / Device Role / Timing Role: Analog front-end processor handling differential biopotential inputs, PGA gain control, and low-noise 16-bit conversion before wireless transmission. Use Value: Differential SD16_A architecture rejects common-mode noise; separate AVCC/AVSS minimizes digital switching interference. |
Use Scenario: Cell voltage monitoring and balancing control in tactical battery packs exposed to extreme thermal cycling. IC Role / Device Role / Timing Role: Precision ADC supervisor measuring cell voltages via multiplexed A/D channels, triggering alerts via USI-I²C to host MCU. Use Value: Extended –40°C to 125°C operation covers full military spec range; radiation-hardened EP process ensures latch-up immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2003QRSATEP | Same package and core, but 1KB flash, no SD16_A ADC - only 16-bit timer and USI | Lacks integrated sigma-delta ADC; suitable only for digital-only sensing or protocol bridging | Select when analog acquisition is handled externally or not required; lower cost but no on-chip precision conversion |
| MSP430FR2033IPWTR | Ferroelectric RAM (FRAM) instead of flash; 2KB FRAM + 1KB RAM; same peripherals including SD16_A and USI | Superior write endurance (>10¹⁴ cycles) and faster write speed; no erase latency or wear leveling needed | Prefer for high-frequency data logging or firmware updates in field-deployed systems; not radiation-hardened or EP-qualified |
Compared with MSP430F2013QRSATEP, the F2003QRSATEP omits the sigma-delta ADC and reduces flash, limiting analog integration; the FR2033IPWTR replaces flash with FRAM for endurance and speed but lacks defense-grade qualification and extended temperature certification.
Availability
MSP430F2013QRSATEP is available at Aetrix Electronics and suitable for defense electronics, aerospace telemetry systems, and medical implantable devices requiring stable component supply across extended temperature and lifecycle requirements.
Supply support for MSP430F2013QRSATEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in high-reliability electronics.
The MSP430F2013QRSATEP belongs to TI's MSP430x2xx ultra-low-power microcontroller family, designed specifically for energy-constrained, mission-critical applications in defense, aerospace, and medical systems where extended temperature operation and radiation tolerance are mandatory.
FAQ
What is the maximum operating frequency of the MSP430F2013QRSATEP?
The MSP430F2013QRSATEP supports a maximum MCLK frequency of 16 MHz at VCC ≥3.3 V, with factory-calibrated DCO settings for 1 MHz, 8 MHz, 12 MHz, and 16 MHz. At 1.8 V, the maximum guaranteed frequency is 6 MHz. All timing specifications assume 50% ±10% duty cycle and proper clock configuration via BCSCTL and DCOCTL registers. The MSP430F2013QRSATEP achieves this performance while maintaining ultra-low active-mode current of 220 µA at 1 MHz and 2.2 V.
Does the MSP430F2013QRSATEP include an integrated analog-to-digital converter?
Yes, the MSP430F2013QRSATEP integrates a 16-bit sigma-delta SD16_A ADC with differential programmable-gain amplifier (PGA) inputs, internal 1.2-V reference, and support for up to four analog input channels (A0–A4). The ADC is characterized for performance up to 105°C and supports both single-ended and differential acquisition modes. This capability is confirmed in the device's functional block diagram and electrical characteristics tables in TI SLAS774A, making the MSP430F2013QRSATEP suitable for precision sensor interfacing without external ADC components.
What debug interface does the MSP430F2013QRSATEP support?
The MSP430F2013QRSATEP supports Spy-Bi-Wire (SBW), a two-wire JTAG variant using RST/NMI/SBWTDIO and TEST/SBWTCK pins for programming, emulation, and real-time debugging. It does not support full 4-wire JTAG. SBW enables full-speed execution control, register inspection, and flash memory access without requiring additional pins beyond the reset and test lines. This interface is documented in Section 1.3 of the SLAS774A datasheet and is fully compatible with TI's MSP-FET and LaunchPad development tools for the MSP430F2013QRSATEP.
Is the MSP430F2013QRSATEP qualified for extended temperature operation?
Yes, the MSP430F2013QRSATEP is explicitly rated for operation from –40°C to +125°C and is designated as an Enhanced Product (EP) device. It meets MIL-PRF-38535 Class V requirements, including controlled baseline, single fabrication/assembly/test site, extended product life cycle, and full traceability. The datasheet specifies that crystal oscillator operation is limited to ≤105°C, but all other functions - including flash programming, ADC operation, and low-power modes - are fully characterized across the full –40°C to 125°C range for the MSP430F2013QRSATEP.
What package type and pin count does the MSP430F2013QRSATEP use?
The MSP430F2013QRSATEP uses a 16-pin QFN package (RSA footprint), measuring 4 mm × 4 mm with an exposed thermal pad. This package is confirmed in TI's SLAS774A datasheet Table 1 (Ordering Information) and Figure 1 (Pinout). The RSA package supports fine-pitch PCB layout, efficient thermal dissipation via the bottom pad (to be connected to DVSS), and compatibility with automated SMT assembly. No alternate packages (e.g., SOIC or TSSOP) are offered for the MSP430F2013QRSATEP variant.
MSP430F2013QRSATEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 16-VQFN Exposed Pad
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SPI
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 10
- Program Memory Size:
- 2KB (2K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x16b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2013QRSATEP FAQ
1.How can I place an order for MSP430F2013QRSATEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2013QRSATEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2013QRSATEP reliable?
The price and inventory of MSP430F2013QRSATEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2013QRSATEP is usually 5 days.
3.What payment methods are accepted for MSP430F2013QRSATEP?
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4.How is shipping managed for MSP430F2013QRSATEP?
MSP430F2013QRSATEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2013QRSATEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2013QRSATEP?
For technical support, including MSP430F2013QRSATEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2013QRSATEP requirements.
6.How does Aetrix verify that MSP430F2013QRSATEP is sourced from the original manufacturer or authorized distributors?
All MSP430F2013QRSATEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2013QRSATEP meets industry standards.
7.What is the process for return or replacement of MSP430F2013QRSATEP?
All MSP430F2013QRSATEP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2013QRSATEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2013QRSATEP part is unused and in its original packaging.
Return procedure for MSP430F2013QRSATEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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