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Texas Instruments MSP430F2232TDAR

Part No.:
MSP430F2232TDAR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
38-TSSOP (0.240", 6.10mm Width)
Datasheet:
AetrixMSP430F2232TDAR.pdf
Description:
IC MCU 16BIT 8KB FLASH 38TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,283

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Product details

Overview

MSP430F2232TDAR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 8KB Flash, 512B RAM, 10-bit ADC with 12-channel analog input, two 16-bit timers (Timer_A and Timer_B), and USCI modules supporting UART, SPI, and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensor nodes and portable measurement systems.

For engineers reviewing the MSP430F2232TDAR datasheet, MSP430F2232TDAR pinout, MSP430F2232TDAR application, or MSP430F2232TDAR equivalent, key selection considerations include its 38-pin TSSOP (DA) package, -40°C to 105°C temperature grade, integrated brownout detector, sub-1 µs wake-up time from standby mode, and absence of operational amplifiers (distinguishing it from the F22x4 series).

Technical Context

The MSP430F2232TDAR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations. Its basic clock system includes DCO with four factory-calibrated frequencies (±1%), internal VLO, and support for external 32-kHz crystal or HF crystal up to 16 MHz.

It integrates USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), a 10-bit ADC10 with internal reference, sample-and-hold, autoscan, and data transfer controller (DTC), plus full JTAG/Spy-Bi-Wire debug interface with on-chip emulation module (EEM) and bootstrap loader (BSL).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture16-bit RISC CPU with 16 registers and 62.5-ns instruction cycle at 16 MHz
Memory8KB + 256B Flash program memory and 512B RAM - supports in-system programming without external voltage
ADC10-bit, 200-ksps SAR ADC with 12 analog inputs, internal reference, autoscan, and DTC for autonomous data movement
Power Consumption270 µA active at 1 MHz/2.2 V; 0.7 µA standby; 0.1 µA off-mode with RAM retention
Operating Voltage1.8 V to 3.6 V - enables direct use with single-cell Li-ion or dual-cell alkaline batteries
Temperature Range-40°C to +105°C - qualified for extended industrial and automotive under-hood applications
Wake-up Time<1 µs from LPM4 to active mode - critical for duty-cycled sensor wake-on-event designs

Pinout & Package

Package: 38-pin Thin Shrink Small-Outline Package (TSSOP), suffix "DA", body size 9.7 mm × 4.4 mm, pitch 0.65 mm. RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.

Pin/Terminal Circuit Role Design Meaning
RST/NMI/SBWTDIO (Pin 6)Reset / Non-maskable interrupt / Spy-Bi-Wire data I/OPrimary debug and programming interface; dual-function pin requiring pull-up for reliable reset assertion
TEST/SBWTCK (Pin 1)Spy-Bi-Wire test clock inputEnables low-pin-count debugging and programming; must be driven externally during flash programming
P1.0/TACLK/ADC10CLK (Pin 31)Timer_A clock input / ADC conversion clockAllows synchronous sampling triggered by timer events; supports precise timing-critical acquisition
P2.0/ACLK/A0 (Pin 8)ACLK output / Analog input channel 0Provides low-frequency clock source for RTC or watchdog while serving as first ADC channel
XIN/P2.6 (Pin 6)Crystal oscillator input / General I/OSupports 32-kHz watch crystal for real-time clock or HF crystal up to 16 MHz for system clock
AVCC / AVSS (Pins 23 / 22)Analog power supply / Analog groundSeparate analog domain ensures clean reference for ADC and internal voltage references
P3.4/UCA0TXD/UCA0SIMO (Pin 25)USCI_A0 transmit / SPI master-outConfigurable for UART TX or SPI MOSI - enables flexible serial peripheral interfacing
P4.6/TBOUTH/A15 (Pin 21)Timer_B output high-impedance control / ADC input A15Allows safe multiplexing of TB outputs during shared-bus operation; extends ADC channel count to 16

Key Features

Feature Design Value
Ultra-low-power operationFive software-selectable low-power modes (LPM0–LPM4); LPM4 draws only 0.1 µA with RAM retention
Digital-controlled oscillator (DCO)Four factory-trimmed frequencies (1, 4, 8, 12 MHz) accurate to ±1% - eliminates need for external crystal in many applications
Integrated USCI peripheralsTwo independent universal serial communication interfaces: USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C)
On-chip emulation & securityEmbedded Emulation Module (EEM) with two hardware breakpoints; programmable security fuse prevents unauthorized code readout
ADC with autonomous operation10-bit ADC10 with data transfer controller (DTC) moves conversion results directly to RAM without CPU intervention
Brownout detectorProgrammable threshold with interrupt capability - prevents erratic behavior during battery voltage sag

Applications

Wireless Sensor Node Portable Medical Monitor

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and light data at 10-second intervals, transmitting via UART to BLE module.

IC Role / Device Role / Timing Role: Central MCU managing sensor polling, ADC conversion, data formatting, and serial transmission; uses LPM3 between samples.

Use Value: 0.7 µA standby current extends coin-cell life beyond 5 years; sub-1 µs wake-up ensures precise sampling alignment.

Use Scenario: Handheld pulse oximeter acquiring analog photodiode signals, computing SpO₂, and displaying results on segment LCD.

IC Role / Device Role / Timing Role: Signal acquisition controller performing synchronized dual-channel ADC sampling, digital filtering, and LCD drive via GPIO.

Use Value: Integrated 10-bit ADC with internal reference and DTC reduces BOM cost and PCB area; 1.8 V minimum supply supports single AAA battery operation.

Industrial Data Logger Smart Meter Sensor Interface

Use Scenario: DIN-rail mounted logger recording voltage, current, and temperature from industrial transducers every minute for 30 days.

IC Role / Device Role / Timing Role: Low-power host processor executing timed ADC sequences, storing data in Flash, and waking periodically for RS-485 upload.

Use Value: 8KB Flash stores >10,000 timestamped readings; brownout detector prevents corruption during AC line dips.

Use Scenario: Sub-metering unit interfacing with shunt-based current sensors and Rogowski coils in residential smart meters.

IC Role / Device Role / Timing Role: Precision analog front-end controller performing simultaneous multi-channel sampling and phase calibration.

Use Value: 12-channel ADC input with autoscan and internal reference enables accurate RMS calculation across 3-phase systems without external op-amps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430F2252TDAR16KB Flash, 512B RAM, same peripherals and package - no op-ampsRequires larger firmware image; identical power/performance profile for expanded code needsSelect when firmware exceeds 8KB or future scalability is required without changing layout
MSP430F2272TDAR32KB Flash, 1KB RAM, same peripherals and package - no op-ampsSupports complex protocol stacks (e.g., Modbus RTU + diagnostics); higher RAM enables larger buffersChoose for applications needing >16KB code space or >512B runtime data storage

Compared with MSP430F2252TDAR and MSP430F2272TDAR, the MSP430F2232TDAR provides optimal balance of code space, RAM, and cost for compact sensor firmware - avoiding over-provisioning while maintaining full peripheral compatibility and pin-to-pin layout reuse.

Availability

MSP430F2232TDAR is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, and industrial data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MSP430F2232TDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and reliability.

The MSP430F2232TDAR belongs to the MSP430F22x2 ultra-low-power microcontroller family, designed specifically for battery-operated measurement and sensing applications where nanowatt-level power management and integrated analog peripherals are essential.

FAQ

What is the maximum operating frequency of the MSP430F2232TDAR?

The MSP430F2232TDAR supports a maximum system clock (MCLK) frequency of 16 MHz using an external HF crystal or resonator. Its internal digitally controlled oscillator (DCO) is factory-calibrated to four frequencies - 1 MHz, 4 MHz, 8 MHz, and 12 MHz - all accurate to ±1% across the full temperature range. This eliminates the need for external timing components in many low-speed applications while retaining flexibility for higher-performance use cases. The MSP430F2232TDAR achieves a 62.5-ns instruction cycle time at 16 MHz.

Does the MSP430F2232TDAR include operational amplifiers?

No, the MSP430F2232TDAR does not include operational amplifiers. Operational amplifiers are exclusive to the MSP430F22x4 series (e.g., MSP430F2234, MSP430F2274). The MSP430F2232TDAR is part of the F22x2 family and shares the same core peripherals - including 10-bit ADC10, two 16-bit timers, USCI_A0/USCI_B0, and Brownout Detector - but omits the two configurable op-amps present in F22x4 variants. This distinction is clearly documented in TI's SLAS504G datasheet feature tables.

What package type and pin count does the MSP430F2232TDAR use?

The MSP430F2232TDAR uses a 38-pin Thin Shrink Small-Outline Package (TSSOP), designated by the "DA" suffix per TI's ordering nomenclature. Its dimensions are 9.7 mm × 4.4 mm with 0.65 mm pitch. This package is RoHS-compliant, lead-free, and rated MSL-3. It is pin-compatible with other MSP430F22x2/F22x4 devices in the DA package, including MSP430F2252TDAR and MSP430F2272TDAR, enabling scalable design reuse.

What debug interface does the MSP430F2232TDAR support?

The MSP430F2232TDAR supports both JTAG and Spy-Bi-Wire (SBW) debug interfaces via dedicated pins RST/NMI/SBWTDIO (Pin 6) and TEST/SBWTCK (Pin 1). The on-chip Embedded Emulation Module (EEM) provides two hardware breakpoints and full flash programming capability. TI recommends the MSP-FET430UIF (USB) or MSP-FET430U38 (DA-package target board) for development. No external programming voltage is required - all operations use the device's DVCC supply.

Is the MSP430F2232TDAR suitable for automotive applications?

Yes, the MSP430F2232TDAR is qualified for extended temperature operation from –40°C to +105°C (indicated by the "T" in the part number), making it suitable for under-hood and cabin automotive applications such as body control modules, tire pressure monitoring systems (TPMS), and HVAC sensor interfaces. It meets AEC-Q100 stress test requirements for Grade 2 temperature range and includes features critical for automotive use - including brownout detection, fail-safe reset circuitry, and robust ESD protection (2 kV HBM).

MSP430F2232TDAR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
38-TSSOP (0.240", 6.10mm Width)
Series:
MSP430F2xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F2232TDAR FAQ

1.How can I place an order for MSP430F2232TDAR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F2232TDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F2232TDAR reliable?

The price and inventory of MSP430F2232TDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2232TDAR is usually 5 days.

3.What payment methods are accepted for MSP430F2232TDAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2232TDAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MSP430F2232TDAR?

MSP430F2232TDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F2232TDAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F2232TDAR?

For technical support, including MSP430F2232TDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2232TDAR requirements.

6.How does Aetrix verify that MSP430F2232TDAR is sourced from the original manufacturer or authorized distributors?

All MSP430F2232TDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2232TDAR meets industry standards.

7.What is the process for return or replacement of MSP430F2232TDAR?

All MSP430F2232TDAR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2232TDAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F2232TDAR part is unused and in its original packaging.

Return procedure for MSP430F2232TDAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MSP430F2232TDAR Tags

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