Texas Instruments MSP430F2234IYFFR
- Part No.:
- MSP430F2234IYFFR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 49-UFBGA, DSBGA
- Datasheet:
-
MSP430F2234IYFFR.pdf
- Description:
- IC MCU 16BIT 8KB FLASH 49DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430F2234IYFFR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller in a 49-pin BGA (YFF) package, featuring 8KB Flash + 256B info memory, 512B RAM, dual operational amplifiers, 10-bit 200-ksps ADC with integrated reference and DTC, two 16-bit timers (Timer_A3 and Timer_B3), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and brownout detection - deployed in battery-powered sensor nodes and portable measurement systems.
For engineers reviewing the MSP430F2234IYFFR datasheet, MSP430F2234IYFFR pinout, MSP430F2234IYFFR application, or MSP430F2234IYFFR equivalent, key selection criteria include its dual-op-amp analog front-end, 12-channel ADC with autoscan and data transfer controller, Spy-Bi-Wire debug interface, 1.8–3.6 V supply range, and LPM4 ultra-low-power mode consuming only 0.1 µA with RAM retention.
Technical Context
The MSP430F2234IYFFR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and high code efficiency. Its clock system integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies (±1%), internal VLO (12 kHz), and support for external crystals up to 16 MHz.
It features two independent 16-bit timers with capture/compare registers, programmable interrupt vectors across 32 priority levels, and dual USCI modules supporting asynchronous UART with auto-baud detection (LIN), synchronous SPI, and I²C - all operating under five software-selectable low-power modes including LPM4 with full RAM retention at 0.1 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 general-purpose registers and constant generators; enables efficient signal processing in resource-constrained embedded applications. |
| Flash / RAM | 8KB + 256B information memory / 512B RAM; sufficient for firmware plus real-time sensor buffering without external memory. |
| ADC | 10-bit, 200-ksps SAR ADC with 12 input channels, internal reference, sample-and-hold, autoscan, and Data Transfer Controller (DTC); eliminates host CPU overhead during multi-channel acquisition. |
| Operational Amplifiers | Two rail-to-rail op amps (OA0 and OA1) with configurable inputs/outputs; supports sensor signal conditioning (e.g., bridge amplification, filtering) on-chip. |
| Power Consumption | Active mode: 270 µA @ 1 MHz, 2.2 V; Standby: 0.7 µA; Off mode (RAM retention): 0.1 µA - enables multi-year operation on coin-cell batteries. |
| Low-Power Modes | Five software-selectable modes (LPM0–LPM4); LPM4 disables all clocks and crystal oscillator while retaining RAM, ideal for intermittent wake-up sensing. |
| Debug Interface | Spy-Bi-Wire (2-wire JTAG) with Embedded Emulation Module (EEM); enables full-speed debugging and flash programming using MSP-FET430UIF. |
Pinout & Package
Package: 49-pin Plastic Ball Grid Array (YFF), 3.33 mm × 3.49 mm, 0.5 mm pitch, bottom thermal pad recommended to be connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO (Pin B3) | Reset / Non-maskable Interrupt / Spy-Bi-Wire Data I/O | Single-pin reset and debug interface; enables secure programming and low-pin-count in-system debugging. |
| TEST/SBWTCK (Pin D1) | Test Clock Input | Provides clock for Spy-Bi-Wire programming; required for flash loading and boundary-scan testing. |
| P2.0/ACLK/A0/OA0I0 (Pin A4) | ACLK Output / ADC Channel 0 / OA0 Inverting Input | Shared function enables clock distribution, analog sensing, and op-amp feedback configuration without external routing. |
| P2.3/TA1/A3/VREF−/VeREF−/OA1I1/OA1O (Pin F3) | Timer_A1 Input / ADC Channel 3 / Negative Reference / OA1 Input & Output | Multi-role pin supports precision reference setup and op-amp output buffering for ratiometric sensor interfaces. |
| P4.4/TB1/A13/OA1O (Pin F7) | Timer_B1 Capture / ADC Channel 13 / OA1 Output | Enables synchronized timing of analog sampling and op-amp output control, critical for closed-loop sensor actuation. |
| DVCC / AVCC (Pins C1, D3, D4, E4, E5, C6, C7, D5) | Digital & Analog Power Supply | Separate DVCC/AVCC rails with dedicated decoupling pads reduce digital noise coupling into sensitive analog circuits. |
| DVSS / AVSS (Pins B1, B2, C3, C4, B7, C5) | Digital & Analog Ground | Independent ground planes minimize return-path interference between digital switching and ADC conversion accuracy. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Operational Amplifiers | Configurable as instrumentation, transimpedance, or filter stages - reduces external analog components and PCB area in sensor front-ends. |
| Data Transfer Controller (DTC) | Automatically moves ADC results to RAM without CPU intervention - enables continuous background acquisition during sleep or computation. |
| USCI_A0 with LIN Auto-Baud Detection | Supports robust automotive and industrial bus communication without external baud-rate configuration hardware or host CPU polling. |
| Factory-Calibrated DCO | Four internal frequencies (1, 8, 12, 16 MHz) trimmed to ±1% - eliminates need for external crystal in cost-sensitive timing applications. |
| Brownout Detector (BOR) | Monitors DVCC and triggers reset if voltage drops below threshold - prevents erratic operation and flash corruption during battery sag. |
| Bootstrap Loader (BSL) | On-chip UART-based firmware update capability - enables field upgrades without JTAG hardware or physical access to debug pins. |
Applications
| Wireless Sensor Node | Portable Medical Monitor |
|---|---|
|
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and pressure data for periodic BLE transmission. IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, op-amp signal conditioning, timer-triggered radio wake-up, and low-power state transitions. Use Value: 0.1 µA LPM4 current extends coin-cell life beyond 5 years; dual op amps enable direct bridge sensor interfacing without external amplifiers. |
Use Scenario: Handheld pulse oximeter acquiring photodiode signals, computing SpO₂, and displaying results on segmented LCD. IC Role / Device Role / Timing Role: Mixed-signal controller performing synchronized LED drive timing, analog front-end amplification, ADC conversion, and display refresh. Use Value: Integrated DTC offloads ADC data movement from CPU; dual op amps condition weak photodiode currents with rail-to-rail output swing. |
| Industrial Process Transmitter | Smart Meter Sensor Interface |
|
Use Scenario: 4–20 mA loop-powered transmitter measuring flow or level with HART modulation capability. IC Role / Device Role / Timing Role: Signal processor handling analog input conditioning, linearization, HART FSK modulation/demodulation via USCI_A0, and loop current control. Use Value: USCI_A0's IrDA encoder/decoder supports HART physical layer; LPM3 mode (0.3 µA) maintains real-time clock during standby without external RTC. |
Use Scenario: Electricity meter auxiliary sensor module monitoring tamper switches, temperature, and magnetic interference. IC Role / Device Role / Timing Role: Secondary MCU providing isolated analog monitoring, event logging, and secure tamper reporting via SPI to main meter SoC. Use Value: Dual op amps detect subtle magnetic field changes; 12-channel ADC scans multiple sensors autonomously using autoscan mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2254IYFFR | 16KB Flash + 256B info memory, same peripherals and pinout - double Flash capacity with identical YFF package and timing specs. | Required when firmware exceeds 8KB or when future feature expansion demands additional code space without layout change. | Select for designs needing larger firmware footprint while retaining identical power profile, analog capability, and debug interface. |
| MSP430F2274IYFFR | 32KB Flash + 256B info memory, 1KB RAM, otherwise identical peripheral set and YFF package - higher memory density with no pin or timing trade-offs. | Used in complex sensor fusion or protocol stack implementations (e.g., Zigbee SE, DLMS) requiring >16KB code and extended RAM buffers. | Choose when application complexity mandates >16KB Flash and ≥1KB RAM, with full backward compatibility in hardware design. |
Compared with MSP430F2254IYFFR and MSP430F2274IYFFR, the MSP430F2234IYFFR delivers optimal cost-performance balance for compact sensor firmware (<8KB), maintaining identical ultra-low-power behavior, dual-op-amp analog front-end, and 49-pin YFF footprint - making it ideal for high-volume, size-constrained deployments.
Availability
MSP430F2234IYFFR is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, industrial process transmitters, and smart meter sensor interfaces requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for MSP430F2234IYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design and industrial-grade reliability.
The MSP430F2234IYFFR belongs to the MSP430F2xx ultra-low-power mixed-signal microcontroller family, engineered specifically for battery-operated sensing, measurement, and control applications where energy efficiency, integrated analog functionality, and robust debug capability are critical.
FAQ
What is the maximum operating frequency of the MSP430F2234IYFFR?
The MSP430F2234IYFFR supports a maximum system clock (MCLK) frequency of 16 MHz, achievable using an external HF crystal or resonator. Its internal DCO provides factory-calibrated frequencies up to 16 MHz (±1%) - eliminating the need for external timing components in many applications. The CPU executes instructions at 62.5-ns cycle time at 16 MHz, and the MSP430F2234IYFFR maintains full peripheral functionality across this range.
Does the MSP430F2234IYFFR support in-system programming without external voltage?
Yes, the MSP430F2234IYFFR supports serial onboard programming with no external programming voltage required. It uses the Spy-Bi-Wire interface (via RST/NMI/SBWTDIO and TEST/SBWTCK pins) and integrates a bootstrap loader (BSL) accessible over UART - enabling firmware updates in the field or on-board using standard 3.3 V logic levels. This capability is fully implemented in the MSP430F2234IYFFR silicon.
How many analog input channels does the MSP430F2234IYFFR ADC support?
The MSP430F2234IYFFR integrates a 10-bit ADC10 module with 12 selectable analog input channels (A0–A7, A12–A15), supported by the YFF package's pin mapping. Channels A0–A7 map directly to P2.0–P2.4 and P3.6–P3.7; A12–A15 map to P4.3–P4.6. All 12 channels are accessible simultaneously in autoscan mode, and the Data Transfer Controller (DTC) automatically stores results in RAM - a confirmed capability of the MSP430F2234IYFFR per SLAS504G.
Is the MSP430F2234IYFFR pin-compatible with other devices in the MSP430F22x4 family?
Yes, the MSP430F2234IYFFR is fully pin-compatible with other YFF-package variants in the MSP430F22x4 family - including MSP430F2254IYFFR and MSP430F2274IYFFR - sharing identical 49-ball layout, signal assignments, power/ground pin locations, and thermal pad requirements. This allows drop-in Flash-capacity upgrades without PCB redesign, as verified in TI's SLAS504G Table 1 and pinout diagrams.
What debug interfaces are supported by the MSP430F2234IYFFR?
The MSP430F2234IYFFR supports Spy-Bi-Wire (2-wire JTAG) via RST/NMI/SBWTDIO and TEST/SBWTCK pins, and includes an on-chip Embedded Emulation Module (EEM) for full-speed debugging, breakpoint setting, and flash programming. It is compatible with TI's MSP-FET430UIF debugger and Code Composer Studio - all documented features of the MSP430F2234IYFFR in the SLAS504G datasheet and MSP430x2xx Family User's Guide.
MSP430F2234IYFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 49-UFBGA, DSBGA
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 8KB (8K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2234IYFFR FAQ
1.How can I place an order for MSP430F2234IYFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2234IYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2234IYFFR reliable?
The price and inventory of MSP430F2234IYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2234IYFFR is usually 5 days.
3.What payment methods are accepted for MSP430F2234IYFFR?
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MSP430F2234IYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2234IYFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2234IYFFR?
For technical support, including MSP430F2234IYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2234IYFFR requirements.
6.How does Aetrix verify that MSP430F2234IYFFR is sourced from the original manufacturer or authorized distributors?
All MSP430F2234IYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2234IYFFR meets industry standards.
7.What is the process for return or replacement of MSP430F2234IYFFR?
All MSP430F2234IYFFR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2234IYFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2234IYFFR part is unused and in its original packaging.
Return procedure for MSP430F2234IYFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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