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Texas Instruments MSP430F2234TDAR
- Part No.:
- MSP430F2234TDAR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TSSOP (0.240", 6.10mm Width)
- Datasheet:
-
MSP430F2234TDAR.pdf
- Description:
- IC MCU 16BIT 8KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,473
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Product details
Overview
MSP430F2234TDAR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 8KB+256B flash, 512B RAM, dual operational amplifiers, 10-bit 200-ksps ADC with internal reference and DTC, two 16-bit timers (Timer_A3 and Timer_B3), USCI_A0/USCI_B0 serial interfaces (UART/LIN/IrDA/SPI/I²C), and 32 I/O pins. It operates from 1.8 V to 3.6 V and targets battery-powered sensor acquisition and processing systems.
For engineers reviewing the MSP430F2234TDAR datasheet, MSP430F2234TDAR pinout, MSP430F2234TDAR application, or MSP430F2234TDAR equivalent, key selection criteria include its dual-op-amp analog front-end, 16-channel ADC input capability (A0–A15), Spy-Bi-Wire debug interface, -40°C to 105°C extended temperature grade, and TSSOP-38 package compatibility with industrial sensor nodes and portable measurement devices.
Technical Context
The MSP430F2234TDAR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations. Its clock system integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies (±1%), plus support for 32-kHz crystal, HF crystal up to 16 MHz, resonator, or external digital clock source.
It features two independent operational amplifiers (OA0 and OA1) with configurable inputs/outputs across multiple pins (e.g., P2.0/OA0I0, P4.3/OA0O, P2.3/OA1I1/OA1O), and a 10-bit ADC with autoscan, sample-and-hold, and data transfer controller - all optimized for low-power analog signal conditioning and digitization in standalone sensor endpoints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers and 62.5-ns instruction cycle time at 16 MHz |
| Memory | 8KB + 256B flash program memory and 512B RAM - sufficient for firmware with integrated sensor algorithms and communication stacks |
| ADC | 10-bit, 200-ksps SAR ADC with 16 analog inputs (A0–A15), internal reference, autoscan, and DTC - enables continuous multi-channel sensor sampling without CPU intervention |
| Power Consumption | 270 µA active @ 1 MHz/2.2 V; 0.7 µA standby; 0.1 µA off-mode with RAM retention - supports >10-year battery life in periodic wake-up sensor applications |
| Operating Temperature | -40°C to +105°C - qualified for under-hood automotive, industrial control, and outdoor environmental monitoring |
| Package | 38-pin Thin Shrink Small-Outline Package (TSSOP, DA) - surface-mount compatible with high-density PCB layouts and automated assembly |
| Debug Interface | Spy-Bi-Wire (2-wire JTAG) via TEST/SBWTCK and RST/NMI/SBWTDIO - enables in-system programming and real-time debugging with minimal pin count |
Pinout & Package
Package: 38-pin TSSOP (Thin Shrink Small-Outline Package), JEDEC MO-153, body size 9.7 mm × 4.4 mm, 0.65 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TACLK/ADC10CLK | Timer_A clock input / ADC conversion clock | Enables synchronous timer-triggered ADC sampling; supports external clock injection for precise timing control |
| P2.0/ACLK/A0/OA0I0 | ACLK output / ADC channel A0 / OA0 inverting input | Shared pin allows direct connection of sensor signal to op-amp input while providing low-jitter clock for RTC or timer functions |
| P2.3/TA1/A3/VREF−/VeREF−/OA1I1/OA1O | ADC channel A3 / OA1 inverting input & output | Configurable as op-amp output or input - supports rail-to-rail instrumentation amplifier configurations with external gain-setting resistors |
| P4.3/TB0/A12/OA0O | Timer_B channel 0 / ADC channel A12 / OA0 output | Combines timer capture/compare, analog input, and op-amp output - ideal for closed-loop sensor feedback with hardware-accelerated timing |
| RST/NMI/SBWTDIO | Reset / non-maskable interrupt / Spy-Bi-Wire data I/O | Single-pin debug interface reduces BOM count; NMI supports critical fault handling (e.g., overtemperature, voltage brownout) |
| TEST/SBWTCK | Spy-Bi-Wire test clock input | Enables full flash programming and on-chip emulation using only two pins - eliminates need for dedicated JTAG header |
Key Features
| Feature | Design Value |
|---|---|
| Dual configurable op-amps (OA0, OA1) | Supports programmable gain stages, differential sensing, and active filtering directly on-chip - reduces external component count by up to 6 passive parts per channel |
| 10-bit ADC with DTC and autoscan | Automatically sequences conversions across up to 16 channels and transfers results to RAM without CPU wake-up - cuts active-mode energy per sample by 40% |
| Ultra-fast wake-up (<1 µs) | DCO-based clock recovery enables immediate execution after LPM3/LPM4 exit - essential for duty-cycled sensor polling with sub-millisecond latency |
| Brownout detector with reset | Monitors supply voltage continuously and asserts RST if VCC drops below threshold - prevents erratic operation during battery depletion or power transients |
| Bootstrap loader (BSL) | Allows UART-based firmware updates in-system without debugger - supports field upgrades and remote calibration via serial interface |
Applications
| Industrial Sensor Node | Portable Environmental Monitor |
|---|---|
Use Scenario: Wireless temperature/humidity/pressure node deployed in factory floor or HVAC ducts, transmitting data every 30 seconds via sub-GHz RF link. IC Role / Device Role / Timing Role: Central MCU managing sensor excitation, analog signal conditioning (via OA0/OA1), 10-bit ADC digitization, low-power sleep/wake scheduling, and UART-to-RF bridge. Use Value: Dual op-amps enable ratiometric bridge sensor biasing and noise rejection; 0.1 µA off-mode extends AA battery life beyond 5 years. |
Use Scenario: Handheld air quality meter measuring CO₂, VOC, and PM2.5 with LCD display and USB charging. IC Role / Device Role / Timing Role: Main controller handling multi-sensor synchronization, ADC autoscan across 12 channels, real-time clock (ACLK), and USB-emulated CDC interface. Use Value: Integrated DTC automates sensor data logging to RAM; 1.8 V minimum supply allows direct Li-ion battery operation down to 3.0 V cell voltage. |
| Automotive Cabin Sensor | Smart Meter Analog Front-End |
Use Scenario: Occupancy and cabin air quality module mounted near dashboard, operating in -40°C to +105°C ambient. IC Role / Device Role / Timing Role: Signal conditioner and data aggregator for NDIR CO₂, MEMS microphone, and thermistor array; interfaces to CAN via external transceiver. Use Value: Extended temperature grade (-40°C to +105°C) and brownout protection ensure reliability during engine cold start and thermal soak cycles. |
Use Scenario: Electricity meter measuring voltage/current waveforms using shunt and isolation amplifiers, with metrology-grade sampling. IC Role / Device Role / Timing Role: Secondary processor performing anti-aliasing filtering (via OA0/OA1), ADC oversampling, and tamper detection logic before sending data to main metrology IC. Use Value: Configurable op-amp inputs/outputs allow re-use of same PCB layout for voltage or current sensing variants; TSSOP-38 simplifies optical isolation barrier routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2254TDAR | 16KB+256B flash, 512B RAM - double program memory; identical peripherals, pinout, and temperature grade | Required when firmware exceeds 8KB (e.g., adding OTA update stack or advanced sensor fusion) | Select MSP430F2254TDAR if future firmware expansion headroom or dual-application partitioning (e.g., secure bootloader + main app) is needed. |
| MSP430F2274TDAR | 32KB+256B flash, 1KB RAM - quadruple memory; otherwise identical architecture, peripherals, and packaging | Suitable for complex protocol stacks (e.g., BLE mesh, LoRaWAN) or embedded GUI rendering with frame buffer | Choose MSP430F2274TDAR only when >16KB code space is confirmed necessary - avoids over-provisioning cost and power overhead. |
Compared with MSP430F2254TDAR and MSP430F2274TDAR, the MSP430F2234TDAR delivers optimal cost-performance balance for fixed-function sensor nodes where firmware size is stable and ≤8KB, while retaining full peripheral compatibility and drop-in replacement capability in TSSOP-38 footprint.
Availability
MSP430F2234TDAR is available at Aetrix Electronics and suitable for industrial sensor nodes, portable environmental monitors, automotive cabin sensors, and smart meter analog front-ends requiring stable component supply across multi-year production cycles.
Supply support for MSP430F2234TDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430F2234TDAR belongs to the MSP430F22x4 family - engineered specifically for battery-operated measurement systems requiring precision analog integration, deterministic real-time response, and multi-year energy efficiency.
FAQ
What is the maximum operating frequency of the MSP430F2234TDAR?
The MSP430F2234TDAR supports a maximum system clock (MCLK) frequency of 16 MHz, achievable using the internal DCO calibrated to ±1% or an external HF crystal/resonator. Its 16-bit RISC core executes instructions at 62.5 ns per cycle at this rate, enabling responsive real-time control in sensor applications without compromising ultra-low-power operation.
Does the MSP430F2234TDAR include hardware debug capability?
Yes, the MSP430F2234TDAR integrates an Embedded Emulation Module (EEM) supporting Spy-Bi-Wire (2-wire JTAG) debugging via TEST/SBWTCK and RST/NMI/SBWTDIO pins. This enables full flash programming, breakpoint setting, register inspection, and real-time variable monitoring - all without requiring a dedicated 4-pin JTAG header or additional PCB area.
How many analog input channels does the MSP430F2234TDAR ADC support?
The MSP430F2234TDAR's 10-bit ADC supports 16 analog input channels (A0 through A15), mapped across P1.x, P2.x, P3.x, and P4.x pins. Channels A0–A7 are accessible on standard I/O ports, while A8–A15 correspond to alternate functions on Timer_B and op-amp pins (e.g., P4.3/A12, P4.6/A15), enabling flexible sensor routing in compact designs.
Is the MSP430F2234TDAR pin-compatible with other MSP430F22x4 devices?
Yes, the MSP430F2234TDAR is fully pin-compatible with all MSP430F22x4 variants (e.g., MSP430F2254TDAR, MSP430F2274TDAR) in the same TSSOP-38 (DA) package. Identical pin functions, electrical characteristics, and timing parameters allow direct substitution - simplifying design reuse and scalability across memory-tier variants.
What development tools are recommended for the MSP430F2234TDAR?
Texas Instruments recommends the MSP-FET430UIF (USB-based programmer/debugger) and MSP-FET430U38 (target board with TSSOP-38 socket) for rapid evaluation and firmware development. The MSP430F2234TDAR also supports Code Composer Studio and naken430loader for open-source toolchain integration, ensuring flexibility across professional and academic environments.
MSP430F2234TDAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TSSOP (0.240", 6.10mm Width)
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 8KB (8K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2234TDAR FAQ
1.How can I place an order for MSP430F2234TDAR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2234TDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2234TDAR reliable?
The price and inventory of MSP430F2234TDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2234TDAR is usually 5 days.
3.What payment methods are accepted for MSP430F2234TDAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2234TDAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2234TDAR?
MSP430F2234TDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2234TDAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2234TDAR?
For technical support, including MSP430F2234TDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2234TDAR requirements.
6.How does Aetrix verify that MSP430F2234TDAR is sourced from the original manufacturer or authorized distributors?
All MSP430F2234TDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2234TDAR meets industry standards.
7.What is the process for return or replacement of MSP430F2234TDAR?
All MSP430F2234TDAR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2234TDAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2234TDAR part is unused and in its original packaging.
Return procedure for MSP430F2234TDAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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