Texas Instruments MSP430F2252TDAR
- Part No.:
- MSP430F2252TDAR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TSSOP (0.240", 6.10mm Width)
- Datasheet:
-
MSP430F2252TDAR.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 38TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,145
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F2252TDAR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 16KB+256B flash, 512B RAM, 10-bit 200-ksps ADC with internal reference and autoscan, dual 16-bit timers (Timer_A3 and Timer_B3), and USCI modules supporting UART/LIN, SPI, and I²C - deployed in battery-powered sensor nodes and portable measurement systems.
For engineers reviewing the MSP430F2252TDAR datasheet, MSP430F2252TDAR pinout, MSP430F2252TDAR application, or MSP430F2252TDAR equivalent, key selection criteria include its -40°C to 105°C industrial temperature grade, TSSOP-38 package, 1.8–3.6 V supply range, sub-1 µs wake-up from LPM4, and integrated brownout detector for robust operation in energy-constrained embedded designs.
Technical Context
The MSP430F2252TDAR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations. Its basic clock system includes DCO (calibrated to ±1% at 1 MHz), ACLK from 32-kHz crystal or internal VLO, and SMCLK derived from DCO or external source.
It integrates two independent USCI modules: USCI_A0 supports enhanced UART with auto-baud detection (LIN-compliant), IrDA encoding/decoding, and synchronous SPI; USCI_B0 supports SPI and I²C master/slave modes. The ADC10 features 12 analog input channels, sample-and-hold, data transfer controller (DTC), and selectable internal/external reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers and 62.5-ns instruction cycle at 16 MHz - enables deterministic real-time control and compact code footprint. |
| Flash / RAM | 16KB + 256B flash memory with security fuse; 512B RAM - sufficient for firmware with sensor fusion algorithms and communication stacks. |
| ADC Performance | 10-bit, 200-ksps SAR ADC with 12-channel autoscan, internal reference, and DTC - eliminates need for external DMA controller in data-acquisition loops. |
| Power Consumption | Active mode: 270 µA @ 1 MHz, 2.2 V; Standby: 0.7 µA; Off mode (RAM retention): 0.1 µA - extends coin-cell battery life to multi-year operation. |
| Wake-up Time | <1 µs from LPM4 to active mode - critical for event-driven sensing where latency must be minimized without sacrificing sleep efficiency. |
| Operating Temperature | -40°C to +105°C - qualified for under-hood automotive sensors, industrial motor controllers, and outdoor environmental monitors. |
| Clock Sources | Internal DCO (1–16 MHz, ±1% calibration), 32-kHz crystal, HF crystal up to 16 MHz, external digital clock, or resistor-controlled oscillator - supports flexible timing architecture without external crystals in cost-sensitive designs. |
Pinout & Package
Package: 38-pin Thin Shrink Small-Outline Package (TSSOP), JEDEC MO-153, body size 9.7 × 4.4 mm, 0.65 mm pitch. Pin 1 marked by notch; thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI/SBWTDIO (Pin 6) | Reset / Non-maskable interrupt / Spy-Bi-Wire data I/O | Single-pin debug interface for programming and emulation; resets device on low pulse; accepts NMI events during normal operation. |
| P1.0/TACLK/ADC10CLK (Pin 31) | Timer_A clock input / ADC conversion clock | Enables synchronous sampling of analog signals using timer-triggered ADC conversions - essential for precise time-domain measurements. |
| P2.0/ACLK/A0 (Pin 8) | ACLK output / ADC channel A0 | Provides low-frequency clock for RTC or watchdog; doubles as first analog input - simplifies PCB routing in space-constrained sensor front ends. |
| P3.0/UCB0STE/UCA0CLK/A5 (Pin 11) | USCI_B0 slave transmit enable / USCI_A0 clock / ADC A5 | Multi-function pin supports daisy-chained SPI slaves or synchronous UART clocking - reduces pin count in multi-node sensor networks. |
| P4.3/TB0/A12 (Pin 20) | Timer_B capture/compare / ADC channel A12 | Allows simultaneous PWM generation and analog monitoring on same pin - useful for closed-loop motor control with current sensing. |
| DVCC / DVSS / AVCC / AVSS (Pins 2, 4, 23, 22) | Digital/analog power and ground rails | Separate analog/digital supplies reduce noise coupling into ADC - improves effective resolution in precision measurement applications. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation across six software-selectable modes | LPM4 draws only 0.1 µA with RAM retention - enables years of operation on CR2032 batteries in wireless sensor endpoints. |
| Integrated brownout detector with programmable threshold | Prevents erratic execution during voltage sag; triggers reset before flash corruption or register instability occurs - critical for field-deployed reliability. |
| On-chip emulation module (EEM) with Spy-Bi-Wire interface | Enables full-speed debugging and flash programming via 2-wire interface - eliminates need for JTAG header, saving board space and BOM cost. |
| Bootstrap loader (BSL) with UART-based firmware update | Permits field firmware upgrades over existing serial interface without external programmer - lowers maintenance cost for distributed IoT deployments. |
| 16-bit Timer_B with shadow registers and TBOUTH control | Enables glitch-free PWM output toggling and synchronized multi-channel waveform generation - required for precise LED dimming or motor phase control. |
Applications
| Wireless Sensor Node | Industrial Motor Monitor |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via UART-to-LoRa gateway every 5 minutes. IC Role / Device Role / Timing Role: Central MCU managing ADC sampling, data preprocessing, low-power scheduling, and UART framing. Use Value: Sub-1 µs wake-up and 0.1 µA LPM4 current minimize average power to <1.5 µA - enabling >5-year CR2032 lifetime. |
Use Scenario: Compact enclosure mounted on HVAC blower housing measuring current, vibration, and coil temperature. IC Role / Device Role / Timing Role: Real-time acquisition engine capturing 10-bit analog waveforms at 20 ksps using ADC autoscan and DTC. Use Value: Integrated 12-channel ADC with internal reference eliminates external op-amp and reference IC - reducing component count by 4. |
| Smart Meter Tamper Detection | Portable Medical Pulse Oximeter |
Use Scenario: Utility meter detecting magnetic tampering via Hall sensor and logging events to flash memory. IC Role / Device Role / Timing Role: Low-power event processor with brownout protection, secure flash write, and timestamped nonvolatile storage. Use Value: Brownout detector prevents corrupted flash writes during voltage dips caused by magnet-induced power disturbance - ensuring audit-trail integrity. |
Use Scenario: Handheld oximeter acquiring red/IR photodiode signals, computing SpO₂, and displaying results on segment LCD. IC Role / Device Role / Timing Role: Signal acquisition and computation unit driving LCD via integrated port mapping and low-power display controller logic. Use Value: Dual USCI modules simultaneously handle UART debug output and I²C OLED interface - eliminating need for external bus switch or level shifter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2272TDAR | 32KB+256B flash, 1KB RAM - double flash capacity, same peripherals and pinout. | Suitable for larger protocol stacks (e.g., BLE mesh, Modbus RTU) requiring more code space. | Select when firmware size exceeds 16KB or future-proofing for feature expansion is needed. |
| MSP430F2232TDAR | 8KB+256B flash, 512B RAM - half flash, identical peripheral set and package. | Better fit for minimal firmware (e.g., simple UART bridge or GPIO extender) with tight cost targets. | Choose when application logic fits within 8KB and BOM cost reduction is prioritized over headroom. |
Compared with MSP430F2272TDAR, the MSP430F2252TDAR offers optimal balance of code space and cost for mid-complexity sensor firmware; versus MSP430F2232TDAR, it provides 100% more flash for algorithmic enhancements without changing PCB layout or power design.
Availability
MSP430F2252TDAR is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical devices, and smart metering applications requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for MSP430F2252TDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in ultra-low-power microcontrollers.
The MSP430F2252TDAR belongs to the MSP430F2xx ultra-low-power MCU family, designed specifically for battery-operated measurement systems where nanowatt-level sleep current and fast wake-up are mandatory for multi-year operation.
FAQ
What is the maximum operating frequency of the MSP430F2252TDAR?
The MSP430F2252TDAR supports a maximum system clock (MCLK) of 16 MHz, achievable via internal DCO calibrated to ±1% or external HF crystal. Its 16-bit RISC core executes instructions at 62.5 ns per cycle at this rate, enabling real-time signal processing in sensor fusion applications. The MSP430F2252TDAR maintains full functionality across its entire 1.8–3.6 V supply range at this frequency.
Does the MSP430F2252TDAR include hardware debug capability?
Yes, the MSP430F2252TDAR integrates an Embedded Emulation Module (EEM) supporting Spy-Bi-Wire (2-wire) debug interface via pins RST/NMI/SBWTDIO and TEST/SBWTCK. This allows full-speed breakpoints, register inspection, and flash programming without JTAG header - reducing PCB area and enabling in-system debugging of the MSP430F2252TDAR in final enclosures.
How many analog input channels does the ADC10 in the MSP430F2252TDAR support?
The ADC10 module in the MSP430F2252TDAR supports 12 analog input channels (A0–A7, A12–A15), accessible through dedicated pins including P2.0, P2.1, P2.2, P2.3, P2.4, P3.6, P3.7, P4.3, P4.4, P4.5, P4.6, and P4.7. Channel selection is fully configurable in software, and autoscan mode enables sequential conversion without CPU intervention - a key capability used in the MSP430F2252TDAR for multi-sensor data acquisition.
Is the MSP430F2252TDAR compatible with the MSP-FET430UIF debugger?
Yes, the MSP430F2252TDAR is fully supported by the MSP-FET430UIF USB-based debugger/programmer. Its Spy-Bi-Wire interface matches the tool's protocol stack, enabling flash programming, real-time variable watch, and breakpoint debugging. TI's Code Composer Studio v6+ and IAR Embedded Workbench both provide native project templates and device support for the MSP430F2252TDAR when used with this hardware.
What is the purpose of the P2.5/ROSC pin on the MSP430F2252TDAR?
P2.5/ROSC on the MSP430F2252TDAR serves as the resistor oscillator input, allowing external resistor tuning of the digitally controlled oscillator (DCO) frequency. Connecting a precision resistor between P2.5 and DVSS sets DCO frequency with ±1% accuracy across voltage and temperature - providing a low-cost, crystal-free clock source ideal for cost-sensitive applications where the MSP430F2252TDAR replaces external oscillators.
MSP430F2252TDAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TSSOP (0.240", 6.10mm Width)
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 16KB (16K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512 x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2252TDAR FAQ
1.How can I place an order for MSP430F2252TDAR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2252TDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2252TDAR reliable?
The price and inventory of MSP430F2252TDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2252TDAR is usually 5 days.
3.What payment methods are accepted for MSP430F2252TDAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2252TDAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2252TDAR?
MSP430F2252TDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2252TDAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2252TDAR?
For technical support, including MSP430F2252TDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2252TDAR requirements.
6.How does Aetrix verify that MSP430F2252TDAR is sourced from the original manufacturer or authorized distributors?
All MSP430F2252TDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2252TDAR meets industry standards.
7.What is the process for return or replacement of MSP430F2252TDAR?
All MSP430F2252TDAR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2252TDAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2252TDAR part is unused and in its original packaging.
Return procedure for MSP430F2252TDAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F2252TDAR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

