Texas Instruments MSP430F2254IYFFR

Overview

MSP430F2254IYFFR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 16KB+256B Flash, 512B RAM, dual operational amplifiers, 10-bit 200-ksps ADC with integrated reference and DTC, two 16-bit timers (Timer_A3 and Timer_B3), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and 32 I/O pins - deployed in sensor signal acquisition, battery-powered measurement, and RF front-end control systems.

For engineers reviewing the MSP430F2254IYFFR datasheet, MSP430F2254IYFFR pinout, MSP430F2254IYFFR application, or MSP430F2254IYFFR equivalent, key selection criteria include its 1.8–3.6 V supply range, sub-1 µs wake-up from LPM4, dual op-amp support for analog front-end conditioning, 32-pin YFF BGA package footprint, and integrated brownout detector with programmable threshold.

Technical Context

The MSP430F2254IYFFR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and high code efficiency. Its clock system integrates a digitally controlled oscillator (DCO), calibrated internal frequencies up to 16 MHz (±1%), and support for external 32-kHz crystal, HF crystal (≤16 MHz), resonator, or resistor-based tuning.

It features two independent 16-bit timers with three capture/compare registers each, configurable for PWM, input capture, interval timing, and quadrature decoding. The USCI modules provide hardware-accelerated UART (with LIN auto-baud), IrDA, SPI, and I²C communication - all operating independently of CPU intervention via DMA-like data transfer controller (DTC) support for ADC results.

Key Specifications

Pinout & Package

49-pin plastic ball grid array (YFF) package, 3.33 mm × 3.49 mm body size, 0.5 mm pitch, bottom-side thermal pad connected to DVSS. Designed for reflow assembly and high-density PCB layouts in portable measurement devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Compared with MSP430F2274IYFFR and MSP430FR2476TRHBR, the MSP430F2254IYFFR uniquely balances on-chip analog integration (dual op amps + 12-channel ADC) with moderate memory (16KB Flash), making it optimal for cost-sensitive, space-constrained sensor nodes requiring embedded signal conditioning without external components.

Availability

MSP430F2254IYFFR is available at Aetrix Electronics and suitable for portable sensor nodes, industrial temperature monitors, wireless remote controls, and low-power RF front ends requiring stable component supply across extended production lifecycles.

Supply support for MSP430F2254IYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.

The MSP430F2254IYFFR belongs to the MSP430F2xx ultra-low-power mixed-signal microcontroller family, engineered specifically for battery-operated measurement and sensing applications demanding nanowatt-level sleep currents and integrated analog subsystems.

FAQ

What is the maximum operating frequency of the MSP430F2254IYFFR?

The MSP430F2254IYFFR supports internal DCO frequencies up to 16 MHz, calibrated to ±1% accuracy across temperature and voltage. It also accepts external clock sources including 32-kHz crystals for low-power real-time clocking and HF crystals up to 16 MHz for high-speed active-mode operation. The device achieves this performance while maintaining ultra-low active current of 270 µA at 1 MHz and 2.2 V - a key advantage for energy-constrained designs. The MSP430F2254IYFFR uses these clock resources to drive MCLK, SMCLK, and ACLK independently for optimized peripheral timing.

Does the MSP430F2254IYFFR include hardware debug support?

Yes, the MSP430F2254IYFFR integrates an Embedded Emulation Module (EEM) supporting full-speed in-circuit debugging via Spy-Bi-Wire (2-wire JTAG). This allows breakpoint setting, real-time variable inspection, flash programming, and traceless execution monitoring using TI's MSP-FET430UIF or compatible tools. No external debug header is required - the TEST/SBWTCK and RST/NMI/SBWTDIO pins provide complete access. This capability is built into every MSP430F2254IYFFR unit and requires no additional licensing or configuration.

How many analog input channels does the MSP430F2254IYFFR ADC support?

The MSP430F2254IYFFR features a 10-bit successive approximation ADC (ADC10) with 12 selectable analog input channels: A0 through A7, plus A12 through A15. These channels are accessible via dedicated pins (e.g., P2.0/A0, P2.3/A3, P3.6/A6, P4.3/A12) and support autoscan mode for sequential conversion without CPU intervention. The ADC includes an integrated reference generator (VREF+/VREF−), sample-and-hold, and Data Transfer Controller (DTC) - enabling fully autonomous data acquisition. All 12 channels are functional in the MSP430F2254IYFFR.

Is the MSP430F2254IYFFR pin-compatible with other MSP430F22x4 variants?

Yes, the MSP430F2254IYFFR shares identical pinout and electrical characteristics with all other MSP430F22x4 devices in the YFF package (e.g., MSP430F2234IYFF, MSP430F2274IYFF), including identical ball mapping, I/O functionality per pin, and power/ground assignments. This allows direct substitution within the same package family without PCB redesign. Differences between variants are limited to Flash/RAM size and feature enablement - all YFF-packaged MSP430F22x4 parts use the same die footprint and bonding layout.

What development tools are recommended for the MSP430F2254IYFFR?

Texas Instruments recommends the MSP-FET430UIF (USB-based) or MSP-FET430PIF (parallel port) for programming and debugging the MSP430F2254IYFFR. For evaluation, the MSP-FET430U38 supports the DA-package variant, while custom carrier boards are used for YFF due to its BGA format. Code development is supported by TI's Code Composer Studio (CCS) IDE with MSP430 compiler and driver libraries. The MSP430F2254IYFFR's Spy-Bi-Wire interface ensures compatibility with all official TI debuggers - no third-party adapters are needed for full functionality.