Texas Instruments MSP430F2272TDAR

Overview

MSP430F2272TDAR from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller with 32KB+256B flash, 1KB RAM, 10-bit 200-ksps ADC with internal reference and autoscan, dual 16-bit timers (Timer_A3 and Timer_B3), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and operates from 1.8 V to 3.6 V. It targets battery-powered sensor nodes and portable measurement systems requiring sub-µA standby current.

For engineers reviewing the MSP430F2272TDAR datasheet, MSP430F2272TDAR pinout, MSP430F2272TDAR application, or MSP430F2272TDAR equivalent, key selection criteria include its 32KB flash capacity, 1KB RAM size, TSSOP-38 package compatibility, -40°C to 105°C extended temperature rating, and integrated analog peripherals including 12-channel ADC and dual op-amps (in F22x4 variants - not present in F2272).

Technical Context

The MSP430F2272TDAR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations. Its basic clock system supports internal DCO (calibrated to ±1% at 1 MHz, 8 MHz, 12 MHz, 16 MHz), 32-kHz crystal, HF crystal up to 16 MHz, resonator, or external digital clock source.

It features five software-selectable low-power modes (LPM0–LPM4), achieving 0.1 µA off-mode (RAM retention) and <1 µs wake-up from standby. The device includes a Brownout Detector, on-chip emulation module (Spy-Bi-Wire), bootstrap loader, and programmable code protection via security fuse.

Key Specifications

Pinout & Package

The MSP430F2272TDAR is housed in a 38-pin TSSOP (Thin Shrink Small-Outline Package, DA) with 0.65 mm lead pitch and exposed thermal pad (not electrically connected). Pin numbering follows TI standard DA package layout (pin 1 = TEST/SBWTCK, pin 38 = P1.7/TA2/TDO/TDI).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Compared with MSP430F2274TDAR, the MSP430F2272TDAR omits on-chip op-amps-reducing quiescent current and die area-while retaining identical flash, RAM, timers, ADC, and communication peripherals. Against MSP430F247TPMR, it trades flash/RAM capacity and pin count for industrial temperature range and smaller TSSOP-38 footprint.

Availability

MSP430F2272TDAR is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, and industrial data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MSP430F2272TDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.

The MSP430F2272TDAR belongs to the MSP430F2xx ultra-low-power microcontroller family, designed specifically for battery-operated measurement and sensing applications where nanowatt-level power consumption and integrated analog functionality are critical.

FAQ

What is the maximum operating frequency of the MSP430F2272TDAR?

The MSP430F2272TDAR supports a maximum system clock (MCLK) frequency of 16 MHz, achievable using the internal digitally controlled oscillator (DCO) calibrated to ±1% accuracy at four frequencies (1/8/12/16 MHz), or via external HF crystal up to 16 MHz. This allows deterministic real-time execution while maintaining ultra-low power in active mode (270 µA at 1 MHz, 2.2 V).

Does the MSP430F2272TDAR include operational amplifiers?

No, the MSP430F2272TDAR does not include operational amplifiers. Operational amplifiers are only present in the MSP430F22x4 series (e.g., MSP430F2274TDAR). The MSP430F2272TDAR belongs to the F22x2 series and shares the same peripheral set excluding the two OAs, making it suitable for applications where on-chip signal conditioning is not required.

What package type and temperature grade does MSP430F2272TDAR use?

The MSP430F2272TDAR uses a 38-pin Thin Shrink Small-Outline Package (TSSOP, DA) and is rated for industrial temperature operation from -40°C to +105°C. The "T" suffix in the part number explicitly denotes this extended temperature range, distinguishing it from the "I"-suffixed versions rated for -40°C to +85°C.

How many ADC input channels does the MSP430F2272TDAR support?

The MSP430F2272TDAR supports 12 analog input channels (A0–A7, A12–A15) for its 10-bit ADC10 module. Channels A0–A7 map to P2.0–P2.4 and P3.6–P3.7; A12–A15 map to P4.3–P4.6. The ADC includes autoscan mode and a data transfer controller (DTC) to autonomously move conversion results to memory without CPU intervention.

What debug interface does the MSP430F2272TDAR support?

The MSP430F2272TDAR supports the Spy-Bi-Wire (SBW) debug interface using two pins: TEST/SBWTCK (Pin 1) and RST/NMI/SBWTDIO (Pin 6). This 2-wire interface enables full-speed programming and debugging via tools like MSP-FET430UIF, eliminating the need for a 4-wire JTAG header and reducing PCB footprint.