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Texas Instruments MSP430F2274IYFFR

Name: MSP430F2274IYFFR
Brand: Texas Instruments
SKU: MSP430F2274IYFFR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MSP430F2274IYFFR

Manufacturer:: Texas Instruments

Category:: Microcontrollers

Package:: 49-UFBGA, DSBGA

Datasheet:: MSP430F2274IYFFR.pdf

Description:: IC MCU 16BIT 32KB FLASH 49DSBGA

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Product details

Overview

MSP430F2274IYFFR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 32KB+256B flash memory, 1KB RAM, dual operational amplifiers, 10-bit 200-ksps ADC with integrated reference and data transfer controller, two 16-bit timers (Timer_A3 and Timer_B3), USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C), and 32 I/O pins - deployed in sensor signal acquisition, battery-powered measurement, and RF front-end control systems.

For engineers reviewing the MSP430F2274IYFFR datasheet, MSP430F2274IYFFR pinout, MSP430F2274IYFFR application, or MSP430F2274IYFFR equivalent, key selection considerations include its YFF 49-pin BGA package, −40°C to +85°C industrial temperature grade, dual-op-amp analog front-end capability, ultra-low active-mode current (270 µA @ 1 MHz, 2.2 V), and Spy-Bi-Wire debug interface compatibility.

Technical Context

The MSP430F2274IYFFR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations and high code efficiency. Its clock system integrates a digitally controlled oscillator (DCO) with four factory-calibrated frequencies (±1%), plus support for 32-kHz crystal, HF crystal up to 16 MHz, resonator, or external digital clock source.

It features two independent 16-bit timers with capture/compare registers, a 10-bit ADC with autoscan and DTC for autonomous data movement, and dual USCI modules supporting UART (with LIN auto-baud), IrDA, SPI, and I²C protocols - all operating under five software-selectable low-power modes, including LPM4 with 0.1 µA off-mode RAM retention.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	16-bit RISC CPU with 16 registers and 62.5-ns instruction cycle time - enables deterministic real-time control and efficient C compilation.
Flash / RAM	32KB + 256B flash memory and 1KB RAM - supports complex firmware with bootloader, calibration tables, and sensor buffering.
ADC Resolution & Speed	10-bit, 200-ksps SAR ADC with internal reference, sample-and-hold, autoscan, and DTC - eliminates need for external DMA controller in multi-channel sensing.
Ultra-Low Power	Active mode: 270 µA @ 1 MHz, 2.2 V; Standby: 0.7 µA; Off mode (RAM retention): 0.1 µA - extends coin-cell battery life to years in intermittent wake-up applications.
Operating Voltage	1.8 V to 3.6 V supply range - compatible with single Li-ion, two alkaline, or regulated 3.3 V rails without level-shifting.
Package & Temp	49-pin YFF (3.33 × 3.49 mm) BGA, −40°C to +85°C - suitable for space-constrained industrial and portable PCB layouts.
Debug Interface	Spy-Bi-Wire (2-wire JTAG) via TEST/SBWTCK and RST/NMI/SBWTDIO - enables in-system programming and real-time debugging with minimal pin overhead.

Pinout & Package

Package: 49-pin YFF (3.33 mm × 3.49 mm) plastic ball grid array (BGA), RoHS-compliant, lead-free, with exposed thermal pad connected to DVSS.

Pin/Terminal	Circuit Role	Design Meaning
TEST/SBWTCK (YFF Pin A1)	Spy-Bi-Wire test clock input	Enables 2-wire JTAG programming and debug; requires pull-down resistor for normal operation.
RST/NMI/SBWTDIO (YFF Pin B3)	Reset / nonmaskable interrupt / debug I/O	Combines power-on reset, NMI trigger, and bidirectional debug data path - critical for secure boot and field firmware updates.
P2.0/ACLK/A0/OA0I0 (YFF Pin A4)	ACLK output / ADC channel 0 / OA0 inverting input	Supports low-frequency timing, analog sensing, and op-amp buffer configuration - enables synchronized analog-digital subsystems.
P2.3/TA1/A3/VREF−/VeREF−/OA1I1/OA1O (YFF Pin F3)	Timer_A1 input / ADC channel 3 / OA1 in/out / VREF−	Multi-function pin enabling precision ratiometric measurements, op-amp gain-setting, and flexible analog signal routing.
P4.3/TB0/A12/OA0O (YFF Pin E7)	Timer_B0 output / ADC channel 12 / OA0 output	Allows simultaneous PWM generation, analog monitoring, and op-amp output driving - ideal for closed-loop sensor actuation.
DVCC / AVCC (YFF Pins C1, D3, D4, E4, E5, C6, C7)	Digital and analog supply voltage inputs	Separate DVCC/AVCC domains with dedicated decoupling pads reduce digital noise coupling into sensitive analog circuits.
DVSS / AVSS (YFF Pins B1, B2, C3, C4, B7, C5)	Digital and analog ground references	Independent ground planes minimize return-path interference between MCU logic and ADC/op-amp sections.

Key Features

Feature	Design Value
Dual configurable op amps (OA0/OA1)	Enable on-chip signal conditioning (gain, filtering, buffering) before ADC sampling - reduces external component count and board area.
USCI_A0 with LIN auto-baud detection	Permits direct connection to automotive LIN bus without external transceiver or baud-rate configuration - simplifies diagnostics and sensor networking.
10-bit ADC with DTC and autoscan	Automatically sequences across up to 12 channels and transfers results to RAM without CPU intervention - frees MCU for computation during acquisition.
Brownout detector with hysteresis	Prevents erratic operation during brownout conditions by asserting reset at ~1.7 V and releasing at ~1.8 V - ensures reliable startup and shutdown behavior.
On-chip bootstrap loader (BSL)	Enables UART-based firmware updates in the field without JTAG hardware - supports remote device reprogramming and security-keyed access.
Five low-power modes with sub-µs wake-up	Wakes from LPM4 to active mode in <1 µs using DCO - captures fast transients while maintaining multi-year battery life in duty-cycled sensors.

Applications

Wireless Sensor Node	Portable Medical Monitor
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and CO₂ via analog front-end and transmitting data over BLE or sub-GHz RF link. IC Role / Device Role / Timing Role: Central MCU managing analog acquisition, digital signal preprocessing, low-power scheduling, and host interface protocol stack. Use Value: Dual op amps condition weak sensor outputs; 200-ksps ADC resolves rapid transients; 0.1 µA off-mode preserves battery for >5 years in sleep-dominated operation.	Use Scenario: Handheld pulse oximeter acquiring photodiode signals, computing SpO₂ and heart rate, and displaying results on OLED. IC Role / Device Role / Timing Role: Mixed-signal controller performing synchronous LED drive timing, analog signal demodulation, and real-time algorithm execution. Use Value: Integrated op amps enable transimpedance amplification and AC/DC signal separation; DTC automates multi-wavelength sampling; 1.8–3.6 V range matches single-cell LiPo supply.
Industrial Process Transmitter	Smart Meter Analog Front-End
Use Scenario: 4–20 mA loop-powered transmitter converting pressure/flow sensor output and communicating via HART protocol. IC Role / Device Role / Timing Role: Low-power signal processor interfacing with precision DAC, isolating UART, and regulating loop current. Use Value: Dual op amps implement programmable gain and offset correction; LIN-capable USCI_A0 handles HART FSK modulation/demodulation; brownout detector ensures safe fail-safe behavior.	Use Scenario: Electricity meter measuring voltage/current waveforms using shunt or CT sensors, calculating RMS, harmonics, and energy consumption. IC Role / Device Role / Timing Role: High-accuracy ADC controller synchronizing sampling across multiple channels with precise timing derived from crystal oscillator. Use Value: 12-channel autoscan ADC captures full waveform cycles; internal reference ensures stable accuracy across temperature; 32-kHz crystal supports real-time clock and metrology timing.

Wireless Sensor Node

Portable Medical Monitor

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and CO₂ via analog front-end and transmitting data over BLE or sub-GHz RF link.

IC Role / Device Role / Timing Role: Central MCU managing analog acquisition, digital signal preprocessing, low-power scheduling, and host interface protocol stack.

Use Value: Dual op amps condition weak sensor outputs; 200-ksps ADC resolves rapid transients; 0.1 µA off-mode preserves battery for >5 years in sleep-dominated operation.

Use Scenario: Handheld pulse oximeter acquiring photodiode signals, computing SpO₂ and heart rate, and displaying results on OLED.

IC Role / Device Role / Timing Role: Mixed-signal controller performing synchronous LED drive timing, analog signal demodulation, and real-time algorithm execution.

Use Value: Integrated op amps enable transimpedance amplification and AC/DC signal separation; DTC automates multi-wavelength sampling; 1.8–3.6 V range matches single-cell LiPo supply.

Industrial Process Transmitter

Smart Meter Analog Front-End

Use Scenario: 4–20 mA loop-powered transmitter converting pressure/flow sensor output and communicating via HART protocol.

IC Role / Device Role / Timing Role: Low-power signal processor interfacing with precision DAC, isolating UART, and regulating loop current.

Use Value: Dual op amps implement programmable gain and offset correction; LIN-capable USCI_A0 handles HART FSK modulation/demodulation; brownout detector ensures safe fail-safe behavior.

Use Scenario: Electricity meter measuring voltage/current waveforms using shunt or CT sensors, calculating RMS, harmonics, and energy consumption.

IC Role / Device Role / Timing Role: High-accuracy ADC controller synchronizing sampling across multiple channels with precise timing derived from crystal oscillator.

Use Value: 12-channel autoscan ADC captures full waveform cycles; internal reference ensures stable accuracy across temperature; 32-kHz crystal supports real-time clock and metrology timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MSP430F2272IYFFR	32KB+256B flash, 512B RAM, no op amps - identical pinout and peripheral set except missing OA0/OA1.	Not suitable for applications requiring on-chip analog signal conditioning; lower RAM limits complex buffering or communication stacks.	Select when analog front-end is implemented externally and cost reduction is prioritized over op-amp integration.
MSP430F5529IPN	128KB flash, 8KB RAM, USB, higher-speed CPU (25 MHz), but larger 80-pin TQFP package and higher active current (165 µA/MHz).	Targets USB-connected devices and more computationally intensive tasks; lacks integrated op amps and has different low-power profile.	Choose when USB connectivity, larger code space, or higher processing throughput outweighs ultra-low-power and analog integration requirements.

Compared with MSP430F2272IYFFR, the MSP430F2274IYFFR adds dual op amps for analog signal chain integration without increasing footprint; versus MSP430F5529IPN, it delivers superior µA/MHz efficiency and smaller BGA form factor at the expense of USB and memory capacity.

Availability

MSP430F2274IYFFR is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, and industrial process transmitters requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for MSP430F2274IYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design and industrial-grade reliability.

The MSP430F2274IYFFR belongs to the MSP430F2xx ultra-low-power mixed-signal microcontroller family, engineered specifically for battery-operated and energy-harvesting applications where extended runtime, analog integration, and robust operation in harsh environments are essential.

FAQ

What is the maximum operating frequency of the MSP430F2274IYFFR?

The MSP430F2274IYFFR supports a maximum system clock (MCLK) frequency of 16 MHz using an external HF crystal or resonator. Its internal DCO is factory-calibrated to ±1% at four frequencies (up to 16 MHz), enabling fast wake-up and precise timing without external components in many applications. The CPU executes instructions at 62.5-ns cycle time at full speed, and the MSP430F2274IYFFR maintains full functionality across its 1.8–3.6 V supply range at this rate.

Does the MSP430F2274IYFFR include hardware debug support?

Yes, the MSP430F2274IYFFR integrates an Embedded Emulation Module (EEM) and supports Spy-Bi-Wire (2-wire JTAG) debugging via TEST/SBWTCK and RST/NMI/SBWTDIO pins. This allows full-speed real-time debugging, breakpoint setting, and flash programming without requiring a dedicated 4-pin JTAG header. The MSP430F2274IYFFR is compatible with TI's MSP-FET430UIF and MSP-GANG430 tools for development and production programming.

How many analog input channels does the MSP430F2274IYFFR ADC support?

The MSP430F2274IYFFR features a 10-bit successive-approximation ADC (ADC10) with up to 12 selectable analog input channels: A0–A7 (P2.0, P2.1, P2.2, P2.3, P2.4, P3.6, P3.7) plus A12–A15 (P4.3, P4.4, P4.5, P4.6). Channel selection is fully software-configurable, and the DTC enables automatic result storage in RAM without CPU involvement - a capability confirmed in the SLAS504G datasheet for the MSP430F2274IYFFR variant.

Is the MSP430F2274IYFFR pin-compatible with other MSP430F22x4 devices?

Yes, the MSP430F2274IYFFR shares identical pinout, package dimensions, and terminal functions with all other MSP430F22x4 variants in the YFF package (e.g., MSP430F2234IYFF, MSP430F2254IYFF), as verified in Tables 1 and 4 of SLAS504G. This allows drop-in replacement within the same family when flash/RAM requirements differ - provided software is updated to match memory map and peripheral enable settings for the MSP430F2274IYFFR.

What are the key differences between MSP430F2274IYFFR and MSP430F2274IDA?

The MSP430F2274IYFFR (49-pin YFF BGA) and MSP430F2274IDA (38-pin TSSOP) share identical core specifications - 32KB+256B flash, 1KB RAM, dual op amps, ADC, timers, and USCI modules - but differ in package type, pin count, thermal performance, and board-level integration. The YFF package offers higher I/O density and better thermal dissipation in compact layouts, while the TSSOP provides easier prototyping and rework. Both operate across −40°C to +85°C and use the same firmware binary.

MSP430F2274IYFFR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 49-UFBGA, DSBGA

Series:: MSP430F2xx

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: MSP430 CPU16

Core Size:: 16-Bit

Speed:: 16MHz

Connectivity:: I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals:: Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O:: 32

Program Memory Size:: 32KB (32K x 8 + 256B)

Program Memory Type:: FLASH

EEPROM Size:: -

RAM Size:: 1K x 8

Voltage - Supply (Vcc/Vdd):: 1.8V ~ 3.6V

Data Converters:: A/D 12x10b

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

MSP430F2274IYFFR FAQ

1.How can I place an order for MSP430F2274IYFFR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F2274IYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F2274IYFFR reliable?

The price and inventory of MSP430F2274IYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2274IYFFR is usually 5 days.

3.What payment methods are accepted for MSP430F2274IYFFR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2274IYFFR transactions.

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4.How is shipping managed for MSP430F2274IYFFR?

MSP430F2274IYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F2274IYFFR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F2274IYFFR?

For technical support, including MSP430F2274IYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2274IYFFR requirements.

6.How does Aetrix verify that MSP430F2274IYFFR is sourced from the original manufacturer or authorized distributors?

All MSP430F2274IYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2274IYFFR meets industry standards.

7.What is the process for return or replacement of MSP430F2274IYFFR?

All MSP430F2274IYFFR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2274IYFFR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F2274IYFFR part is unused and in its original packaging.

Return procedure for MSP430F2274IYFFR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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