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Texas Instruments MSP430F2274MDATEP
- Part No.:
- MSP430F2274MDATEP
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TSSOP (0.240", 6.10mm Width)
- Datasheet:
-
MSP430F2274MDATEP.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:308
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Product details
Overview
MSP430F2274MDATEP from Texas Instruments is an ultralow-power 16-bit mixed-signal microcontroller featuring 32KB flash, 1KB RAM, a 10-bit 200-ksps ADC with DTC and internal reference, two configurable op amps, dual 16-bit timers (Timer_A3 and Timer_B3), and USCI modules supporting UART/LIN/IrDA/SPI/I²C - deployed in sensor front ends, battery-powered instrumentation, and radiation-tolerant telemetry systems.
For engineers reviewing the MSP430F2274MDATEP datasheet, MSP430F2274MDATEP pinout, MSP430F2274MDATEP application, or MSP430F2274MDATEP equivalent, key selection criteria include extended temperature operation (–55°C to 125°C), EP-grade reliability for defense/aerospace use, Spy-Bi-Wire debug interface, and integrated analog signal conditioning capability without external amplifiers.
Technical Context
The MSP430F2274MDATEP implements a 16-bit RISC CPU with 62.5 ns instruction cycle time, five software-selectable low-power modes (LPM0–LPM4), and a digitally controlled oscillator (DCO) enabling wake-up from standby in under 1 μs. Its clock system integrates ACLK (32-kHz crystal or LF oscillator), MCLK (up to 16 MHz), and SMCLK with four factory-calibrated DCO frequencies (1/8/12/16 MHz ±1%).
Peripherals are memory-mapped and fully accessible via all CPU instructions. The ADC10 includes autoscan across 12 analog inputs, sample-and-hold, and a data transfer controller (DTC) that autonomously stores conversion results to RAM. Both OA0 and OA1 support flexible input/output routing to ports P2–P4 for programmable signal conditioning prior to digitization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with seven addressing modes; register-to-register execution in one cycle |
| Memory | 32KB + 256B flash (main + info segments), 1KB RAM - supports in-system programming via BSL or Spy-Bi-Wire |
| ADC Performance | 10-bit SAR, 200 ksps max sampling rate, internal 1.5V reference, 12-channel autoscan with DTC |
| Power Consumption | Active mode: 270 μA @ 1 MHz / 2.2 V; Standby: 0.7 μA; Off mode (RAM retention): 0.1 μA |
| Operating Temperature | –55°C to +125°C - qualified for military, aerospace, and medical applications per EP specifications |
| Communication Interfaces | USCI_A0 (UART/LIN/IrDA/SPI), USCI_B0 (SPI/I²C), JTAG/Spy-Bi-Wire debug |
| Analog Peripherals | Two independent op amps (OA0/OA1); each supports multiple input sources (A0–A7, A12–A15) and output routing |
Pinout & Package
Package: 38-pin Thin Shrink Small-Outline (DA/TSSOP), 0.65 mm pitch, body size 9.7 × 4.4 mm. Pin 1 marked with dot; thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TACLK/ADC10CLK | Timer_A clock input / ADC conversion clock | Enables synchronous sampling triggered by external timer or internal clock source |
| P2.0/ACLK/A0/OA0I0 | ACLK output / ADC channel A0 / OA0 input 0 | Shared analog/digital resource allows direct connection of sensor signal to op amp or ADC |
| P2.3/TA1/A3/VREF–/VeREF–/OA1I1/OA1O | ADC reference negative / OA1 input 1 or output | Configurable as reference sink or op amp node - enables rail-to-rail input range adjustment |
| P3.4/UCA0TXD/UCA0SIMO | USCI_A0 transmit data / SPI master out | Single pin serves UART TX or SPI MOSI - reduces I/O count in space-constrained designs |
| RST/NMI/SBWTDIO | Reset / nonmaskable interrupt / debug I/O | Spy-Bi-Wire bidirectional debug interface uses only this pin plus TEST/SBWTCK - minimal PCB footprint |
| TEST/SBWTCK | Debug test clock input | Second pin required for full-programmability and on-chip emulation - no external debugger voltage needed |
Key Features
| Feature | Design Value |
|---|---|
| Ultralow-power operation | 0.1 μA off-mode current preserves battery life in dormant telemetry nodes for years |
| Integrated analog front end | Two op amps + 12-channel ADC eliminate need for external signal conditioning ICs in sensor nodes |
| Factory-calibrated DCO | Four precision frequencies (1/8/12/16 MHz ±1%) enable accurate timing without external crystal |
| Enhanced UART with LIN support | Auto-baud-rate detection simplifies integration into automotive sub-networks without host coordination |
| Extended product lifecycle | Controlled baseline, single assembly/test/fab site, and product traceability meet MIL-PRF-38535 requirements |
Applications
| Wireless Sensor Node | Avionics Health Monitor |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature, pressure, and humidity data at 10-second intervals for transmission via LoRaWAN. IC Role / Device Role / Timing Role: Central MCU executing sensor polling, ADC conversion, op-amp gain scaling, data formatting, and low-power radio control. Use Value: 0.7 μA standby current extends 2xAA battery life beyond 5 years; integrated DTC automates 12-channel scan without CPU wake-up. |
Use Scenario: Real-time monitoring of hydraulic pressure, vibration, and valve position in fighter jet landing gear subsystems. IC Role / Device Role / Timing Role: Radiation-hardened controller acquiring analog signals, detecting fault thresholds, and triggering discrete alerts over MIL-STD-1553 bus. Use Value: –55°C to 125°C operation ensures reliability during high-G maneuvers; brownout detector prevents erratic behavior during power transients. |
| Medical Implant Telemetry | Spacecraft Payload Controller |
Use Scenario: Subcutaneous glucose monitor transmitting calibrated analog readings to NFC-enabled reader every 5 minutes. IC Role / Device Role / Timing Role: Signal conditioner (OA0/OA1), ADC converter, secure bootloader-enforced firmware updater, and NFC interface manager. Use Value: On-chip op amps provide programmable gain/offset for sensor offset compensation; BSL password protection meets FDA cybersecurity guidance. |
Use Scenario: Radiation-tolerant controller for star tracker calibration, managing photodiode array readout and thermal compensation algorithms. IC Role / Device Role / Timing Role: High-reliability timing core (ACLK from 32-kHz crystal), ADC for thermistor readings, and SPI master for CCD configuration. Use Value: EP-grade qualification ensures >100 krad(Si) TID tolerance; internal DCO provides backup timing if crystal fails in orbit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2274IRHAT | Same core/peripherals but commercial-grade (–40°C to 85°C), QFN-40 package, no EP process controls | Lacks radiation tolerance, extended temp range, and controlled baseline - unsuitable for defense/aerospace deployment | Select only for cost-sensitive terrestrial industrial prototypes where EP reliability is unnecessary |
| MSP430F2617TPMR | Higher-end variant: 116KB flash, 8KB RAM, DMA, hardware multiplier, 12-bit DAC, enhanced USCI | Supports complex motor control and real-time FFT processing - over-spec for simple sensor acquisition | Choose when future firmware expansion, higher-resolution analog output, or computational headroom is required |
Compared with MSP430F2274IRHAT, the MSP430F2274MDATEP delivers guaranteed operation at extreme temperatures and radiation-hardened process integrity; versus MSP430F2617TPMR, it offers optimal balance of analog integration, ultra-low power, and EP compliance without unnecessary overhead.
Availability
MSP430F2274MDATEP is available at Aetrix Electronics and suitable for defense electronics, aerospace telemetry, and medical implantable device programs requiring stable component supply across extended product lifecycles and rigorous environmental certification.
Supply support for MSP430F2274MDATEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of heritage in low-power microcontrollers and space-grade components.
The MSP430F2274MDATEP belongs to TI's MSP430x2xx EP family - engineered specifically for mission-critical applications demanding extended temperature operation, radiation tolerance, and long-term supply assurance in defense, aerospace, and medical systems.
FAQ
What is the operating temperature range of the MSP430F2274MDATEP?
The MSP430F2274MDATEP is rated for continuous operation from –55°C to +125°C. This extended temperature range is validated per MIL-PRF-38535 requirements and supports deployment in jet engine bays, satellite payload compartments, and deep-implantable medical devices where ambient conditions exceed commercial-grade limits.
Does the MSP430F2274MDATEP include on-chip debug capability?
Yes, the MSP430F2274MDATEP integrates full Spy-Bi-Wire (SBW) debug support using only two pins - RST/NMI/SBWTDIO and TEST/SBWTCK. This enables in-circuit programming, real-time breakpoints, and register inspection without requiring a full 4-wire JTAG interface, reducing board space and test complexity.
How many analog input channels does the ADC10 support on the MSP430F2274MDATEP?
The ADC10 module in the MSP430F2274MDATEP supports up to 12 analog input channels (A0–A7, A12–A15), selectable via ADC10AE0 and ADC10AE1 registers. Autoscan mode allows sequential conversion of all enabled channels with automatic result storage via the Data Transfer Controller (DTC), eliminating CPU intervention.
Can the operational amplifiers in the MSP430F2274MDATEP be used independently?
Yes, the MSP430F2274MDATEP contains two fully independent operational amplifiers - OA0 and OA1 - each with configurable inputs (multiple port pins) and outputs (including dedicated OA0O/OA1O pins). They can operate simultaneously in different topologies (e.g., OA0 as PGA, OA1 as comparator) without shared resource conflict.
Is the MSP430F2274MDATEP pin-compatible with other MSP430F2274 variants?
No - the MSP430F2274MDATEP uses a 38-pin DA (TSSOP) package, while the functionally identical MSP430F2274MRHATEP uses a 40-pin QFN (RHA) package. Pin mappings differ significantly between packages; PCB layout must be redesigned when switching between them, despite identical peripheral functionality and register compatibility.
MSP430F2274MDATEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TSSOP (0.240", 6.10mm Width)
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 32KB (32K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2274MDATEP FAQ
1.How can I place an order for MSP430F2274MDATEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2274MDATEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2274MDATEP reliable?
The price and inventory of MSP430F2274MDATEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2274MDATEP is usually 5 days.
3.What payment methods are accepted for MSP430F2274MDATEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2274MDATEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2274MDATEP?
MSP430F2274MDATEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2274MDATEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2274MDATEP?
For technical support, including MSP430F2274MDATEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2274MDATEP requirements.
6.How does Aetrix verify that MSP430F2274MDATEP is sourced from the original manufacturer or authorized distributors?
All MSP430F2274MDATEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2274MDATEP meets industry standards.
7.What is the process for return or replacement of MSP430F2274MDATEP?
All MSP430F2274MDATEP units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2274MDATEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2274MDATEP part is unused and in its original packaging.
Return procedure for MSP430F2274MDATEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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