My Inquiry
My Account
Texas Instruments MSP430F2274TDAR
- Part No.:
- MSP430F2274TDAR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 38-TSSOP (0.240", 6.10mm Width)
- Datasheet:
-
MSP430F2274TDAR.pdf
- Description:
- IC MCU 16BIT 32KB FLASH 38TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,749
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F2274TDAR from Texas Instruments is an ultra-low-power 16-bit mixed-signal microcontroller featuring 32KB+256B flash memory, 1KB RAM, dual 16-bit timers (Timer_A and Timer_B), a 10-bit 200-ksps ADC with integrated reference and data transfer controller, two operational amplifiers, and USCI modules supporting UART/LIN, IrDA, SPI, and I²C. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and RF front ends.
For engineers reviewing the MSP430F2274TDAR datasheet, MSP430F2274TDAR pinout, MSP430F2274TDAR application, or MSP430F2274TDAR equivalent, key selection criteria include its 38-pin TSSOP (DA) package, -40°C to 105°C temperature grade, dual op-amp support, 32KB flash capacity, and Spy-Bi-Wire debug interface compatibility.
Technical Context
The MSP430F2274TDAR implements a 16-bit RISC CPU with constant generators and seven addressing modes, enabling single-cycle register operations. Its clock system includes a digitally controlled oscillator (DCO) with four factory-calibrated frequencies (±1%), internal VLO, and support for 32-kHz crystal, HF crystal up to 16 MHz, resonator, or external digital clock source.
It integrates two independent operational amplifiers (OA0 and OA1) with multiple input/output configurations per channel, a 12-channel ADC10 with autoscan and DTC, and two USCI modules - USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C). Power management supports six operating modes, including LPM4 with 0.1 µA off-mode current and sub-1-µs wake-up from standby.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 16 registers and 62.5-ns instruction cycle time at 16 MHz |
| Flash Memory | 32KB + 256B program memory with security fuse and bootloader support |
| RAM | 1KB on-chip SRAM for data and stack storage |
| ADC | 10-bit, 200-ksps SAR ADC with 12 analog inputs, internal reference, sample-and-hold, autoscan, and DTC |
| Timers | Two 16-bit timers: Timer_A with three capture/compare registers; Timer_B with three capture/compare registers and shadow registers |
| USCI Peripherals | USCI_A0 (UART/LIN/IrDA/SPI) and USCI_B0 (SPI/I²C) with independent clocking and interrupt control |
| Op Amps | Two rail-to-rail operational amplifiers (OA0, OA1) with configurable inputs/outputs and gain options |
| Supply Range | 1.8 V to 3.6 V operation with brownout detector and 0.1 µA off-mode (RAM retention) |
Pinout & Package
Package: 38-pin Thin Shrink Small-Outline Package (TSSOP), suffix "DA", JEDEC MO-153, body size 9.7 mm × 4.4 mm × 1.2 mm, lead pitch 0.65 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 / TEST/SBWTCK | Spy-Bi-Wire test clock input | Enables programming and debugging via 2-wire interface; no JTAG pins required |
| 6 / RST/NMI/SBWTDIO | Reset/nonmaskable interrupt/test data I/O | Active-low reset, NMI input, and bidirectional test data line for Spy-Bi-Wire |
| 7–10, 14–19, 25–38 / P1.x–P4.x | General-purpose I/O with peripheral multiplexing | 32 GPIO pins with interrupt capability, pull-up/down resistors, and timer/ADC/USCI function overlay |
| 2 / DVCC, 23 / AVCC, 4 / DVSS, 22 / AVSS | Digital/analog power and ground | Separate supply domains isolate noise-sensitive analog circuitry (ADC, op amps) from digital switching |
| 5 / XIN/P2.6, 4 / XOUT/P2.7 | Crystal oscillator input/output | Supports 32-kHz low-frequency and up to 16-MHz high-frequency crystals for precise timing |
| 30 / P2.4, 29 / P2.3 | VREF+/VREF− for ADC | Configurable internal/external reference inputs enabling ratiometric or absolute voltage measurements |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 0.1 µA off-mode (RAM retention), 0.7 µA standby, 270 µA active @ 1 MHz/2.2 V enables multi-year battery life |
| Dual integrated op amps | OA0 and OA1 support sensor signal conditioning (e.g., bridge amplification, filtering) without external components |
| Enhanced UART with LIN auto-baud | USCI_A0 detects LIN bus baud rate automatically, simplifying integration into automotive body electronics networks |
| On-chip emulation module | Embedded Emulation Module (EEM) enables real-time debugging, breakpoints, and flash programming via Spy-Bi-Wire |
| Programmable code protection | Security fuse prevents unauthorized read-out of flash contents, protecting firmware IP in production devices |
| 12-channel ADC with DTC | Data Transfer Controller automates ADC result movement to RAM without CPU intervention, reducing active time and power |
Applications
| Wireless Sensor Node | Industrial Process Monitor |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and pressure data for periodic wireless transmission. IC Role / Device Role / Timing Role: Central MCU managing sensor interfacing (ADC, op amps), data processing, low-power scheduling, and UART-based radio communication. Use Value: Sub-1-µs wake-up and 0.1 µA off-mode extend coin-cell battery life beyond 5 years while maintaining measurement accuracy via integrated reference and DTC. | Use Scenario: DIN-rail mounted device monitoring motor current, vibration, and ambient temperature in factory automation systems. IC Role / Device Role / Timing Role: Signal acquisition MCU with dual op amps conditioning analog transducer outputs and ADC digitizing results for Modbus RTU over RS-485. Use Value: Integrated op amps eliminate external instrumentation amplifiers; 105°C rating ensures reliable operation in hot industrial enclosures. |
| Smart Meter Front End | Portable Medical Diagnostic Tool |
Use Scenario: Electricity meter measuring voltage/current waveforms using shunt or CT sensors, computing RMS, harmonics, and energy consumption. IC Role / Device Role / Timing Role: High-precision analog front-end controller performing synchronized sampling, filtering, and preprocessing before sending data to host processor. Use Value: 12-channel ADC with autoscan and DTC captures multi-phase waveforms continuously; dual op amps enable programmable gain for wide dynamic range. | Use Scenario: Handheld pulse oximeter acquiring photodiode signals, applying analog filtering and amplification, and calculating SpO₂ saturation. IC Role / Device Role / Timing Role: Mixed-signal SoC integrating optical signal conditioning (op amps), ADC conversion, LED drive control, and Bluetooth UART interface. Use Value: On-chip op amps reduce BOM count and board space; ultra-low-power modes maximize clinical usage time between charges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2274TRHA | Same core, peripherals, and memory; differs only in 40-pin QFN (RHA) package instead of 38-pin TSSOP (DA) | Requires PCB redesign for smaller footprint and thermal pad; better thermal performance but higher assembly cost | Select when board space is constrained and reflow-compatible assembly is available |
| MSP430F2272IDA | Identical DA package and pinout, but reduced memory: 32KB+256B flash → 16KB+256B flash; same 1KB RAM and peripherals | Suitable for simpler firmware with lower code size; lacks headroom for future feature expansion or OTA updates | Select when application firmware fits within 16KB and long-term scalability is not required |
Compared with MSP430F2274TRHA and MSP430F2272IDA, the MSP430F2274TDAR uniquely combines full 32KB flash, dual op amps, and the industry-standard 38-pin TSSOP package-enabling drop-in compatibility with legacy MSP430F2xx designs while retaining maximum firmware flexibility and analog integration.
Availability
MSP430F2274TDAR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial process monitors, and smart meter front ends requiring stable component supply across extended product lifecycles.
Supply support for MSP430F2274TDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, personal electronics, and communications markets.
The MSP430F2274TDAR belongs to the MSP430F2xx ultra-low-power microcontroller family, designed specifically for battery-operated and energy-constrained applications where extended runtime, precision analog integration, and robust debug capability are essential.
FAQ
What is the operating temperature range for the MSP430F2274TDAR?
The MSP430F2274TDAR is rated for industrial operation from –40°C to +105°C. This extended temperature range is confirmed by TI's SLAS504G datasheet and applies specifically to the "T" grade variant (e.g., MSP430F2274Txx), making it suitable for deployment in harsh environments such as factory floors, outdoor metering, and automotive under-hood applications where thermal stability is critical. The "DAR" suffix denotes the 38-pin TSSOP package with tape-and-reel packaging.
Does the MSP430F2274TDAR include hardware debug support?
Yes, the MSP430F2274TDAR includes an Embedded Emulation Module (EEM) that enables full hardware debugging via the Spy-Bi-Wire interface using only two pins (TEST/SBWTCK and RST/NMI/SBWTDIO). This allows real-time breakpoints, register inspection, and flash programming without requiring a full 4-pin JTAG connector. TI's MSP-FET430UIF and MSP-FET430U38 tools are fully compatible with the MSP430F2274TDAR for development and production programming.
How many analog input channels does the ADC10 support on the MSP430F2274TDAR?
The ADC10 module in the MSP430F2274TDAR supports 12 analog input channels (A0–A7, A12–A15), as documented in Tables 3 and 4 of the SLAS504G datasheet. These channels are accessible through dedicated pins including P2.0/A0, P2.1/A1, P2.2/A2, P2.3/A3, P2.4/A4, P3.0/A5, P3.6/A6, P3.7/A7, P4.3/A12, P4.4/A13, P4.5/A14, and P4.6/A15. The autoscan mode allows sequential conversion without CPU intervention, coordinated by the Data Transfer Controller (DTC).
Can the operational amplifiers in the MSP430F2274TDAR be used in instrumentation amplifier configurations?
Yes, the two operational amplifiers (OA0 and OA1) in the MSP430F2274TDAR support multiple configurations including non-inverting, inverting, differential, and programmable-gain setups. Pin mappings such as P2.0/OA0I0, P2.1/OA0O, P2.2/OA0I1, and P3.6/OA0I2 allow flexible external feedback network implementation. While not a monolithic instrumentation amplifier, the dual-op-amp architecture enables discrete 3-op-amp INA topologies using external resistors-ideal for low-noise sensor signal conditioning in precision measurement applications.
Is the MSP430F2274TDAR pin-compatible with other MSP430F22x4 variants in the same package?
Yes, the MSP430F2274TDAR is fully pin-compatible with all other MSP430F22x4 family members (e.g., MSP430F2234TDAR, MSP430F2254TDAR) in the 38-pin TSSOP (DA) package. Pin functions-including I/O, analog inputs, timer capture/compare, USCI signals, and op amp terminals-are identical across the F22x4 series. Firmware and hardware designs can be reused across these variants, differing only in flash/RAM size and minor peripheral enablement, as defined in TI's SLAS504G datasheet Table 1.
MSP430F2274TDAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 38-TSSOP (0.240", 6.10mm Width)
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 32KB (32K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2274TDAR FAQ
1.How can I place an order for MSP430F2274TDAR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2274TDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2274TDAR reliable?
The price and inventory of MSP430F2274TDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2274TDAR is usually 5 days.
3.What payment methods are accepted for MSP430F2274TDAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2274TDAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2274TDAR?
MSP430F2274TDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2274TDAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2274TDAR?
For technical support, including MSP430F2274TDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2274TDAR requirements.
6.How does Aetrix verify that MSP430F2274TDAR is sourced from the original manufacturer or authorized distributors?
All MSP430F2274TDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2274TDAR meets industry standards.
7.What is the process for return or replacement of MSP430F2274TDAR?
All MSP430F2274TDAR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2274TDAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2274TDAR part is unused and in its original packaging.
Return procedure for MSP430F2274TDAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F2274TDAR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
