Texas Instruments MSP430F2419TZQWR
- Part No.:
- MSP430F2419TZQWR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 113-VFBGA
- Datasheet:
-
MSP430F2419TZQWR.pdf
- Description:
- IC MCU 16BIT 120KB FLASH 113BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,995
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Product details
Overview
MSP430F2419TZQWR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 120KB+256B flash, 4KB RAM, 12-bit ADC, dual USCI_A/USCI_B modules (UART/I²C/SPI), 16-bit Timer_A and Timer_B, and on-chip comparator - designed for battery-powered sensor systems and portable medical devices operating from 1.8 V to 3.6 V.
For engineers reviewing the MSP430F2419TZQWR datasheet, MSP430F2419TZQWR pinout, MSP430F2419TZQWR application, or MSP430F2419TZQWR equivalent, key selection criteria include LPM4 current (0.1 µA), wake-up time (<1 µs), ADC12 resolution (12-bit, 8-channel), I/O count (48), and MicroStar Junior BGA (113-ball) package compatibility with medical imaging layouts.
Technical Context
The MSP430F2419TZQWR implements a 16-bit CPU with constant generators and calibrated DCO enabling sub-1-µs wake-up from LPM4. Its peripheral set includes ADC12 with internal reference and autoscan, two USCI_A modules supporting UART/LIN/IrDA/SPI, and two USCI_B modules supporting I²C and SPI - all configurable without DMA (not present in F241x series).
Unlike the MSP430F261x family, the MSP430F2419TZQWR omits DAC12 and DMA modules but retains identical Timer_A3, Timer_B7, Comparator_A+, and USCI architecture - making it suitable for measurement applications requiring analog sensing and serial communication without voltage-output DAC or memory-mapped data movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle; enables high code efficiency in low-power firmware. |
| Flash / RAM | 120KB + 256B flash / 4KB RAM; supports complex sensor fusion algorithms and bootloader storage. |
| ADC12 | 12-bit, 8-channel SAR ADC with internal reference and autoscan; delivers ±1 LSB INL for precision analog front-end design. |
| USCI Modules | 2 × USCI_A (UART/IrDA/SPI) + 2 × USCI_B (I²C/SPI); enables concurrent wired communication on multiple protocols. |
| Low-Power Modes | LPM4 draws 0.1 µA (RAM retention); supports multi-year battery life in always-on monitoring nodes. |
| Wake-up Time | <1 µs from LPM4; ensures deterministic real-time response to external interrupts or timer events. |
| Supply Range | 1.8 V to 3.6 V; compatible with single-cell Li-ion, LiFePO₄, and dual-cell alkaline power sources. |
Pinout & Package
Package: MicroStar Junior™ BGA (113-ball, 7 mm × 7 mm, 0.5-mm pitch). Pinout validated per TI SLAS541M Figure 7-5 (ZQW package) and Table 7-2 (Signal Descriptions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with programmable NMI edge detection; critical for fail-safe system recovery. |
| TCK/TMS/TDI/TDO | JTAG debug interface | Enables full-speed emulation, flash programming, and boundary-scan testing without external hardware. |
| P1.0–P1.7, P2.0–P2.7, etc. | Configurable GPIO with interrupt | 48 total I/O pins; each supports Schmitt-trigger input, slew-rate control, and individual direction register. |
| XIN/XOUT | LFXT1 crystal oscillator terminals | Supports 32.768-kHz watch crystal for precise real-time clock operation in LPM3. |
| AVCC/AVSS | Analog supply and ground | Separate analog domain reduces digital noise coupling into ADC/DAC reference paths. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low standby current | 0.5 µA in LPM3 (VLO active); extends battery life in intermittently active sensor nodes. |
| Calibrated DCO | Factory-trimmed internal oscillator with ±3% tolerance over 0°C–85°C; eliminates need for external crystal in cost-sensitive designs. |
| Hardware multiplier | 16×16-bit signed/unsigned multiply and accumulate (MAC); accelerates FIR filtering and math-intensive sensor processing. |
| Bootloader (BSL) | ROM-resident UART-based bootloader; enables field firmware updates without JTAG hardware. |
| Supply supervision | Programmable SVS threshold with interrupt output; prevents erratic operation during brownout conditions. |
Applications
| Portable Medical Sensors | Industrial Process Monitors |
|---|---|
Use Scenario: Wearable ECG patch acquiring analog biopotentials and transmitting via UART to BLE gateway. IC Role / Device Role / Timing Role: Primary MCU handling ADC sampling, digital filtering, UART framing, and low-power state management. Use Value: 12-bit ADC linearity (±1 LSB INL) and 0.1 µA LPM4 current enable >3-day runtime on coin cell while maintaining clinical-grade signal fidelity. | Use Scenario: Remote temperature/humidity node in factory HVAC duct using I²C sensors and RS-485 backhaul. IC Role / Device Role / Timing Role: Sensor aggregator with dual USCI_B modules driving I²C peripherals and USCI_A managing RS-485 UART protocol stack. Use Value: Concurrent I²C master and UART operation without DMA allows deterministic timing control for time-critical environmental alarms. |
| Hand-Held Test Meters | Smart Utility Meters |
Use Scenario: Battery-powered multimeter with auto-ranging, LCD display, and USB-CDC interface. IC Role / Device Role / Timing Role: System controller managing analog front-end multiplexing, LCD segment drive, and USB virtual COM port emulation. Use Value: Dual USCI_A modules support simultaneous UART (for USB bridge) and IrDA (for legacy printer sync) without resource conflict. | Use Scenario: AMI endpoint collecting pulse-count data from mechanical meters and reporting via NB-IoT modem. IC Role / Device Role / Timing Role: Low-duty-cycle host MCU waking every 15 minutes to read counters, compute checksums, and trigger modem transmit. Use Value: Sub-1-µs wake-up from LPM4 ensures precise timing alignment with utility billing intervals and minimizes active-mode energy overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2419TPM | LQFP-64 package (10 mm × 10 mm); same core, flash, RAM, and peripherals as MSP430F2419TZQWR. | Requires PCB redesign for land pattern and thermal relief; better suited for prototyping or non-magnetic medical assemblies. | Select when manual rework, test probe access, or non-BGA assembly is required. |
| MSP430F2619TZQWR | Adds DAC12 (dual 12-bit voltage-output) and 3-channel DMA; otherwise identical package, pinout, and memory configuration. | Enables closed-loop analog control (e.g., sensor calibration offset correction) and burst ADC-to-memory transfers. | Select when DAC or DMA functionality is needed - no PCB change required due to pin-for-pin compatibility. |
Compared with MSP430F2419TPM, the MSP430F2419TZQWR offers higher I/O density and smaller footprint in BGA form, while MSP430F2619TZQWR adds analog output and data movement capability without altering layout - making the latter a drop-in upgrade path for enhanced functionality.
Availability
MSP430F2419TZQWR is available at Aetrix Electronics and suitable for portable medical sensors, industrial process monitors, and hand-held test meters requiring stable component supply across long-lifecycle embedded programs.
Supply support for MSP430F2419TZQWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and reliability.
The MSP430F2419TZQWR belongs to the MSP430F2xx ultra-low-power microcontroller product line, engineered specifically for battery-operated measurement and sensing applications where nanowatt-level sleep current and fast wake-up are mandatory.
FAQ
What is the maximum ADC12 sampling rate supported by the MSP430F2419TZQWR?
The MSP430F2419TZQWR supports ADC12CLK up to 7 MHz, enabling a minimum conversion time of 1.86 µs per sample (12-bit, single-channel). This yields up to ~537 kSPS in continuous mode with autoscan disabled - sufficient for ultrasound pre-processing and high-resolution thermistor logging.
Does the MSP430F2419TZQWR include a hardware multiplier unit?
Yes, the MSP430F2419TZQWR integrates a 16×16-bit hardware multiplier supporting signed/unsigned multiply and MAC operations. This unit executes in one CPU cycle and is accessible via MPY, MPYS, MAC, and MACS instructions - accelerating FFTs, PID control, and sensor linearization in firmware.
Is the MSP430F2419TZQWR pin-compatible with any MSP430F261x devices?
Yes, the MSP430F2419TZQWR is pin-compatible with the MSP430F2619TZQWR in the ZQW package. Both share identical ball map, power domains, and peripheral pin assignments - differing only in internal DAC12 and DMA module presence, which are disabled or unconnected in the F2419 variant.
What debug interfaces are supported on the MSP430F2419TZQWR?
The MSP430F2419TZQWR supports full-speed JTAG (TCK/TMS/TDI/TDO) for emulation and programming, plus ROM-based UART bootloader (BSL) accessible via USCI_A0. No SWD or cJTAG is implemented - JTAG remains the primary debug and production programming interface.
What is the qualified temperature range for the MSP430F2419TZQWR?
The MSP430F2419TZQWR is specified for operation from –40°C to 85°C (industrial temperature grade). All electrical characteristics - including DCO accuracy, ADC linearity, and LPM4 current - are guaranteed across this full range per TI SLAS541M Section 8.
MSP430F2419TZQWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 113-VFBGA
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 120KB (120K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2419TZQWR FAQ
1.How can I place an order for MSP430F2419TZQWR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2419TZQWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2419TZQWR reliable?
The price and inventory of MSP430F2419TZQWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2419TZQWR is usually 5 days.
3.What payment methods are accepted for MSP430F2419TZQWR?
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MSP430F2419TZQWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2419TZQWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2419TZQWR?
For technical support, including MSP430F2419TZQWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2419TZQWR requirements.
6.How does Aetrix verify that MSP430F2419TZQWR is sourced from the original manufacturer or authorized distributors?
All MSP430F2419TZQWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2419TZQWR meets industry standards.
7.What is the process for return or replacement of MSP430F2419TZQWR?
All MSP430F2419TZQWR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2419TZQWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2419TZQWR part is unused and in its original packaging.
Return procedure for MSP430F2419TZQWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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