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Texas Instruments MSP430F2617TZQW
- Part No.:
- MSP430F2617TZQW
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 113-VFBGA
- Datasheet:
-
MSP430F2617TZQW.pdf
- Description:
- IC MCU 16BIT 92KB FLASH 113BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,894
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Product details
Overview
MSP430F2617TZQW from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 92KB+256B flash, 8KB RAM, dual 12-bit DACs, 12-bit ADC with autoscan, three-channel DMA, and four USCI modules (two UART/IrDA/SPI, two I²C/SPI). It operates from 1.8 V to 3.6 V and supports sub-1 µs wake-up from standby mode - ideal for battery-powered sensor nodes and portable medical devices.
For engineers reviewing the MSP430F2617TZQW datasheet, MSP430F2617TZQW pinout, MSP430F2617TZQW application, or MSP430F2617TZQW equivalent, key selection criteria include its MicroStar Junior™ BGA-113 package, integrated DAC/ADC timing synchronization, DMA-accelerated sensor data acquisition, and support for LIN/UART auto-baud detection in constrained embedded systems.
Technical Context
The MSP430F2617TZQW implements a 16-bit CPU with constant generators and a calibrated DCO enabling <1 µs active-mode wake-up from LPM3/LPM4. Its peripheral set includes Timer_A3 (3 capture/compare), Timer_B7 (7 registers with shadowing), and dual 12-bit DACs with voltage output and synchronous update capability.
It integrates four USCI modules: USCI_A0/A1 support enhanced UART (with automatic baud-rate detection), IrDA, and SPI; USCI_B0/B1 support I²C and SPI. The ADC12 features internal reference, sample-and-hold, and autoscan across up to 8 channels, while the DAC12 subsystem provides two independent 12-bit voltage-output channels with programmable reference selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle and 16 general-purpose registers |
| Flash / RAM | 92KB + 256B flash memory; 8KB RAM - sufficient for complex sensor fusion algorithms with retained context during low-power sleep |
| ADC Resolution | 12-bit SAR ADC with 8 input channels, internal reference, and autoscan - enables simultaneous multi-sensor analog monitoring without CPU intervention |
| DAC Channels | Dual 12-bit voltage-output DACs with synchronization - supports precise analog waveform generation or closed-loop control signal injection |
| Low-Power Modes | Active: 365 µA @ 1 MHz / 2.2 V; Standby (VLO): 0.5 µA; Off (RAM retention): 0.1 µA - extends battery life in intermittent-sampling applications |
| Wake-up Time | <1 µs from standby mode - critical for real-time response in event-triggered sensing (e.g., motion or threshold crossing) |
| USCI Interfaces | Four USCI modules: two UART/IrDA/SPI (A0/A1), two I²C/SPI (B0/B1) - enables concurrent communication with multiple sensors and host controllers |
Pinout & Package
Package: MicroStar Junior™ BGA-113 (7 mm × 7 mm, 0.5 mm pitch), nonmagnetic option available for MRI-compatible medical imaging systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | General-purpose I/O with TA0–TA2, TACLK, CAOUT | Support timer capture, comparator output, and clock input - enables flexible signal conditioning and timing measurement |
| P2.0–P2.7 | I/O with ACLK, CA0–CA7, ROSC, ADC12CLK, DMAE0 | Provides auxiliary clock routing, analog comparator inputs, oscillator resistor connection, and DMA trigger source |
| P3.0–P3.7 | USCI_A0/A1 and USCI_B0/B1 signals | Configurable for UART, SPI, or I²C - allows mixed-protocol connectivity to displays, EEPROMs, and transceivers |
| P4.0–P4.7 | Timer_B7 capture/compare channels TB0–TB6, TBCLK | Enables high-resolution PWM generation, quadrature decoding, or precise pulse-width measurement |
| P5.0–P5.7 | USCI_B1, MCLK, SMCLK, ACLK, TBOUTH, SVSOUT | Delivers system clock distribution, secondary USCI interface, and supply-monitoring status output |
| P6.0–P6.7 | Analog inputs A0–A7, DAC0/DAC1 outputs, SVSIN | Combines ADC channel inputs, DAC voltage outputs, and supply-voltage supervisor input - simplifies analog front-end design |
| P7.0–P7.7, P8.0–P8.5 | General-purpose I/O with optional XT2 functions | Provides additional GPIO for expansion or dedicated crystal oscillator support (XT2IN/XT2OUT on P8.6/P8.7) |
| RST/NMI, TCK, TMS, TDI/TCLK, TDO/TDI | JTAG debug interface | Enables full-speed in-circuit debugging and programming without external voltage - reduces test fixture complexity |
Key Features
| Feature | Design Value |
|---|---|
| Three-channel DMA controller | Offloads CPU during ADC sampling, DAC updates, or USCI transfers - preserves low-power state during bulk data movement |
| Dual synchronized 12-bit DACs | Enables simultaneous analog output updates for differential signal generation or multi-axis actuator control |
| Enhanced UART with auto-baud detection | Eliminates need for pre-negotiated baud rates - simplifies interoperability with legacy or variable-speed peripherals |
| Calibrated DCO with <1 µs wake-up | Removes dependency on external crystal for fast wake-up - reduces BOM cost and board space in time-critical applications |
| Supply voltage supervisor (SVS) with programmable threshold | Prevents erratic operation during brownout by triggering reset at user-defined VCC level - enhances system reliability |
Applications
| Portable Medical Sensors | Industrial Process Monitoring |
|---|---|
Use Scenario: Continuous glucose monitoring patch with electrochemical sensor readout and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Primary MCU managing analog front-end (ADC/DAC), real-time sensor calibration, and low-power wireless co-processor interface. Use Value: 8KB RAM buffers raw sensor data; dual DACs inject precise bias voltages; sub-1 µs wake-up ensures timely response to rapid glucose excursions. | Use Scenario: Wireless temperature/pressure node in hazardous-area refinery instrumentation. IC Role / Device Role / Timing Role: Sensor hub aggregating RTD/strain-gauge readings via ADC, performing linearization, and transmitting via RS-485 (via USCI_A0). Use Value: Integrated SVS prevents firmware corruption during line transients; 0.1 µA off-mode extends 10-year battery life; nonmagnetic BGA avoids MRI interference. |
| Hand-Held Test Meters | Energy Harvesting Sensor Nodes |
Use Scenario: Battery-powered multimeter with autoranging, capacitance measurement, and LCD display. IC Role / Device Role / Timing Role: Main controller executing measurement algorithms, driving segmented LCD, and managing button/LED interface. Use Value: Dual DACs generate precision reference voltages for auto-ranging; USCI_B0 interfaces I²C temperature sensor; 365 µA active current enables >200 hr runtime on AA cells. | Use Scenario: Solar-powered environmental monitor logging temperature/humidity/UV index to SD card. IC Role / Device Role / Timing Role: Power-aware data logger coordinating energy harvesting management, sensor polling, and SPI-based SD card writes. Use Value: Three-channel DMA moves ADC samples directly to RAM while CPU sleeps; 0.5 µA standby mode maximizes duty cycle between solar charging pulses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2617TPM | LQFP-64 package (10 mm × 10 mm); identical core/peripherals but different thermal and mechanical characteristics | Suitable for prototyping, manual assembly, or applications requiring reworkability and thermal vias | Select when PCB layout flexibility, debug access, or thermal management via exposed pad is prioritized over miniaturization. |
| MSP430F2417TZQW | Same MicroStar Junior™ BGA-113 package; lacks DAC12 and DMA modules; otherwise identical flash/RAM/peripheral count | Applicable where analog output or high-throughput sensor streaming is unnecessary - reduces cost and power in simpler sensing nodes | Choose when DAC and DMA functionality are unused - achieves same footprint and pin compatibility with lower unit cost. |
Compared with MSP430F2617TPM, the MSP430F2617TZQW offers superior miniaturization and EMI performance in dense layouts; compared with MSP430F2417TZQW, it adds essential DAC and DMA capabilities for closed-loop control and sensor fusion - making it the only choice for applications requiring synchronized analog output and autonomous data movement.
Availability
MSP430F2617TZQW is available at Aetrix Electronics and suitable for portable medical sensors, industrial process monitoring, and hand-held test meters requiring stable component supply and long-term lifecycle support.
Supply support for MSP430F2617TZQW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F2617TZQW belongs to TI's ultra-low-power mixed-signal MCU family, designed specifically for battery-operated measurement and sensing applications demanding extended runtime, high analog integration, and robust real-time responsiveness.
FAQ
What is the operating voltage range of the MSP430F2617TZQW?
The MSP430F2617TZQW operates from 1.8 V to 3.6 V. This wide supply range supports direct connection to single-cell Li-ion, Li-polymer, or two-cell alkaline batteries without external regulation - simplifying power architecture and improving efficiency in portable designs. All specifications, including ADC accuracy and DAC linearity, are guaranteed across this range.
Does the MSP430F2617TZQW support JTAG debugging?
Yes, the MSP430F2617TZQW supports full-speed JTAG debugging via dedicated pins (RST/NMI, TCK, TMS, TDI/TCLK, TDO/TDI). This enables real-time code execution control, register inspection, and flash programming without requiring external voltage - critical for development and field firmware updates.
How many USCI modules does the MSP430F2617TZQW integrate?
The MSP430F2617TZQW integrates four USCI modules: USCI_A0 and USCI_A1 support UART, IrDA, and SPI; USCI_B0 and USCI_B1 support I²C and SPI. This enables concurrent communication with multiple peripherals - for example, UART to a BLE module, I²C to a temperature sensor, and SPI to an OLED display - all managed independently.
Is the MSP430F2617TZQW pin-compatible with other MSP430F261x devices in the same package?
Yes, the MSP430F2617TZQW shares identical pinout and electrical characteristics with MSP430F2616TZQW, MSP430F2618TZQW, and MSP430F2619TZQW in the MicroStar Junior™ BGA-113 package. Firmware and PCB layout are interchangeable across these variants - allowing scalable memory selection without hardware redesign.
What is the maximum ADC sampling rate supported by the MSP430F2617TZQW?
The MSP430F2617TZQW ADC12 supports a maximum conversion clock (fADC12CLK) of 7 MHz, enabling up to ~380 kSPS in sequential single-channel mode. With autoscan across 8 channels and DMA-driven transfers, sustained throughput remains high while CPU remains in low-power mode - ideal for continuous waveform capture in diagnostic tools.
MSP430F2617TZQW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 113-VFBGA
- Series:
- MSP430F2xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 92KB (92K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2617TZQW FAQ
1.How can I place an order for MSP430F2617TZQW through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2617TZQW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2617TZQW reliable?
The price and inventory of MSP430F2617TZQW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2617TZQW is usually 5 days.
3.What payment methods are accepted for MSP430F2617TZQW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2617TZQW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2617TZQW?
MSP430F2617TZQW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2617TZQW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2617TZQW?
For technical support, including MSP430F2617TZQW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2617TZQW requirements.
6.How does Aetrix verify that MSP430F2617TZQW is sourced from the original manufacturer or authorized distributors?
All MSP430F2617TZQW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2617TZQW meets industry standards.
7.What is the process for return or replacement of MSP430F2617TZQW?
All MSP430F2617TZQW units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2617TZQW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2617TZQW part is unused and in its original packaging.
Return procedure for MSP430F2617TZQW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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