Texas Instruments MSP430F2617TZQWR
- Part No.:
- MSP430F2617TZQWR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 113-VFBGA
- Datasheet:
-
MSP430F2617TZQWR.pdf
- Description:
- IC MCU 16BIT 92KB FLASH 113BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,790
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F2617TZQWR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller featuring 92KB+256B flash, 8KB RAM, dual 12-bit DACs, three-channel DMA, 12-bit ADC with autoscan, two 16-bit timers (Timer_A3 and Timer_B7), four USCI modules (dual UART/IrDA/SPI + dual I²C/SPI), and on-chip comparator. It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and portable medical devices.
For engineers reviewing the MSP430F2617TZQWR datasheet, MSP430F2617TZQWR pinout, MSP430F2617TZQWR application, or MSP430F2617TZQWR equivalent, key selection criteria include its 8KB RAM capacity, MicroStar Junior™ BGA-113 package, DAC12/DMA support (distinguishing it from F241x), wake-up time <1 µs from LPM3/LPM4, and calibrated DCO stability across temperature and supply voltage.
Technical Context
The MSP430F2617TZQWR implements a 16-bit CPU with constant generators and 16-bit registers for optimized code efficiency in ultra-low-power embedded control. Its architecture integrates dual 12-bit DACs with voltage output and synchronization, three-channel DMA for autonomous peripheral data movement, and four USCI modules supporting simultaneous UART, IrDA, SPI, and I²C protocols.
It features a programmable supply voltage supervisor (SVS) with adjustable threshold, brownout detection, and a hardware multiplier for accelerated math operations. The calibrated DCO enables sub-1-µs wake-up from LPM3/LPM4, while the 12-bit ADC supports up to 200 kSPS with internal reference and sample-and-hold - all within a 1.8–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle and 16 general-purpose registers |
| Flash / RAM | 92KB + 256B flash memory and 8KB RAM - sufficient for complex sensor fusion algorithms with real-time buffering |
| ADC | 12-bit SAR ADC with 8 channels, internal reference, sample-and-hold, and autoscan - supports high-precision analog monitoring without external components |
| DAC | Dual 12-bit voltage-output DACs with synchronization - enables precise analog waveform generation or bias control in closed-loop systems |
| Timers | Timer_A3 (3 capture/compare) and Timer_B7 (7 capture/compare with shadow registers) - supports multi-phase PWM, event timing, and pulse counting |
| USCI Modules | Four USCI peripherals: USCI_A0/A1 (UART/IrDA/SPI) and USCI_B0/B1 (I²C/SPI) - allows concurrent serial communication with multiple sensors and host interfaces |
| Power Modes | Active mode: 365 µA @ 1 MHz, 2.2 V; Standby (VLO): 0.5 µA; Off (RAM retention): 0.1 µA - extends battery life in intermittent-sensing applications |
Pinout & Package
Package: MicroStar Junior™ BGA-113 (7 mm × 7 mm, 0.5 mm pitch). Pinout validated per TI SLAS541M Rev. M functional block diagrams and terminal configuration tables for MSP430F261x PM/PN/ZCA/ZQW packages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with NMI capability; supports both power-on and software-triggered system recovery |
| TCK/TMS/TDI/TDO | JTAG debug interface signals | Enables full-speed in-circuit emulation, flash programming, and real-time debugging without external hardware |
| P1.x–P8.x | General-purpose I/O with interrupt capability | Up to 48 configurable GPIOs with Schmitt-trigger inputs and programmable pullup/pulldown - suitable for sensor interfacing and status signaling |
| XIN/XOUT | Low-frequency crystal oscillator terminals | Supports 32.768 kHz watch crystal for RTC and low-power timing; integrated oscillator circuit eliminates external load capacitors |
| XT2IN/XT2OUT | High-frequency crystal oscillator terminals | Supports 4–16 MHz crystals for precise system clocking; enables high-speed ADC sampling and USB-like data rates |
| VREF+/VREF−/VeREF+ | ADC/DAC reference voltage inputs | Accepts internal or external references; VeREF+ can be sourced from DAC0 output - enables ratiometric sensing and self-calibrating signal chains |
| DAC0/DAC1 | Analog voltage outputs (P6.6/P6.5) | 12-bit monotonic voltage outputs with rail-to-rail swing - used for sensor excitation, calibration offsets, or analog actuator control |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 0.1 µA off-mode current with RAM retention enables years of operation on coin-cell batteries in wireless sensor nodes |
| Dual synchronized 12-bit DACs | Enables simultaneous analog output generation for differential signal conditioning or multi-channel calibration without CPU intervention |
| Three-channel hardware DMA | Permits background data transfer between ADC, USCI, and RAM - reduces CPU load and active time during burst acquisition |
| Calibrated DCO with <1 µs wake-up | Eliminates crystal start-up delay in responsive systems; maintains timing accuracy across −40°C to 85°C and 1.8–3.6 V |
| Four independent USCI modules | Allows concurrent UART (sensor telemetry), I²C (local sensor bus), SPI (flash memory), and IrDA (user interface) - no protocol arbitration required |
| On-chip comparator with 8-channel input mux | Provides fast analog threshold detection for wake-up triggers or overvoltage protection - avoids external comparators and saves board space |
Applications
| Portable Medical Sensors | Industrial Process Monitoring |
|---|---|
Use Scenario: Wearable ECG front-end with analog signal conditioning and Bluetooth LE telemetry. IC Role / Device Role / Timing Role: Primary MCU handling ADC sampling, digital filtering, DAC-based electrode biasing, and UART-to-BLE bridge via USCI_A0. Use Value: 8KB RAM buffers multi-lead waveform data; dual DACs set precise electrode DC offsets; sub-1-µs wake-up ensures responsive lead-off detection. |
Use Scenario: Smart pressure transmitter with HART-compatible 4–20 mA loop and local display. IC Role / Device Role / Timing Role: System controller managing piezoresistive sensor excitation (DAC0), ratiometric ADC conversion, HART modem interface (USCI_A1), and LCD driver (Timer_B7 PWM). Use Value: Internal SVS monitors loop supply; calibrated DCO ensures accurate HART frequency generation; 0.5 µA standby extends maintenance intervals. |
| Hand-Held Test Equipment | Energy Metering Subsystem |
Use Scenario: Battery-powered multimeter with auto-ranging, capacitance measurement, and USB-C connectivity. IC Role / Device Role / Timing Role: Main processor executing auto-range logic, driving test signal generators (DAC1), digitizing inputs (ADC12), and managing USB-C PD negotiation (USCI_B0 I²C to PD controller). Use Value: Three-channel DMA moves ADC results to RAM while CPU computes RMS; 92KB flash stores firmware + calibration tables; 1.8 V min operation extends usable battery range. |
Use Scenario: Residential smart meter auxiliary MCU for tamper detection, temperature compensation, and secure firmware updates. IC Role / Device Role / Timing Role: Secondary controller monitoring enclosure tilt (accelerometer via I²C), case temperature (ADC channel), and validating signed update packets (hardware multiplier for CRC/SHA acceleration). Use Value: 0.1 µA off-mode preserves main meter battery during long idle periods; bootloadable BSL enables field updates without JTAG access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2618TZQWR | 116KB+256B flash, same 8KB RAM, identical peripherals and pinout | Preferred where larger firmware image size is required (e.g., integrated crypto stack or multi-protocol stacks) | Select when >92KB flash is needed; otherwise, MSP430F2617TZQWR offers optimal cost/performance balance for most sensor edge nodes |
| MSP430F2417TZQWR | No DAC12 or DMA modules; otherwise identical package, pinout, and core peripherals | Suitable for simpler analog monitoring tasks without waveform generation or high-throughput data movement | Choose when DAC/DMA functionality is unnecessary - lower cost and reduced firmware complexity |
Compared with MSP430F2618TZQWR, the MSP430F2617TZQWR trades 24KB flash for lower unit cost while retaining full peripheral feature set; versus MSP430F2417TZQWR, it adds critical DAC and DMA capabilities essential for closed-loop control and sensor data preprocessing - making it the minimum viable option for advanced analog-intensive edge nodes.
Availability
MSP430F2617TZQWR is available at Aetrix Electronics and suitable for portable medical sensors, industrial process monitoring, and hand-held test equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing for regulated environments.
Supply support for MSP430F2617TZQWR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430F2617TZQWR belongs to the MSP430F261x family - engineered specifically for extended-battery-life portable measurement applications requiring integrated precision analog, deterministic real-time control, and minimal active power consumption.
FAQ
What is the package type and pin count of the MSP430F2617TZQWR?
The MSP430F2617TZQWR uses the MicroStar Junior™ BGA-113 package with 113 balls in a 7 mm × 7 mm footprint and 0.5 mm pitch. This nonmagnetic variant is qualified for medical imaging applications and shares pin compatibility with other MSP430F261x ZQW devices. All ZQW-package orderables are currently in Last Time Buy status per TI's Product Lifecycle Notice.
Does the MSP430F2617TZQWR support hardware debugging and programming?
Yes, the MSP430F2617TZQWR includes a full JTAG interface (TCK, TMS, TDI, TDO) for in-circuit emulation, flash programming, and real-time debugging. It also supports Spy-Bi-Wire (2-wire JTAG) and the built-in bootloader (BSL) for UART-based programming without external voltage - enabling field firmware updates via standard serial interface.
How does the MSP430F2617TZQWR differ from the MSP430F2417TZQWR?
The MSP430F2617TZQWR includes dual 12-bit DACs and a three-channel DMA controller, while the MSP430F2417TZQWR omits both modules. All other peripherals - including 92KB flash, 8KB RAM, ADC12, timers, and USCI modules - are functionally identical. This makes MSP430F2617TZQWR the correct choice for applications requiring analog output generation or high-bandwidth peripheral data movement.
What are the supported operating voltage and temperature ranges for the MSP430F2617TZQWR?
The MSP430F2617TZQWR operates from 1.8 V to 3.6 V and is rated for the industrial temperature range of −40°C to +85°C. Its calibrated DCO maintains frequency accuracy across this full range, and the supply voltage supervisor (SVS) supports programmable trip points to protect against brownout conditions in variable-power environments.
Can the MSP430F2617TZQWR drive external crystals, and what frequencies are supported?
Yes, the MSP430F2617TZQWR supports two crystal oscillators: LFXT1 (XIN/XOUT) for 32.768 kHz crystals used in real-time clock applications, and XT2 (XT2IN/XT2OUT) for 4–16 MHz crystals used for high-precision system clocking. Both oscillators include integrated load capacitance and fault-detection circuitry to ensure reliable startup and operation.
MSP430F2617TZQWR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 113-VFBGA
- Series:
- MSP430F2xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 92KB (92K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2617TZQWR FAQ
1.How can I place an order for MSP430F2617TZQWR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2617TZQWR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2617TZQWR reliable?
The price and inventory of MSP430F2617TZQWR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2617TZQWR is usually 5 days.
3.What payment methods are accepted for MSP430F2617TZQWR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2617TZQWR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2617TZQWR?
MSP430F2617TZQWR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2617TZQWR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2617TZQWR?
For technical support, including MSP430F2617TZQWR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2617TZQWR requirements.
6.How does Aetrix verify that MSP430F2617TZQWR is sourced from the original manufacturer or authorized distributors?
All MSP430F2617TZQWR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2617TZQWR meets industry standards.
7.What is the process for return or replacement of MSP430F2617TZQWR?
All MSP430F2617TZQWR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2617TZQWR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2617TZQWR part is unused and in its original packaging.
Return procedure for MSP430F2617TZQWR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F2617TZQWR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

