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Texas Instruments MSP430F2618TZQW
- Part No.:
- MSP430F2618TZQW
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 113-VFBGA
- Datasheet:
-
MSP430F2618TZQW.pdf
- Description:
- IC MCU 16BIT 116KB FLASH 113BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,096
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Product details
Overview
MSP430F2618TZQW from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 116KB+256B flash, 8KB RAM, dual 12-bit DACs, 12-bit ADC, three-channel DMA, four USCI modules (UART/IrDA/SPI/I²C), and two 16-bit timers (Timer_A3 and Timer_B7). It operates from 1.8 V to 3.6 V and targets battery-powered sensor systems and portable medical imaging devices requiring sub-1 µs wake-up and precise analog signal generation.
For engineers reviewing the MSP430F2618TZQW datasheet, MSP430F2618TZQW pinout, MSP430F2618TZQW application, or MSP430F2618TZQW equivalent, key selection considerations include its MicroStar Junior™ BGA-113 package, DAC12/DMA support (distinguishing it from F241x variants), calibrated DCO for fast LPM3/LPM4 wake-up, and nonmagnetic option suitability for MRI-adjacent instrumentation.
Technical Context
The MSP430F2618TZQW implements a 16-bit CPU with constant generators and 16-bit registers optimized for code efficiency in measurement applications. Its architecture integrates a programmable supply voltage supervisor (SVS/SVM), brownout detector, and bootloadable flash memory with security fuse protection.
It features dual 12-bit voltage-output DACs with synchronization, a 12-bit ADC with internal reference and autoscan, and four USCI modules-two supporting UART/IrDA/SPI (USCI_A0/A1) and two supporting I²C/SPI (USCI_B0/B1)-enabling concurrent serial communication in resource-constrained embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle; enables deterministic real-time control in low-power sensor nodes. |
| Flash / RAM | 116KB + 256B flash, 8KB RAM; supports complex firmware with data logging and calibration tables. |
| ADC | 12-bit SAR ADC with 8 channels, internal reference, sample-and-hold, autoscan; suitable for multi-sensor analog front-end acquisition. |
| DAC | Dual synchronized 12-bit voltage-output DACs; enables precision waveform generation or bias control in closed-loop analog systems. |
| Timers | Timer_A3 (3 capture/compare) + Timer_B7 (7 capture/compare with shadow registers); supports PWM, input capture, and time-critical event sequencing. |
| Low-Power Modes | Active mode: 365 µA @ 1 MHz/2.2 V; Standby (VLO): 0.5 µA; Off (RAM retention): 0.1 µA; extends battery life in intermittent-sampling applications. |
| Wake-up Time | <1 µs from standby mode; critical for responsive wake-on-event behavior in energy-harvesting or interrupt-driven systems. |
| Supply Range | 1.8 V to 3.6 V; compatible with single-cell Li-ion, Li-polymer, or dual-AA alkaline power sources. |
Pinout & Package
Package: MicroStar Junior™ BGA-113 (7 mm × 7 mm), nonmagnetic variant available for medical imaging environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Hardware reset initiation and high-priority fault handling; supports JTAG-based debugging and safe recovery. |
| TCK/TMS/TDI/TDO | JTAG emulation interface | Full boundary-scan and in-circuit debug capability without requiring dedicated debug pins beyond standard JTAG. |
| P1.x–P8.x | Programmable I/O ports (up to 64 pins) | Configurable as digital I/O, peripheral function pins (e.g., TA0, TBCLK, UCA0TXD), or analog inputs (A0–A7); supports interrupt on change. |
| XIN/XOUT | LFXT1 crystal oscillator terminals | Supports external 32.768 kHz watch crystal for accurate real-time clock operation in LPM3. |
| XT2IN/XT2OUT | XT2 high-frequency crystal oscillator terminals | Enables optional 4–16 MHz crystal for higher-speed system clock or precise ADC sampling clock source. |
| VREF+/VREF-/VeREF+ | ADC/DAC reference voltage terminals | Accepts internal or external reference; VeREF+ doubles as DAC0 output buffer reference for rail-to-rail analog output. |
| DAC0/DAC1 | DAC output terminals (P6.6/P6.5/P6.7) | Direct voltage outputs from dual 12-bit DACs; P6.6 = DAC0, P6.5/P6.7 = DAC1; enable analog actuation or calibration signal injection. |
| ADC12CLK | ADC conversion clock input (P2.6) | Accepts internal DCO, SMCLK, or external clock up to 7 MHz; determines maximum sampling rate and resolution trade-offs. |
Key Features
| Feature | Design Value |
|---|---|
| Three-channel hardware DMA | Enables zero-CPU-overhead data movement between peripherals (e.g., ADC → RAM, RAM → DAC), freeing CPU for computation during acquisition/generation cycles. |
| Dual synchronized 12-bit DACs | Allows simultaneous, phase-aligned analog output generation-critical for differential signal conditioning or multi-channel stimulus in test equipment. |
| Four USCI modules (2× UART/IrDA/SPI + 2× I²C/SPI) | Supports concurrent communication with multiple sensors (I²C), host MCU (UART), and auxiliary peripherals (SPI), eliminating protocol bottlenecks in dense node architectures. |
| Calibrated DCO with <1 µs wake-up | Eliminates need for external crystal startup delay; enables immediate processing upon interrupt-essential for ultra-low-duty-cycle wake-and-measure applications. |
| Supply voltage supervisor (SVS) with programmable threshold | Prevents erratic operation during brownout by triggering reset or interrupt at user-defined VCC level, improving system reliability in variable-power environments. |
| Bootloader (BSL) with UART/I²C interface | Permits field firmware updates without JTAG hardware; supports secure code reprogramming via serial interface using TI's standard BSL protocol. |
Applications
| Portable Medical Sensors | Industrial Process Monitoring |
|---|---|
Use Scenario: Battery-powered handheld blood glucose meter acquiring analog sensor signals and driving LCD display with minimal power draw. IC Role / Device Role / Timing Role: Central controller managing ADC sampling, DAC-based reference generation, LCD timing via Timer_A, and low-power UART communication to smartphone. Use Value: 0.1 µA off-mode current and sub-1 µs wake-up extend battery life to >1 year; dual DACs enable precise electrochemical sensor biasing. | Use Scenario: Remote temperature/pressure transmitter in oil & gas pipeline monitoring, operating unattended for months on primary cell. IC Role / Device Role / Timing Role: Sensor interface MCU performing periodic ADC reads, SPI communication with pressure transducer, and I²C readout of local temperature sensor. Use Value: 0.5 µA standby mode with VLO preserves battery during sleep intervals; USCI_B0/B1 allow independent SPI and I²C buses without software arbitration. |
| Hand-Held Test Equipment | MRI-Compatible Instrumentation |
Use Scenario: Portable oscilloscope probe with analog front-end, real-time waveform digitization, and USB-UART bridge to PC. IC Role / Device Role / Timing Role: High-fidelity signal acquisition controller using ADC12 with external reference, DMA for streaming, and USCI_A0 for UART-to-USB bridge. Use Value: 7 MHz max ADC clock enables 1 MSPS sampling; DMA offloads data transfer, reducing CPU load and jitter in time-critical capture. | Use Scenario: Auxiliary sensor module mounted near MRI scanner bore, requiring nonmagnetic construction and immunity to EMI-induced resets. IC Role / Device Role / Timing Role: Radiation-tolerant analog monitor capturing coil temperature and gradient feedback, communicating via isolated UART. Use Value: MicroStar Junior™ BGA-113 package is certified nonmagnetic; SVS with programmable threshold prevents false resets during magnetic field ramping events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2619TZQW | 120KB+256B flash, 4KB RAM, same peripherals and package; lacks 4KB RAM vs. MSP430F2618TZQW | Better for firmware with large lookup tables but less runtime data buffering; identical DAC/ADC/DMA functionality | Select when flash headroom is prioritized over RAM capacity for fixed-function firmware. |
| MSP430F2418TZQW | No DAC12 or DMA modules; otherwise identical pinout, package, and core peripherals (ADC12, USCI, timers) | Suitable for cost-sensitive sensor nodes where DAC or high-throughput data movement is unnecessary | Choose when analog output or peripheral-to-memory DMA is not required-reduces BOM cost and simplifies firmware. |
Compared with MSP430F2619TZQW, the MSP430F2618TZQW provides 4KB more RAM for dynamic data structures while retaining full DAC/DMA capability; versus MSP430F2418TZQW, it adds essential analog generation and zero-CPU-overhead data movement-making it indispensable for closed-loop or high-channel-count sensing.
Availability
MSP430F2618TZQW is available at Aetrix Electronics and suitable for portable medical sensors, industrial process monitors, hand-held test equipment, and MRI-compatible instrumentation requiring stable component supply across long-lifecycle deployments.
Supply support for MSP430F2618TZQW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer applications.
The MSP430F261x product line was designed for ultra-low-power portable measurement systems requiring extended battery life, fast wake-up, and integrated analog peripherals-including dual DACs and DMA-to minimize external component count in space-constrained designs.
FAQ
What is the package type and pin count of the MSP430F2618TZQW?
The MSP430F2618TZQW uses the MicroStar Junior™ BGA-113 package with 113 balls in a 7 mm × 7 mm footprint. This nonmagnetic variant is qualified for medical imaging environments and supports high I/O density in compact PCB layouts. Pin assignments match the MSP430F261x functional block diagram for ZQW-package devices, including dedicated DAC0/DAC1 outputs on P6.6/P6.5.
Does the MSP430F2618TZQW include DAC and DMA peripherals?
Yes, the MSP430F2618TZQW includes both dual 12-bit voltage-output DACs and a three-channel hardware DMA controller-key differentiators from the MSP430F241x series. These are confirmed in the device comparison table and functional block diagrams for MSP430F261x devices in PN/ZCA/ZQW packages. The DACs support synchronized operation, and DMA channels can service ADC, DAC, and USCI modules without CPU intervention.
What are the supported low-power modes and wake-up times for the MSP430F2618TZQW?
The MSP430F2618TZQW supports five low-power modes, with standby mode (VLO active) drawing 0.5 µA and off mode (RAM retention) drawing 0.1 µA. Wake-up from standby to active mode takes less than 1 µs due to its calibrated digitally controlled oscillator (DCO), enabling rapid response to external interrupts in energy-harvesting or event-triggered systems.
Which communication interfaces does the MSP430F2618TZQW support?
The MSP430F2618TZQW integrates four USCI modules: USCI_A0 and USCI_A1 support UART, IrDA, and SPI; USCI_B0 and USCI_B1 support I²C and SPI. This allows concurrent use of UART for host communication, I²C for sensor networks, and SPI for high-speed peripheral control-all without software bit-banging or CPU overhead.
Is the MSP430F2618TZQW suitable for medical imaging applications?
Yes-the MSP430F2618TZQW in the ZQW (MicroStar Junior™ BGA) package is explicitly designated as a nonmagnetic option for medical imaging applications per TI documentation. Its low EMI profile, support for external 32.768 kHz crystal for precise timing, and immunity to magnetic field interference make it appropriate for auxiliary sensor modules near MRI scanners.
MSP430F2618TZQW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 113-VFBGA
- Series:
- MSP430F2xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 116KB (116K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2618TZQW FAQ
1.How can I place an order for MSP430F2618TZQW through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2618TZQW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2618TZQW reliable?
The price and inventory of MSP430F2618TZQW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2618TZQW is usually 5 days.
3.What payment methods are accepted for MSP430F2618TZQW?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2618TZQW transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2618TZQW?
MSP430F2618TZQW orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2618TZQW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2618TZQW?
For technical support, including MSP430F2618TZQW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2618TZQW requirements.
6.How does Aetrix verify that MSP430F2618TZQW is sourced from the original manufacturer or authorized distributors?
All MSP430F2618TZQW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2618TZQW meets industry standards.
7.What is the process for return or replacement of MSP430F2618TZQW?
All MSP430F2618TZQW units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2618TZQW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2618TZQW part is unused and in its original packaging.
Return procedure for MSP430F2618TZQW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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