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Texas Instruments MSP430F2619SKGD1
- Part No.:
- MSP430F2619SKGD1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- Die
- Datasheet:
-
MSP430F2619SKGD1.pdf
- Description:
- IC MCU 16BIT 120KB FLASH 0XCEPT
- Quantity:
- Payment:
- Shipping:
Inventory:1,879
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Product details
Overview
MSP430F2619SKGD1 from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller with 120 KB Flash, 4 KB RAM, dual 12-bit DACs, a 12-bit ADC with internal reference and autoscan, three-channel DMA, four USCI modules (UART/LIN/IrDA/SPI/I²C), two 16-bit timers (Timer_A3 and Timer_B7), and on-chip comparator - designed for battery-powered sensor systems and extreme-temperature industrial monitoring.
For engineers reviewing the MSP430F2619SKGD1 datasheet, MSP430F2619SKGD1 pinout, MSP430F2619SKGD1 application, or MSP430F2619SKGD1 equivalent, key selection criteria include its 80-pin KGD package, -55°C to +150°C extended temperature qualification, 0.1 μA off-mode current with RAM retention, sub-1 μs wake-up from standby, and integrated analog peripherals enabling single-chip sensor signal acquisition and processing.
Technical Context
The MSP430F2619SKGD1 implements a 16-bit CPU with constant generators and a digitally controlled oscillator (DCO) enabling <1 μs wake-up from LPM3/LPM4. Its memory-mapped peripheral architecture supports simultaneous analog capture (ADC12), digital waveform generation (DAC12), and serial communication across four independent USCI modules with hardware synchronization.
It integrates dual 12-bit DACs with dedicated output pins (P6.5/DAC1, P6.6/DAC0, P6.7/DAC1/SVSIN), a 12-bit ADC with eight selectable analog inputs (A0–A7), and Timer_B7 with seven capture/compare registers plus shadow registers for glitch-free PWM updates - all operating under five low-power modes optimized for intermittent sensing duty cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle and constant generators for high code efficiency |
| Memory | 120 KB Flash + 256 B info memory, 4 KB RAM - sufficient for firmware, calibration tables, and real-time data buffers |
| Power Consumption | 0.1 μA in off mode (RAM retention), 0.5 μA in standby (VLO), 365 μA at 1 MHz/2.2 V active mode |
| Analog Peripherals | 12-bit ADC12 with 8-channel autoscan, internal reference, sample-and-hold; dual 12-bit DAC12 with synchronization |
| Digital Peripherals | Timer_A3 (3 CC), Timer_B7 (7 CC + shadow), 3-channel DMA, 4× USCI (2× UART/LIN/IrDA/SPI + 2× SPI/I²C) |
| Operating Range | -55°C to +150°C ambient; qualified for 1000 hours continuous operation at max rated temperature |
| Clock System | Digital-controlled oscillator (DCO), LFXT1 (crystal), VLO, and optional XT2 - supports flexible clock tree configuration |
Pinout & Package
Package: 80-pin Known Good Die (KGD), bare die format with TiN/AlCu metallization, 10.5 mil thickness, floating backside potential, and bond pad coordinates defined per TI SLAS697E.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P6.5/A5/DAC1 | Analog input / DAC output | Primary output for DAC12.1 channel; also serves as ADC input A5 - enables simultaneous analog generation and sensing |
| P6.6/A6/DAC0 | Analog input / DAC output | Primary output for DAC12.0 channel; also serves as ADC input A6 - supports differential or complementary analog output schemes |
| P6.7/A7/DAC1/SVSIN | Analog input / DAC output / SVS input | Shared terminal for DAC12.1 output, ADC input A7, and supply voltage supervisor threshold input - allows adaptive voltage monitoring |
| AVCC / AVSS | Analog power rails | Isolated analog supply domain (2.2–3.6 V) powering ADC12 and DAC12 - prevents digital noise coupling into precision analog paths |
| DVCC1 / DVSS1 | Digital power rails | Dedicated digital supply (1.8–3.6 V) for CPU, timers, USCI, and I/O - enables independent rail optimization and sequencing |
| RST/NMI | Reset & nonmaskable interrupt | Combines power-on reset, brownout detection, and programmable NMI trigger - critical for fail-safe system recovery |
| TCK/TMS/TDI/TDO | JTAG debug interface | Four-pin boundary-scan interface supporting full emulation, flash programming, and real-time trace without external hardware |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power operation | 0.1 μA off-mode current preserves battery life in intermittently powered sensor nodes for years |
| Dual synchronized 12-bit DACs | Enables precise analog stimulus generation (e.g., sensor excitation, calibration signals) with matched timing and gain |
| 12-bit ADC with autoscan | Automatically sequences across up to 8 analog inputs without CPU intervention - ideal for multi-sensor polling |
| Four USCI modules | Supports concurrent UART (LIN-capable), IrDA, SPI, and I²C interfaces - eliminates need for external protocol translators |
| Hardware multiplier & DMA | Accelerates math-intensive tasks (e.g., FFT, filtering) and enables zero-CPU data movement between peripherals and memory |
Applications
| High-Temperature Industrial Sensor Node | Multi-Channel Analog Data Logger |
|---|---|
Use Scenario: Continuous temperature, pressure, and strain monitoring in oil/gas downhole tools or turbine engine compartments. IC Role / Device Role / Timing Role: Central controller acquiring analog sensor outputs via ADC12, conditioning data with DAC12-generated references, and transmitting via USCI_A0 UART/LIN to host. Use Value: Extended -55°C to +150°C qualification and 0.1 μA off-mode enable maintenance-free deployment in sealed, inaccessible environments. | Use Scenario: Battery-powered environmental station logging soil moisture, air quality, and solar irradiance across 6+ sensors. IC Role / Device Role / Timing Role: Autonomous scheduler using Timer_B7 to trigger periodic ADC12 autoscan, store results in RAM, and transmit batches via USCI_B0 I²C to local gateway. Use Value: Integrated DMA and low-power modes reduce average current to <10 μA during sleep, extending 2-AA battery life beyond 5 years. |
| Stand-Alone RF Sensor Front End | Embedded LIN Bus Node |
Use Scenario: Wireless sensor node with RF transceiver (e.g., CC1101) where MSP430F2619SKGD1 handles baseband signal processing and sensor fusion. IC Role / Device Role / Timing Role: Real-time signal preprocessing unit: ADC12 captures RF detector output, DAC12 generates local oscillator offsets, USCI_A1 SPI configures transceiver. Use Value: Sub-1 μs wake-up from LPM4 ensures minimal latency in event-driven RF wake-up schemes, preserving overall system responsiveness. | Use Scenario: Automotive body control module (BCM) sub-node communicating over LIN 2.x bus for seat position, mirror angle, or HVAC actuator feedback. IC Role / Device Role / Timing Role: LIN master/slave node using USCI_A0's auto-baud-rate detection and built-in LIN break detection for robust bus arbitration. Use Value: On-chip LIN-compliant UART eliminates external transceiver, reducing BOM cost and PCB area while maintaining ISO 17987 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2618SKGD1 | Same package and core, but 48 KB Flash, 2 KB RAM, no DAC12 - lacks dual 12-bit DACs and reduced memory | Suitable only for simpler sensor nodes without analog stimulus generation or large firmware requirements | Select when DAC functionality and >64 KB Flash are unnecessary to reduce cost |
| MSP430F5638IPZ | 100-pin QFP, 256 KB Flash, 16 KB RAM, enhanced USCI, but rated only to 85°C - not qualified for extreme temperature | Applicable in commercial/industrial settings with higher memory and performance needs, but not for >125°C environments | Choose for feature-rich designs requiring larger code space and higher-speed peripherals, provided temperature range permits |
Compared with MSP430F2619SKGD1, the MSP430F2618SKGD1 sacrifices DAC capability and memory for lower cost, while the MSP430F5638IPZ trades extreme-temperature qualification for greater memory and peripheral bandwidth - making MSP430F2619SKGD1 uniquely suited for compact, high-reliability analog-digital sensor systems operating beyond 125°C.
Availability
MSP430F2619SKGD1 is available at Aetrix Electronics and suitable for high-reliability industrial monitoring, downhole instrumentation, and aerospace subsystems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MSP430F2619SKGD1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of microcontroller innovation.
The MSP430F2619S family targets ultra-low-power, mixed-signal applications in harsh environments - engineered for extended battery life, rapid wake-up, and guaranteed operation from -55°C to +150°C.
FAQ
What is the maximum operating temperature rating for the MSP430F2619SKGD1?
The MSP430F2619SKGD1 is qualified for continuous operation from -55°C to +150°C ambient temperature and has been validated for 1000 hours at maximum rated temperature. This extreme-temperature qualification is achieved through TI's controlled baseline process, single-fab assembly/test, and enhanced silicon design - making it suitable for downhole, turbine, and military applications where standard commercial-grade MCUs fail.
Does the MSP430F2619SKGD1 include hardware debug support?
Yes, the MSP430F2619SKGD1 includes full JTAG boundary-scan support via dedicated TCK, TMS, TDI/TCLK, and TDO/TDI pins. It enables real-time emulation, flash programming, and non-intrusive debugging without requiring additional hardware - essential for validating firmware in high-temperature test chambers or sealed sensor enclosures where physical access is limited.
How many analog input channels does the MSP430F2619SKGD1 ADC support?
The MSP430F2619SKGD1 integrates the ADC12 module with eight selectable analog input channels (A0 through A7), accessible on P6.0–P6.7. The autoscan feature allows automatic sequential conversion across all enabled channels without CPU involvement - ideal for multi-sensor systems where deterministic sampling timing and low CPU overhead are required.
Can the MSP430F2619SKGD1 generate synchronized analog outputs?
Yes, the MSP430F2619SKGD1 features dual 12-bit DAC12 modules with hardware synchronization capability. Outputs appear on P6.5 (DAC12.1), P6.6 (DAC12.0), and P6.7 (DAC12.1), allowing phase-aligned analog waveforms - critical for applications like precision sensor excitation, calibration signal generation, or closed-loop control where timing skew between channels must be eliminated.
What communication interfaces are integrated into the MSP430F2619SKGD1?
The MSP430F2619SKGD1 includes four Universal Serial Communication Interfaces (USCIs): USCI_A0 and USCI_A1 support UART (with LIN auto-baud detection), IrDA, and SPI; USCI_B0 and USCI_B1 support I²C and SPI. This enables concurrent use of multiple protocols - for example, UART for host telemetry, I²C for local sensor communication, and SPI for RF transceiver control - all without external bridge ICs.
MSP430F2619SKGD1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- Die
- Series:
- MSP430F2xx
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 48
- Program Memory Size:
- 120KB (120K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2619SKGD1 FAQ
1.How can I place an order for MSP430F2619SKGD1 through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2619SKGD1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2619SKGD1 reliable?
The price and inventory of MSP430F2619SKGD1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2619SKGD1 is usually 5 days.
3.What payment methods are accepted for MSP430F2619SKGD1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2619SKGD1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2619SKGD1?
MSP430F2619SKGD1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2619SKGD1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2619SKGD1?
For technical support, including MSP430F2619SKGD1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2619SKGD1 requirements.
6.How does Aetrix verify that MSP430F2619SKGD1 is sourced from the original manufacturer or authorized distributors?
All MSP430F2619SKGD1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2619SKGD1 meets industry standards.
7.What is the process for return or replacement of MSP430F2619SKGD1?
All MSP430F2619SKGD1 units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2619SKGD1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2619SKGD1 part is unused and in its original packaging.
Return procedure for MSP430F2619SKGD1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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