Texas Instruments MSP430F2619SPM
- Part No.:
- MSP430F2619SPM
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
MSP430F2619SPM.pdf
- Description:
- IC MCU 16BIT 120KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:218
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Product details
Overview
MSP430F2619SPM from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 120 KB Flash, 4 KB RAM, dual 12-bit DACs, a 12-bit ADC with internal reference and autoscan, three-channel DMA, four USCI modules (UART/LIN/IrDA/SPI/I²C), two 16-bit timers (Timer_A3 and Timer_B7), and on-chip comparator-designed for extreme-temperature sensor systems and standalone RF front ends operating from –55°C to +150°C.
For engineers reviewing the MSP430F2619SPM datasheet, MSP430F2619SPM pinout, MSP430F2619SPM application, or MSP430F2619SPM equivalent, key selection criteria include its high-temperature qualification (1000 hrs at max rated temperature), QFP-64 package with verified pin mapping, integrated SVS/Brownout protection, and support for LIN auto-baud detection and synchronized dual DAC output in harsh-environment embedded control.
Technical Context
The MSP430F2619SPM implements a 16-bit CPU with constant generators and a digitally controlled oscillator (DCO) enabling sub-1-μs wake-up from Standby mode. Its five low-power modes-including LPM4 (0.1 μA RAM retention) and LPM3 (0.5 μA VLO)-are optimized for battery-powered measurement applications requiring long operational life.
Peripherals are tightly integrated via shared memory-mapped registers and hardware-triggered DMA channels. The ADC12 supports up to 8 analog inputs with sample-and-hold and internal/external reference selection, while DAC12 provides two synchronized 12-bit voltage outputs with dedicated pins (P6.5/DAC1, P6.6/DAC0, P6.7/DAC1/SVSIN) and programmable reference sourcing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with 62.5-ns instruction cycle and constant generators for optimized code efficiency |
| Memory | 120 KB Flash + 256 B info memory; 4 KB RAM - sufficient for firmware with real-time signal processing and calibration tables |
| ADC | 12-bit SAR ADC with 8-channel autoscan, internal reference (2.5 V), and sample-and-hold - enables multi-sensor analog acquisition without external components |
| DAC | Dual 12-bit voltage-output DACs (DAC12.0/DAC12.1) with synchronization and independent reference inputs - supports closed-loop analog control or waveform generation |
| Timers | Timer_A3 (3 capture/compare registers) and Timer_B7 (7 capture/compare registers with shadow registers) - suitable for PWM, input capture, and time-critical event sequencing |
| USCI Interfaces | Four USCI modules: USCI_A0/A1 (UART/LIN/IrDA/SPI) and USCI_B0/B1 (I²C/SPI) - enables concurrent serial communication with host, sensors, and displays |
| Supply Range | 1.8 V to 3.6 V operation - compatible with single-cell Li-ion, 2-cell alkaline, or regulated industrial supplies |
| Temperature Range | –55°C to +150°C - qualified for extended-life, high-reliability applications in oil & gas, aerospace, and automotive under-hood environments |
Pinout & Package
Package: 64-pin QFP (PM), lead-free, RoHS-compliant, with exposed thermal pad (per TI SLAS697E).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RST/NMI | Reset / Non-maskable interrupt input | Active-low reset with bootstrap loader entry capability; supports JTAG/Spy-Bi-Wire programming initiation |
| P1.0–P1.7 | General-purpose I/O with Timer_A/Comparator functions | Configurable digital I/O; TA0–TA2 compare/capture, CAOUT, TACLK - enables timer-driven GPIO and analog comparator interfacing |
| P6.0–P6.7 | Analog input / DAC output / SVS input | A0–A7 analog inputs for ADC12; DAC0 (P6.6), DAC1 (P6.5/P6.7); SVSIN (P6.7) - integrates analog sensing, actuation, and supply monitoring on same port group |
| USCI Pins (P3.x, P4.x, P5.x) | Serial interface signals | UCA0/UCA1 (UART/LIN/IrDA/SPI); UCB0/UCB1 (I²C/SPI) - supports dual independent serial buses for sensor hub and host communication |
| XT2IN/XT2OUT | High-frequency crystal oscillator terminals | Supports external 4–16 MHz crystals for precise system clocking - required for USB-capable derivatives (not present here) but used for high-accuracy timing in RF front ends |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low power consumption | 0.1 μA in Off mode (RAM retention), 0.5 μA in Standby (VLO), 365 μA active at 1 MHz/2.2 V - extends battery life in remote sensor nodes |
| Integrated analog subsystem | 12-bit ADC with internal 2.5-V reference and autoscan + dual 12-bit DACs with synchronization - eliminates need for external converters in closed-loop control |
| High-temperature qualification | 1000 hours continuous operation at +150°C with controlled baseline, extended lifecycle, and full traceability - meets requirements for downhole and engine-control applications |
| Multiple clock domains | Independent MCLK, SMCLK, ACLK sources with DCO, VLO, LFXT1, and XT2 oscillators - enables precise timing separation between CPU, peripherals, and low-power subsystems |
| Hardware DMA controller | Three-channel DMA supporting peripheral-to-memory and memory-to-peripheral transfers without CPU intervention - reduces active time during ADC sampling or UART streaming |
| Programmable supply monitoring | SVS with user-selectable threshold and Brownout Detector with hysteresis - ensures reliable reset and safe operation during voltage transients in unregulated power environments |
Applications
| Downhole Sensor Node | Automotive Under-Hood Controller |
|---|---|
Use Scenario: Real-time pressure, temperature, and vibration monitoring in oil/gas wellbores at >125°C ambient. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion, data logging, and RS-485/LIN transmission; uses ADC12 for analog conditioning and DAC12 for calibration offset correction. Use Value: Extended -55°C to +150°C operation and 1000-hour high-temp qualification eliminate derating and enable direct mounting near transducers. |
Use Scenario: Engine coolant temperature regulation and exhaust gas recirculation (EGR) valve feedback in turbocharged gasoline engines. IC Role / Device Role / Timing Role: Standalone control unit managing thermistor-based sensing, PWM-driven solenoid actuation, and LIN bus communication with ECU. Use Value: Dual synchronized DAC outputs drive precision current sources for 4–20 mA sensor loops; SVS ensures fail-safe shutdown during brownout events. |
| Industrial Wireless Transmitter | RF Front-End Calibration Module |
Use Scenario: Battery-powered wireless transmitter for factory-floor vibration sensors using LoRaWAN or NB-IoT modems. IC Role / Device Role / Timing Role: Data aggregator and preprocessing unit: ADC12 samples piezoelectric sensor output, applies digital filtering, then forwards via UART to modem IC. Use Value: Sub-1-μs wake-up from LPM4 and 365 μA/MHz active current minimize energy per measurement cycle - extending 10-year battery life. |
Use Scenario: On-board calibration of RF power amplifiers in phased-array radar systems requiring DC offset trimming and gain compensation. IC Role / Device Role / Timing Role: Precision analog controller generating calibrated bias voltages for GaN FET gate drivers using DAC12 outputs referenced to internal 2.5 V. Use Value: Matched 12-bit DAC linearity (±1 LSB INL) and low-drift internal reference ensure <±0.5% gain error over temperature - critical for beamforming accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F2419TPM | Same 64-pin QFP package, identical core/peripherals, but rated for –40°C to +105°C only; 60 KB Flash, 2 KB RAM | Lacks high-temperature qualification and reduced memory - unsuitable for downhole or under-hood use, but lower cost for commercial-grade sensor nodes | Select when operating environment stays below +105°C and firmware size ≤60 KB; verify SVS threshold compatibility for target supply rails |
| MSP430F5639IPZ | 113-pin QFP, 256 KB Flash, 16 KB RAM, enhanced USCI (eUSCI), higher DCO stability; rated –40°C to +85°C | Higher memory and clock precision support complex protocols (e.g., USB stack), but no high-temp rating and incompatible pinout | Choose for feature-rich applications needing larger code space and advanced peripherals where ambient temperature remains ≤85°C |
Compared with MSP430F2419TPM and MSP430F5639IPZ, the MSP430F2619SPM uniquely combines extreme-temperature operation, dual synchronized DACs, and full peripheral set in a 64-pin footprint - making it irreplaceable for mission-critical analog-intensive control in harsh environments.
Availability
MSP430F2619SPM is available at Aetrix Electronics and suitable for downhole instrumentation, automotive under-hood control, and industrial wireless sensor networks requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MSP430F2619SPM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of expertise in low-power microcontrollers and high-reliability industrial solutions.
The MSP430F2619SPM belongs to the MSP430x2xx ultra-low-power MCU family, designed specifically for battery-operated and thermally demanding embedded systems where energy efficiency, analog integration, and environmental ruggedness are primary design constraints.
FAQ
What is the maximum operating temperature specification for the MSP430F2619SPM?
The MSP430F2619SPM is qualified for continuous operation from –55°C to +150°C and has been tested for 1000 hours at maximum rated temperature. This high-temperature rating is achieved through TI's controlled baseline process, extended product lifecycle management, and full traceability - making MSP430F2619SPM suitable for downhole, aerospace, and under-hood automotive applications where standard MCUs fail.
Does the MSP430F2619SPM support LIN bus communication?
Yes, the MSP430F2619SPM supports LIN bus communication via its USCI_A0 and USCI_A1 modules, which include enhanced UART with auto-baud-rate detection - a mandatory feature for LIN 2.x slave node implementation. The MSP430F2619SPM can serve as a LIN slave controlling actuators or reporting sensor data without external transceivers when paired with TI's SN65HV23x series.
How many analog input channels does the ADC12 module support on the MSP430F2619SPM?
The ADC12 module on the MSP430F2619SPM supports up to eight analog input channels (A0–A7), accessible via P6.0 through P6.7. It includes internal reference (2.5 V), sample-and-hold, and autoscan functionality - allowing sequential conversion of multiple sensors without CPU intervention, directly leveraging the three-channel DMA for efficient data transfer.
What are the DAC output capabilities of the MSP430F2619SPM?
The MSP430F2619SPM features two synchronized 12-bit voltage-output DACs (DAC12.0 and DAC12.1) with dedicated pins: DAC0 on P6.6, DAC1 on P6.5 and P6.7. Both support internal or external reference sourcing, monotonic output, and ±1 LSB integral nonlinearity - enabling precision analog actuation, calibration offset correction, or waveform generation in closed-loop systems.
Is the MSP430F2619SPM pin-compatible with other MSP430F2xx devices in QFP-64 packages?
The MSP430F2619SPM shares the same 64-pin QFP (PM) mechanical footprint and core peripheral mapping with other MSP430F2xx variants like MSP430F2419TPM, but functional pin assignments differ for certain USCI and timer signals. While PCB layout is mechanically compatible, firmware and schematic validation are required due to variations in peripheral routing - e.g., P5.7 serves as TBOUTH/SVSOUT on MSP430F2619SPM but differs on lower-pin-count derivatives.
MSP430F2619SPM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-LQFP
- Series:
- MSP430F2xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPU16
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 48
- Program Memory Size:
- 120KB (120K x 8 + 256B)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F2619SPM FAQ
1.How can I place an order for MSP430F2619SPM through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F2619SPM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F2619SPM reliable?
The price and inventory of MSP430F2619SPM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F2619SPM is usually 5 days.
3.What payment methods are accepted for MSP430F2619SPM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F2619SPM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F2619SPM?
MSP430F2619SPM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F2619SPM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F2619SPM?
For technical support, including MSP430F2619SPM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F2619SPM requirements.
6.How does Aetrix verify that MSP430F2619SPM is sourced from the original manufacturer or authorized distributors?
All MSP430F2619SPM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F2619SPM meets industry standards.
7.What is the process for return or replacement of MSP430F2619SPM?
All MSP430F2619SPM units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F2619SPM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F2619SPM part is unused and in its original packaging.
Return procedure for MSP430F2619SPM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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