Texas Instruments MSP430F5212IRGZR
- Part No.:
- MSP430F5212IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5212IRGZR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 48VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,302
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Product details
Overview
MSP430F5212IRGZR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with 64 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), hardware multiplier, DMA, RTC, and comparator. It operates from 1.8–3.6 V DVCC and 1.62–1.98 V DVIO, targeting battery-powered sensor nodes and data loggers.
For engineers reviewing the MSP430F5212IRGZR datasheet, MSP430F5212IRGZR pinout, MSP430F5212IRGZR application, or MSP430F5212IRGZR equivalent, key selection criteria include its 48-pin VQFN package, absence of integrated ADC (vs. F522x series), 3.5 µs LPM3 wake-up time, dual-voltage I/O architecture, and support for crystal oscillators up to 32 MHz.
Technical Context
The MSP430F5212IRGZR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes an integrated LDO with programmable core voltage and supply supervision with brownout detection.
It features split I/O domains: 20 DVCC-supplied I/Os (including P1–P6, PJ) and 17 DVIO-supplied I/Os (including P1–P4, P7), enabling direct interfacing with 1.8-V peripherals without level shifters. All timers support capture/compare and PWM; USCI_A supports UART/IrDA/SPI; USCI_B supports I²C/SPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock |
| Memory | 64 KB Flash (in-system programmable), 8 KB RAM (full retention in LPM3/LPM4) |
| Power Modes | LPM3: 1.9 µA @ 2.2 V (RTC active); LPM4: 1.1 µA @ 3.0 V; LPM4.5: 0.18 µA @ 3.0 V |
| Wake-up Time | 3.5 µs from LPM3 to active mode (typical), enabling rapid response to sensor interrupts |
| Timers | TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers) - supports PWM, input capture, interval timing |
| Communication | USCI_A0/A1: UART (auto-baud), IrDA, SPI; USCI_B0/B1: I²C, SPI - dual independent serial interfaces |
| Supply System | Dual-rail: DVCC (1.8–3.6 V), DVIO (1.62–1.98 V) - eliminates external level translation for 1.8-V logic |
Pinout & Package
This device is housed in a 48-pin VQFN (RGZ) package with 7 mm × 7 mm body size and exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer A0 clock input / Auxiliary clock source | Accepts external 32-kHz crystal or digital clock for low-power timing and RTC synchronization |
| P1.4–P1.7, P2.0–P2.7, P3.0–P3.4, P4.0–P4.7, P7.0–P7.5 | DVIO-supplied general-purpose I/O | Operate at 1.62–1.98 V - directly interface with 1.8-V sensors, transceivers, or FPGAs |
| P6.0–P6.5, P5.0–P5.1, P3.0–P3.4, P4.0–P4.5 | DVCC-supplied I/O or peripheral function | Support full-drive/reduced-drive outputs and Schmitt-trigger inputs at 1.8–3.6 V |
| RST/NMI | Reset and non-maskable interrupt input | Active-low reset with configurable NMI edge detection for fault or watchdog recovery |
| BSLEN | Bootloader entry control | Enables factory-programmed UART-based firmware update without JTAG debugger |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Supply I/O Architecture | Separate DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) rails eliminate need for external level translators when connecting to 1.8-V peripherals |
| Ultra-Low-Power Operation | 1.1 µA in LPM4 with full RAM retention enables multi-year battery life in intermittent-sensing applications |
| Fast Wake-up from LPM3 | 3.5 µs typical transition to active mode allows precise timing-critical responses to external events (e.g., sensor triggers) |
| Integrated Real-Time Clock (RTC) | Crystal-controlled RTC with alarm capability supports accurate timekeeping and scheduled wake-up without external components |
| Hardware Multiplier & DMA | 32-bit multiplication in single cycle and 3-channel DMA reduce CPU load during math-intensive or burst-data transfers (e.g., sensor fusion) |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting via UART-to-LoRa module. IC Role / Device Role / Timing Role: Main controller managing sensor reads, RTC-timed transmissions, and ultra-low-power sleep cycles. Use Value: Dual-voltage I/O directly drives 1.8-V LoRa transceiver; 1.1 µA LPM4 extends 2-AA battery life beyond 5 years. | Use Scenario: Standalone environmental monitor logging sensor data to SPI flash every 10 minutes. IC Role / Device Role / Timing Role: Central MCU executing timed sampling, CRC-16 checksum generation, and flash write sequencing. Use Value: Hardware multiplier accelerates CRC calculation; TB0's 7 CC registers enable precise multi-channel PWM-driven LED status indicators. |
| Portable Medical Monitor | Smart Utility Meter Interface |
Use Scenario: Handheld pulse oximeter with analog front-end and OLED display. IC Role / Device Role / Timing Role: Signal processor and display controller with synchronized ADC sampling (external) and SPI-driven OLED refresh. Use Value: USCI_B0 handles I²C communication with external ADC; 3.5 µs wake-up ensures immediate response to button press or alarm condition. | Use Scenario: AMI meter interface board communicating with metrology IC via SPI and reporting via RS-485. IC Role / Device Role / Timing Role: Protocol bridge and secure bootloader host managing firmware updates over serial interface. Use Value: BSLEN pin enables field-upgradable firmware without JTAG; dual USCI modules support simultaneous SPI (metrology) and UART (RS-485 transceiver) operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5214IRGZR | 128 KB Flash, same 48-pin RGZ package, identical peripheral set and power specs | Higher Flash capacity supports larger firmware (e.g., OTA stack, encryption libraries) | Select when firmware growth headroom or future feature expansion is required |
| MSP430F5222IRGZR | Includes 8-channel 10-bit ADC (8 external + 2 internal inputs); otherwise identical Flash/RAM/timers/USCI | Enables direct analog sensing (e.g., battery voltage, thermistor) without external ADC | Select when on-chip analog acquisition is needed and ADC performance (200 kSPS) meets system requirements |
Compared with MSP430F5214IRGZR, the MSP430F5212IRGZR trades Flash capacity for cost-sensitive deployments; compared with MSP430F5222IRGZR, it omits the ADC to reduce silicon area and power in purely digital sensor-interface roles.
Availability
MSP430F5212IRGZR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, portable medical monitors, and smart utility meter interfaces requiring stable component supply and long-term manufacturability.
Supply support for MSP430F5212IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, personal electronics, and communications markets.
The MSP430F521x series is designed for ultra-low-power embedded applications where extended battery life, fast wake-up, and dual-voltage I/O interoperability are critical - especially in sensor systems and data acquisition devices without integrated analog front-ends.
FAQ
What is the maximum operating frequency of the MSP430F5212IRGZR?
The MSP430F5212IRGZR supports a maximum system clock frequency of 25 MHz, achieved via its digitally controlled oscillator (DCO) with FLL stabilization using external crystals (XT2 up to 32 MHz) or internal references. This enables high-speed code execution while maintaining ultra-low-power efficiency in active mode (290 µA/MHz at 8 MHz, 3.0 V).
Does the MSP430F5212IRGZR include an analog-to-digital converter (ADC)?
No, the MSP430F5212IRGZR does not include an integrated ADC. It belongs to the MSP430F521x series, which excludes the ADC10_A module present in the F522x series. For designs requiring analog sensing, external ADCs must be interfaced via USCI_B0 (I²C) or USCI_A0 (SPI), or the pin-compatible MSP430F5222IRGZR should be considered.
What package type and dimensions does the MSP430F5212IRGZR use?
The MSP430F5212IRGZR uses a 48-pin VQFN package (RGZ) with a 7 mm × 7 mm body size and an exposed thermal pad. TI recommends connecting the thermal pad to DVSS for optimal thermal performance and electrical stability, as documented in the SLAS718H datasheet Section 4.2.
How many general-purpose I/O pins does the MSP430F5212IRGZR provide?
The MSP430F5212IRGZR provides 37 total general-purpose I/O pins: 20 supplied by DVCC (1.8–3.6 V) and 17 supplied by DVIO (1.62–1.98 V). These include dedicated functions such as timer capture/compare, USCI signals, and RTC clock input, all configurable via port mapping control registers.
What are the key low-power modes supported by the MSP430F5212IRGZR?
The MSP430F5212IRGZR supports five low-power modes: LPM0–LPM3 (with increasing peripheral disablement) and LPM4/LPM4.5. Key operational points include LPM3 (1.9 µA @ 2.2 V with RTC active), LPM4 (1.1 µA @ 3.0 V with full RAM retention), and LPM4.5 (0.18 µA @ 3.0 V with supply supervisor only), enabling flexible power optimization across use cases.
MSP430F5212IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5212IRGZR FAQ
1.How can I place an order for MSP430F5212IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5212IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5212IRGZR reliable?
The price and inventory of MSP430F5212IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5212IRGZR is usually 5 days.
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MSP430F5212IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5212IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5212IRGZR?
For technical support, including MSP430F5212IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5212IRGZR requirements.
6.How does Aetrix verify that MSP430F5212IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430F5212IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5212IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430F5212IRGZR?
All MSP430F5212IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5212IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5212IRGZR part is unused and in its original packaging.
Return procedure for MSP430F5212IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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