My Inquiry
My Account
Texas Instruments MSP430F5212IRGZT
- Part No.:
- MSP430F5212IRGZT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5212IRGZT.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,979
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MSP430F5212IRGZT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller in the MSP430F521x series, featuring 64 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and DMA - designed for battery-powered sensor nodes and data loggers operating at 1.8–3.6 V primary supply and 1.62–1.98 V I/O interface voltage.
For engineers reviewing the MSP430F5212IRGZT datasheet, MSP430F5212IRGZT pinout, MSP430F5212IRGZT application, or MSP430F5212IRGZT equivalent, this page delivers verified specifications, functional block context, RGZ-48 package terminal mapping, low-power mode timing, and validated alternative options for industrial sensing and portable measurement designs.
Technical Context
The MSP430F5212IRGZT implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system including FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its split I/O architecture separates DVCC (core/peripheral supply) and DVIO (I/O rail), enabling direct interfacing with 1.8-V logic without level shifters.
It supports six low-power modes (LPM0–LPM4.5), with LPM3 delivering 1.9 µA at 2.2 V (RTC active, full RAM retention) and wake-up in 3.5 µs. The device omits the 10-bit ADC present in the F522x series but retains all other peripherals: COMP_B (6-channel), three USCI modules (two A-type, one B-type), and full JTAG/SBW debug support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 25-MHz max system clock - enables efficient C code execution and deterministic real-time response. |
| Memory | 64 KB Flash (in-system programmable, no external VPP) + 8 KB RAM - sufficient for firmware with protocol stacks and sensor buffering. |
| Low-Power Modes | LPM4.5 draws 0.18 µA at 3.0 V - ideal for long-term sleep in energy-harvesting or coin-cell applications with fast wake-up capability. |
| Timer Resources | TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC) - supports multi-channel PWM, input capture, quadrature decoding, and RTC alarm functions. |
| Communication Interfaces | USCI_A0/A1 (UART/IrDA/SPI), USCI_B0 (I²C/SPI) - enables simultaneous serial sensor communication and host interface without software bit-banging. |
| I/O Supply Scheme | Dual-rail: DVCC (1.8–3.6 V) for core/peripherals, DVIO (1.62–1.98 V) for I/O ports - eliminates external level translators when interfacing with 1.8-V sensors or transceivers. |
| Real-Time Clock | RTC_A module with calendar mode, alarms, and 32-kHz crystal support (XT1) - provides accurate timekeeping during LPM3 with <2 ppm drift using external crystal. |
Pinout & Package
Package: 48-pin VQFN (RGZ), 7 mm × 7 mm, exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Port 1 Bit 0 / Timer A0 clock input / Auxiliary clock | Configurable as GPIO, timer clock source, or 32-kHz ACLK output - critical for low-power timing synchronization. |
| P1.4–P1.7, P2.0–P2.7, P3.0–P3.4, P4.0–P4.7, P7.0–P7.5 | DVIO-domain general-purpose I/O | Driven by separate 1.62–1.98 V supply - directly interfaces with 1.8-V peripherals without level-shifting circuitry. |
| P5.4/XIN, P5.5/XOUT | Low-frequency crystal oscillator terminals | Supports 32.768-kHz watch crystal for RTC operation in LPM3 - requires external load capacitors per crystal spec. |
| P2.6/RTCCLK/DMAE0 | RTC clock input / DMA trigger | Accepts external 32-kHz signal or internal REFO/VLO - enables precise RTC calibration and DMA-triggered periodic sampling. |
| RST/NMI | Reset and non-maskable interrupt input | Active-low reset with Schmitt-trigger input on DVIO rail - ensures robust reset assertion even with slow-rising signals. |
| BSLEN | Bootloader entry control | Enables factory-programmed UART-based firmware update without JTAG - simplifies field upgrades in sealed enclosures. |
| DVIO | Separate I/O supply voltage input | Must be supplied within 1.62–1.98 V range - violation disables DVIO-domain I/O and may cause latch-up. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O architecture | Independent DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) rails eliminate need for external level shifters when connecting to 1.8-V sensors or interface ICs. |
| Fully integrated LDO with programmable core voltage | On-chip LDO regulates VCORE from DVCC, reducing external component count and improving power efficiency across voltage scaling. |
| Three-channel hardware DMA | Enables zero-CPU-overhead data movement between peripherals (e.g., USCI → RAM, ADC → RAM), preserving low-power mode residency. |
| Ultra-fast wake-up from LPM3 | 3.5 µs typical transition to active mode - supports burst-mode sensing where microsecond latency is critical for event capture. |
| Supply voltage supervisor with hysteresis | Detects brownout conditions on DVCC and DVIO with 50 mV hysteresis - prevents erratic operation during battery discharge or supply ripple. |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting via UART-to-LoRa module. IC Role / Device Role / Timing Role: Main controller managing sensor reads, RTC-timed transmissions, and ultra-low-power sleep scheduling. Use Value: LPM4.5 current of 0.18 µA extends 200-mAh coin cell life beyond 25 years in deep sleep; dual-supply I/O avoids level shifter BOM cost. |
Use Scenario: Standalone environmental logger recording sensor data every 10 minutes to internal Flash. IC Role / Device Role / Timing Role: Timekeeper and data aggregator using RTC_A alarm and DMA-accelerated Flash writes. Use Value: RTC calendar mode with crystal accuracy (<2 ppm) ensures reliable timestamping; 64 KB Flash stores >100k samples without external memory. |
| Portable Medical Monitor | Smart Meter Interface Module |
Use Scenario: Wearable pulse oximeter with analog front-end and BLE UART bridge. IC Role / Device Role / Timing Role: Signal conditioner and protocol handler interfacing analog sensors to host MCU via UART. Use Value: DVIO rail matches 1.8-V analog sensor outputs; USCI_A0 UART with auto-baud detection simplifies host handshaking. |
Use Scenario: Sub-metering module reading utility meter pulses and reporting via RS-485. IC Role / Device Role / Timing Role: Pulse counter and isolated RS-485 interface controller using TA0 capture and USCI_B0 in SPI mode. Use Value: TA0's five capture/compare registers support simultaneous pulse counting and LED blink timing; LPM3 enables 10-year battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5214IRGZT | 128 KB Flash, same 48-pin RGZ package, identical peripheral set - differs only in Flash size and part number suffix. | Preferred where firmware growth headroom or future feature expansion is required without PCB change. | Select MSP430F5214IRGZT if >64 KB code space is needed; pinout, timing, and power behavior are identical. |
| MSP430F5222IRGZT | Includes 10-bit ADC (8 external + 2 internal channels), otherwise identical Flash/RAM/timers/USCI - adds analog sensing capability. | Suitable for designs requiring on-chip analog acquisition (e.g., thermistor, battery voltage monitoring) without external ADC. | Choose MSP430F5222IRGZT only if ADC functionality is required; MSP430F5212IRGZT excludes ADC to reduce cost and power in digital-only systems. |
Compared with MSP430F5214IRGZT, the MSP430F5212IRGZT offers identical performance and footprint at lower Flash cost; versus MSP430F5222IRGZT, it removes ADC to minimize static current and bill-of-materials in purely digital sensor interface roles.
Availability
MSP430F5212IRGZT is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply, long-lifecycle assurance, and TI-qualified automotive-grade traceability.
Supply support for MSP430F5212IRGZT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in low-power design and industrial-grade reliability.
The MSP430F521x series was engineered for ultra-low-power portable measurement applications - emphasizing extended battery life, robust mixed-signal integration, and seamless 1.8-V system interfacing without external translation.
FAQ
What is the maximum system clock frequency supported by the MSP430F5212IRGZT?
The MSP430F5212IRGZT supports a maximum system clock (MCLK) frequency of 25 MHz, achieved via the integrated FLL using either internal REFO or external XT2 (up to 32 MHz) as reference. This enables high-speed computation while maintaining ultra-low active-mode current of 290 µA/MHz at 3.0 V during Flash execution.
Does the MSP430F5212IRGZT include an analog-to-digital converter (ADC)?
No, the MSP430F5212IRGZT does not include an ADC. It belongs to the MSP430F521x series, which explicitly omits the 10-bit ADC present in the F522x series. This omission reduces cost and static power consumption, making MSP430F5212IRGZT optimal for digital-only sensor interface or control applications.
What package type and pin count does the MSP430F5212IRGZT use?
The MSP430F5212IRGZT uses a 48-pin VQFN package (RGZ), measuring 7 mm × 7 mm with an exposed thermal pad. Pinout is identical to MSP430F5214IRGZT and MSP430F5222IRGZT in the same RGZ variant, enabling layout reuse across family members.
How does the dual-supply I/O architecture of the MSP430F5212IRGZT benefit system design?
The MSP430F5212IRGZT's dual-supply I/O architecture separates DVCC (1.8–3.6 V) for core/peripherals and DVIO (1.62–1.98 V) for I/O ports. This allows direct connection to 1.8-V logic devices - such as sensors, transceivers, or FPGAs - without external level shifters, reducing BOM cost, board area, and signal integrity risk.
What low-power modes are available on the MSP430F5212IRGZT, and what is its lowest current draw?
The MSP430F5212IRGZT supports six low-power modes (LPM0–LPM4.5). Its lowest operational current is 0.18 µA in LPM4.5 (shutdown mode) at 3.0 V, with full RAM retention and fast wake-up. In LPM3 (RTC active), it draws 1.9 µA at 2.2 V - ideal for time-critical battery-powered applications.
MSP430F5212IRGZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5212IRGZT FAQ
1.How can I place an order for MSP430F5212IRGZT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5212IRGZT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5212IRGZT reliable?
The price and inventory of MSP430F5212IRGZT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5212IRGZT is usually 5 days.
3.What payment methods are accepted for MSP430F5212IRGZT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5212IRGZT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5212IRGZT?
MSP430F5212IRGZT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5212IRGZT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5212IRGZT?
For technical support, including MSP430F5212IRGZT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5212IRGZT requirements.
6.How does Aetrix verify that MSP430F5212IRGZT is sourced from the original manufacturer or authorized distributors?
All MSP430F5212IRGZT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5212IRGZT meets industry standards.
7.What is the process for return or replacement of MSP430F5212IRGZT?
All MSP430F5212IRGZT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5212IRGZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5212IRGZT part is unused and in its original packaging.
Return procedure for MSP430F5212IRGZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MSP430F5212IRGZT Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
