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Texas Instruments MSP430F5214IRGZR
- Part No.:
- MSP430F5214IRGZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5214IRGZR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,018
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Product details
Overview
MSP430F5214IRGZR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with 128 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), hardware multiplier, DMA, RTC, and comparator. It operates from 1.8–3.6 V DVCC and 1.62–1.98 V DVIO, targeting battery-powered sensor nodes and data loggers.
For engineers reviewing the MSP430F5214IRGZR datasheet, MSP430F5214IRGZR pinout, MSP430F5214IRGZR application, or MSP430F5214IRGZR equivalent, key selection criteria include its 48-pin VQFN package, absence of ADC (vs. F522x series), dual-rail I/O architecture, LPM4.5 shutdown current of 0.18 µA, and RTC+DMA support for autonomous wake-up and low-power data acquisition.
Technical Context
The MSP430F5214IRGZR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32 kHz crystal), and XT2 (up to 32 MHz crystal). Its CPUXV2 core executes instructions at up to 25 MHz with constant generators for optimized code density.
Power management includes an integrated LDO with programmable core voltage, SVM/SVS monitoring, brownout reset, and five low-power modes (LPM0–LPM4.5). The split I/O supply enables direct interfacing with 1.8-V peripherals without external level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with 25-MHz max system clock and extended memory addressing |
| Memory | 128 KB Flash (in-system programmable) + 8 KB RAM for real-time data buffering and firmware updates |
| Low-Power Modes | LPM4.5 draws only 0.18 µA at 3.0 V - enables multi-year battery life in always-on sensing applications |
| Timers | Four independent 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers) for PWM, capture, and RTC synchronization |
| Communication | Two USCI modules: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI) - supports dual-protocol concurrent operation |
| I/O Supply | Dual-rail: DVCC (1.8–3.6 V) for analog/peripheral logic; DVIO (1.62–1.98 V) for digital I/O - eliminates external level translation |
| Wake-up Time | 3.5 µs from LPM3 to active mode - meets sub-10 µs response requirements for event-driven sensor systems |
Pinout & Package
Package: 48-pin VQFN (RGZ), 7 mm × 7 mm, exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer A0 clock input / Auxiliary clock source | Accepts external 32-kHz crystal or internal REFO/VLO for precise RTC timing and low-power timer operation |
| P1.1–P1.5/TA0.0–TA0.4 | Timer A0 capture/compare channels | Support PWM generation, input capture for pulse-width measurement, and quadrature decoding |
| P1.6/TA1CLK/CBOUT | Timer A1 clock input / Comparator B output | Enables synchronized timer triggering from comparator events or external clocks |
| P1.7/TA1.0 | Timer A1 channel 0 | Provides dedicated PWM or capture capability independent of TA0 resources |
| P2.0–P2.5/TA1.1–TA2.2 | Timer A1/A2 capture/compare channels | Extends PWM and timing flexibility across three independent Timer_A instances |
| P2.6/RTCCLK/DMAE0 | Real-time clock input / DMA trigger source | Allows RTC alarm or periodic interrupt to initiate DMA transfers without CPU intervention |
| P3.0–P3.4/UCB0SIMO–UCA0RXD | USCI_B0 (I²C) and USCI_A0 (UART/SPI) signals | Enables simultaneous I²C sensor communication and UART host interface on shared pins |
| P4.0–P4.5/PM_UCA1CLK–PM_UCA1RXD | USCI_A1 peripheral module signals | Provides second full-duplex UART or SPI interface for secondary communication or bootloader isolation |
| RST/NMI | Reset and non-maskable interrupt input | Hardware reset initiation and high-priority fault handling (e.g., power failure detection) |
| BSLEN | Bootloader entry control | Enables factory-programmed ROM-based BSL activation via DVIO rail for field firmware updates |
| RSTDVCC/SBWTDIO | Test interface I/O (Spy-Bi-Wire) | Single-wire debug and programming interface compatible with MSP-FET and LaunchPad tools |
| DVCC, DVSS, AVCC, AVSS | Power supply terminals | DVCC/DVSS power digital logic and timers; AVCC/AVSS supply analog peripherals (comparator, reference); DVIO powers all GPIO |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Supply I/O Architecture | Separate DVIO (1.62–1.98 V) and DVCC (1.8–3.6 V) rails enable direct interface to 1.8-V sensors and logic without level shifters |
| Ultra-Low-Power Shutdown (LPM4.5) | 0.18 µA consumption at 3.0 V allows multi-year operation on coin-cell batteries in maintenance-free deployments |
| Three-Channel DMA | Offloads CPU during ADC-less data movement (e.g., UART-to-RAM or timer-triggered memory copy), reducing active time |
| RTC with Alarm and Calendar Mode | Hardware real-time clock retains time/date across LPM4 and triggers wake-up or interrupts at configurable intervals |
| Hardware Multiplier (MPY32) | 32-bit multiplication in one cycle accelerates filtering, scaling, and cryptographic operations in sensor fusion algorithms |
| Split Peripheral Mapping (PM) | Configurable pin assignment (e.g., P4.x) allows dynamic remapping of USCI functions to avoid routing conflicts in dense PCB layouts |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via UART-to-LoRa module every 5 minutes. IC Role / Device Role / Timing Role: MSP430F5214IRGZR manages sensor reads, RTC-scheduled wake-up, UART transmission, and deep-sleep between cycles. Use Value: LPM4.5 current (0.18 µA) extends CR2032 battery life beyond 5 years; dual USCI permits concurrent sensor I²C reads and LoRa UART comms. | Use Scenario: Standalone environmental monitor logging pressure, light, and motion to internal Flash every hour for 30 days. IC Role / Device Role / Timing Role: MSP430F5214IRGZR acts as central controller executing RTC alarms, sensor polling, Flash writes, and low-power state transitions. Use Value: 128 KB Flash stores >100,000 timestamped samples; 3.5 µs wake-up ensures rapid response to motion-triggered high-frequency sampling. |
| Smart Meter Interface Module | Portable Medical Monitor |
Use Scenario: Sub-metering add-on board interfacing with utility meter's optical port and reporting via RS-485. IC Role / Device Role / Timing Role: MSP430F5214IRGZR decodes IR pulses, formats data, drives RS-485 transceiver, and maintains secure time-stamping. Use Value: Dual-supply I/O matches 1.8-V optical receiver and 3.3-V RS-485 driver; comparator monitors supply integrity during brownout conditions. | Use Scenario: Handheld pulse oximeter acquiring analog sensor data, computing SpO₂, and displaying results on segmented LCD. IC Role / Device Role / Timing Role: MSP430F5214IRGZR controls LED drivers, processes photodiode signals via comparator thresholds, and drives LCD segments. Use Value: Comparator_B provides fast analog threshold detection without ADC overhead; RTC maintains clinical session timestamps across sleep cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5224IRGZR | Includes 10-bit ADC with 8 external channels; same Flash/RAM/timers/USCI; identical 48-pin RGZ package | Required when analog sensor signal conditioning (e.g., thermistor, potentiometer) must be performed on-chip | Select MSP430F5224IRGZR if ADC functionality is needed; otherwise MSP430F5214IRGZR offers lower cost and identical low-power performance for digital-only interfaces. |
| MSP430F5212IRGZR | 64 KB Flash (vs. 128 KB); identical peripherals, package, and power specs | Suitable for simpler firmware with smaller code footprint (e.g., basic polling loops without complex protocol stacks) | Choose MSP430F5212IRGZR for cost-sensitive designs where firmware size remains under 64 KB and future feature expansion is unlikely. |
Compared with MSP430F5224IRGZR, the MSP430F5214IRGZR removes ADC circuitry to reduce leakage and cost while retaining identical timer, communication, and power capabilities; versus MSP430F5212IRGZR, it doubles Flash capacity for larger firmware, OTA updates, or dual-bank bootloading - critical for field-deployed reliability.
Availability
MSP430F5214IRGZR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and smart meter interface modules requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for MSP430F5214IRGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F521x series targets ultra-low-power embedded applications where extended battery life, deterministic real-time response, and robust peripheral integration are essential - especially in sensor, metering, and portable instrumentation systems.
FAQ
What is the maximum operating frequency of the MSP430F5214IRGZR?
The MSP430F5214IRGZR supports a maximum system clock frequency of 25 MHz, enabled by its digitally controlled oscillator (DCO) and FLL-based clock system. This allows high-speed instruction execution while maintaining ultra-low-power characteristics in active mode, with typical current draw of 290 µA/MHz at 8 MHz and 3.0 V during Flash program execution.
Does the MSP430F5214IRGZR include an analog-to-digital converter (ADC)?
No, the MSP430F5214IRGZR does not include an ADC. It belongs to the MSP430F521x series, which omits the 10-bit ADC present in the MSP430F522x series (e.g., MSP430F5224IRGZR). The MSP430F5214IRGZR retains all other peripherals - including comparators, timers, USCI modules, RTC, and DMA - making it ideal for digital-sensor or communication-centric applications.
What package type and pin count does the MSP430F5214IRGZR use?
The MSP430F5214IRGZR uses a 48-pin VQFN package (RGZ), measuring 7 mm × 7 mm with an exposed thermal pad. This compact, surface-mount package supports high-density PCB layouts and requires connection of the thermal pad to DVSS for optimal thermal performance and electrical stability, as specified in TI's packaging guidelines.
How does the dual-supply I/O architecture of the MSP430F5214IRGZR benefit system design?
The MSP430F5214IRGZR features separate DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) supplies, allowing direct interfacing with 1.8-V peripherals such as sensors, transceivers, or logic devices without external level shifters. This reduces BOM cost, PCB area, and signal integrity risks while simplifying power domain partitioning in mixed-voltage systems.
What low-power modes are supported by the MSP430F5214IRGZR, and what is the lowest current consumption?
The MSP430F5214IRGZR supports five low-power modes (LPM0–LPM4.5). Its deepest state, LPM4.5 (shutdown mode), consumes only 0.18 µA at 3.0 V with full RAM retention and supply supervisor active. Wake-up from LPM4.5 is possible via RST/NMI or SVS events, enabling ultra-long battery life in intermittently active applications like remote sensors or security tags.
MSP430F5214IRGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 17
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5214IRGZR FAQ
1.How can I place an order for MSP430F5214IRGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5214IRGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5214IRGZR reliable?
The price and inventory of MSP430F5214IRGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5214IRGZR is usually 5 days.
3.What payment methods are accepted for MSP430F5214IRGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5214IRGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5214IRGZR?
MSP430F5214IRGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5214IRGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5214IRGZR?
For technical support, including MSP430F5214IRGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5214IRGZR requirements.
6.How does Aetrix verify that MSP430F5214IRGZR is sourced from the original manufacturer or authorized distributors?
All MSP430F5214IRGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5214IRGZR meets industry standards.
7.What is the process for return or replacement of MSP430F5214IRGZR?
All MSP430F5214IRGZR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5214IRGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5214IRGZR part is unused and in its original packaging.
Return procedure for MSP430F5214IRGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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