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Texas Instruments MSP430F5217IYFFR
- Part No.:
- MSP430F5217IYFFR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-UFBGA, DSBGA
- Datasheet:
-
MSP430F5217IYFFR.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 64DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,970
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Product details
Overview
MSP430F5217IYFFR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller with 64 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), three 16-bit timers (TA0/TA1/TA2 + TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and DMA. It operates from 1.8–3.6 V DVCC and 1.62–1.98 V DVIO, targeting battery-powered sensor nodes and data loggers requiring fast wake-up (3.5 µs) and sub-µA standby current.
For engineers reviewing the MSP430F5217IYFFR datasheet, MSP430F5217IYFFR pinout, MSP430F5217IYFFR application, or MSP430F5217IYFFR equivalent, key selection criteria include its 64-pin DSBGA package, absence of integrated ADC (vs. F522x series), dual-rail I/O compatibility, LPM3/LPM4 current specs (1.9 µA / 1.1 µA at 3.0 V), and USCI peripheral configuration for low-power wired communication.
Technical Context
The MSP430F5217IYFFR implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes an integrated LDO with programmable VCORE, SVM/SVS monitoring, and brownout reset - enabling robust operation across voltage transitions in energy-constrained systems.
Peripherals are mapped via port mapping control (P4), supporting flexible I/O assignment. The device supports split-rail I/O: 22 pins on DVCC (3.6–1.8 V) and 31 pins on DVIO (1.98–1.62 V), eliminating external level shifters when interfacing with 1.8-V logic. All timers support capture/compare, PWM, and real-time counting; RTC_A provides alarm and calendar functions with crystal backup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 25-MHz max system clock |
| Memory | 64 KB Flash (in-system programmable, no external VPP), 8 KB RAM (full retention in LPM3/LPM4) |
| Power Modes | LPM3: 1.9 µA @ 3.0 V (RTC + watchdog + full RAM); LPM4: 1.1 µA @ 3.0 V (full RAM + supervisor) |
| Wake-up Time | 3.5 µs from LPM3 to active mode - enables rapid response to sensor interrupts without sacrificing sleep efficiency |
| Timers | Three Timer_A instances (5/3/3 CC registers) + one Timer_B (7 CC registers) - supports multi-channel PWM, input capture, and time-stamped event logging |
| Communication | Two USCI modules: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI) - enables concurrent wired interfaces with automatic baud rate detection |
| I/O Supply | Dual-rail: DVCC (1.8–3.6 V) powers 22 I/Os; DVIO (1.62–1.98 V) powers 31 I/Os - direct interface to 1.8-V peripherals without level translation |
Pinout & Package
Package: 64-pin DSBGA (YFF), 3.2 mm × 3.2 mm, 0.4-mm pitch, thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Port 1 bit 0 / Timer A0 clock input / Auxiliary clock | Configurable as GPIO, timer clock source, or 32-kHz crystal oscillator output for RTC timing |
| P1.1–P1.5/TA0.0–TA0.4 | Timer A0 capture/compare channels 0–4 | Support PWM generation, edge-triggered capture, and pulse-width measurement on five independent signals |
| P1.6/TA1CLK/CBOUT | Timer A1 clock input / Comparator B output | Enables synchronized timer operation or routing comparator decision to external circuitry |
| P2.0–P2.7 | Port 2 bits 0–7 (DVIO domain) | All 8 pins powered by DVIO rail - suitable for 1.8-V logic interface and interrupt-capable inputs |
| P3.0–P3.4 | USCI_B0 SDA/SCL/CLK + USCI_A0 SIMO/SOMI | Shared I²C master/slave and SPI slave functions - allows dual-protocol use on same pins with software configuration |
| P4.0–P4.5 | USCI_B1/USCI_A1 primary signals (STE, SDA/SCL, CLK, TXD, RXD) | Dedicated second USCI instance for isolated I²C or UART channel - avoids bus contention in multi-peripheral designs |
| RST/NMI | Reset and non-maskable interrupt input | Active-low reset with Schmitt trigger; doubles as NMI source for critical fault handling or wake-up from deep sleep |
| BSLEN | Bootloader entry enable | Pulled high during power-on to activate factory-programmed ROM bootloader - enables UART-based firmware updates without JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O architecture | Eliminates external level shifters when connecting to 1.8-V sensors, transceivers, or memory - reduces BOM count and PCB area |
| Sub-µA LPM4 operation | 1.1 µA at 3.0 V enables >10-year battery life in coin-cell-powered data loggers with periodic wake-up intervals |
| Hardware multiplier (MPY32) | Accelerates 16/32-bit arithmetic for sensor fusion, filtering, or cryptographic operations - reduces active-mode duration and energy per computation |
| Three-channel DMA | Enables zero-CPU-overhead data movement between peripherals (e.g., USCI → RAM, timer → RAM), preserving low-power modes during bulk transfers |
| Real-time clock with alarm | RTC_A module supports calendar mode, alarm interrupts, and 32-kHz crystal stabilization - provides precise timekeeping without host CPU intervention |
| Programmable LDO core regulator | VCORE adjustable via PMMCTL0 register - allows dynamic voltage scaling to match processing load and minimize active-mode power |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting readings every 5 minutes via UART-to-LoRa module. IC Role / Device Role / Timing Role: Main controller managing sensor reads, RTC-triggered wake-up, UART framing, and low-power state orchestration. Use Value: 1.9 µA LPM3 current extends CR2032 battery life beyond 3 years; dual-rail I/O directly drives 1.8-V LoRa transceiver without level shifter. |
Use Scenario: Standalone environmental monitor recording pressure, light, and motion data to internal Flash every hour. IC Role / Device Role / Timing Role: Central data acquisition unit with RTC alarm scheduling, Flash write management, and low-voltage brownout protection. Use Value: Hardware multiplier accelerates CRC-16 checksum calculation before Flash writes; 3.5 µs wake-up ensures precise timestamping of each sample. |
| Smart Meter Interface Module | Portable Medical Monitor |
Use Scenario: Sub-metering add-on board communicating with main meter MCU via I²C and reporting via RS-485 (via external transceiver). IC Role / Device Role / Timing Role: Isolated interface processor handling protocol translation, error checking, and power-fail-safe data buffering. Use Value: Two independent USCI_B modules allow simultaneous I²C slave (to meter) and I²C master (to EEPROM) - no software arbitration needed. |
Use Scenario: Wearable ECG patch acquiring analog signals (via external ADC), storing waveform snippets, and alerting on arrhythmia via buzzer. IC Role / Device Role / Timing Role: Real-time signal coordinator managing external ADC SPI reads, RTC-based sampling intervals, and low-power buzzer activation. Use Value: Three 16-bit timers enable concurrent ECG sampling timing, LED blink pattern, and buzzer tone generation - all hardware-synchronized without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5219IYFFR | Same package and pinout; 128 KB Flash (vs. 64 KB), identical peripheral set | Preferred where larger firmware footprint or future feature expansion is required | Select when code size exceeds 64 KB or long-term scalability is prioritized over cost |
| MSP430F5227IRGC | VQFN-64 (9×9 mm) vs. DSBGA-64 (3.2×3.2 mm); includes 10-bit ADC (10 ext + 2 int channels) | Suitable for designs requiring on-chip analog sensing without external ADC | Choose only if ADC functionality is needed and board space permits larger package |
Compared with MSP430F5219IYFFR, the MSP430F5217IYFFR offers identical low-power performance and peripheral capability at lower Flash cost; versus MSP430F5227IRGC, it trades ADC integration and package size for higher density and lower system-level BOM count in purely digital sensor interfaces.
Availability
MSP430F5217IYFFR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply, long-lifecycle assurance, and consistent DSBGA packaging for high-density PCB layouts.
Supply support for MSP430F5217IYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power design.
The MSP430F521x series was engineered for extended-battery-life measurement applications - emphasizing sub-µA sleep currents, fast wake-up, dual-rail I/O, and integrated peripherals that minimize external components in compact, energy-sensitive systems.
FAQ
What is the maximum operating frequency of the MSP430F5217IYFFR?
The MSP430F5217IYFFR supports a maximum system clock frequency of 25 MHz, achieved using the FLL-controlled DCO with XT2 (up to 32 MHz crystal) or internal reference sources. This allows high-speed instruction execution while maintaining ultra-low-power characteristics in active mode - critical for time-sensitive sensor processing tasks within the MSP430F5217IYFFR's power budget.
Does the MSP430F5217IYFFR include an integrated analog-to-digital converter (ADC)?
No, the MSP430F5217IYFFR does not include an integrated ADC. It belongs to the MSP430F521x series, which omits the ADC10_A module present in the F522x family. This simplifies the die and reduces cost for applications relying solely on digital peripherals and external ADCs - a confirmed architectural distinction documented in the SLAS718H datasheet section 1.3 and Table 3-1.
What package type and dimensions does the MSP430F5217IYFFR use?
The MSP430F5217IYFFR uses a 64-pin DSBGA (Die Size Ball Grid Array) package designated YFF, measuring 3.2 mm × 3.2 mm with 0.4-mm ball pitch. The thermal pad must be connected to DVSS per TI's mechanical guidelines. This compact, bottom-terminal package enables high-density layouts in space-constrained portable devices - a specification confirmed in Section 8 of the SLAS718H datasheet and TI's official package drawings.
How many general-purpose I/O pins does the MSP430F5217IYFFR support, and how are they powered?
The MSP430F5217IYFFR supports up to 22 I/O pins powered by DVCC (1.8–3.6 V) and up to 31 I/O pins powered by DVIO (1.62–1.98 V), totaling 53 usable GPIOs. This dual-rail architecture is explicitly defined in the "Features" section of SLAS718H and enables seamless interfacing with both 3.3-V and 1.8-V peripherals without external level-shifting circuitry - a key differentiator of the MSP430F5217IYFFR.
What low-power modes are supported by the MSP430F5217IYFFR, and what is the current draw in LPM4?
The MSP430F5217IYFFR supports LPM0 through LPM4, including LPM4.5. In LPM4 (full RAM retention, supply supervisor active), typical current consumption is 1.1 µA at 3.0 V - verified in Section 5.5 of SLAS718H. This ultra-low quiescent current makes the MSP430F5217IYFFR ideal for applications requiring infrequent wake-ups while preserving system state, such as periodic environmental monitoring.
MSP430F5217IYFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-UFBGA, DSBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5217IYFFR FAQ
1.How can I place an order for MSP430F5217IYFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5217IYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5217IYFFR reliable?
The price and inventory of MSP430F5217IYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5217IYFFR is usually 5 days.
3.What payment methods are accepted for MSP430F5217IYFFR?
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4.How is shipping managed for MSP430F5217IYFFR?
MSP430F5217IYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5217IYFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5217IYFFR?
For technical support, including MSP430F5217IYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5217IYFFR requirements.
6.How does Aetrix verify that MSP430F5217IYFFR is sourced from the original manufacturer or authorized distributors?
All MSP430F5217IYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5217IYFFR meets industry standards.
7.What is the process for return or replacement of MSP430F5217IYFFR?
All MSP430F5217IYFFR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5217IYFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5217IYFFR part is unused and in its original packaging.
Return procedure for MSP430F5217IYFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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