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Texas Instruments MSP430F5219IRGCR
- Part No.:
- MSP430F5219IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5219IRGCR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,967
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Product details
Overview
MSP430F5219IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 128 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), three 16-bit timers (TA0/TA1/TA2 + TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, DMA, and comparator-designed for battery-powered sensor systems and data loggers.
For engineers reviewing the MSP430F5219IRGCR datasheet, MSP430F5219IRGCR pinout, MSP430F5219IRGCR application, or MSP430F5219IRGCR equivalent, key selection criteria include its 1.8 V DVIO interface capability, LPM3 standby current of 1.9 µA at 3.0 V, 3.5 µs wake-up time, absence of integrated ADC (vs. F522x series), and VQFN-64 (RGC) package compatibility with industrial embedded designs.
Technical Context
The MSP430F5219IRGCR implements a split-rail I/O architecture: DVCC (1.8–3.6 V) powers core logic and select I/O ports (P1.0–P1.3, P5–P6, PJ), while DVIO (1.62–1.98 V) supplies high-density I/O banks (P1.4–P1.7, P2–P4, P7), enabling direct interfacing with 1.8-V peripherals without level shifters. Its unified clock system integrates FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz) sources.
Power management includes an on-chip LDO with programmable core voltage, SVM/SVS monitoring, brownout reset, and five low-power modes (LPM0–LPM4.5). The device lacks ADC10_A-confirmed by family comparison table and functional block diagrams-distinguishing it from the F522x series and targeting applications where analog conversion is handled externally or omitted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPU with constant generators and 25-MHz max system clock for efficient code execution in resource-constrained environments |
| Memory | 128 KB Flash (in-system programmable) + 8 KB RAM for firmware storage and real-time data buffering in standalone data loggers |
| Low-Power Modes | LPM3 draws 1.9 µA at 3.0 V with RTC, watchdog, and full RAM retention-enabling multi-year battery life in periodic-sensing applications |
| I/O Supply | Dual-rail: DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) allow native 1.8-V digital interface without external level translation circuitry |
| Wake-up Time | 3.5 µs from LPM3 to active mode-critical for responsive event-driven sensing and rapid duty-cycled operation |
| Peripherals | Three Timer_A instances (5/3/3 CC registers), one Timer_B (7 CC), two USCI (A0/A1: UART/IrDA/SPI; B0/B1: I²C/SPI), RTC_A, COMP_B (6-channel), MPY32, and 3-channel DMA |
| Package | VQFN-64 (RGC), 9 mm × 9 mm, exposed thermal pad-suited for compact industrial PCB layouts requiring thermal reliability |
Pinout & Package
VQFN-64 (RGC) package with 9 mm × 9 mm body size and exposed thermal pad recommended to be connected to DVSS for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Primary clock input / auxiliary clock source | Accepts 32-kHz crystal (XT1) for RTC timing or external clock; enables low-power timekeeping with crystal accuracy |
| P1.6/TA1CLK/CBOUT | Timer A1 clock input / comparator output | Supports asynchronous timer triggering or feeds comparator result directly to timer for windowed event detection |
| P2.6/RTCCLK/DMAE0 | RTC clock input / DMA trigger | Routes external 32-kHz signal to RTC or initiates DMA transfer on RTC alarm-enabling autonomous data capture without CPU wake-up |
| P3.0–P3.4/UCB0SIMO–UCA0RXD | USCI_B0 and USCI_A0 serial I/O | Configurable as I²C master/slave (B0) and UART/IrDA (A0)-supports dual-protocol sensor hub communication |
| P4.0–P4.5/PM_UCA1CLK–PM_UCA1RXD | USCI_A1 peripheral multiplexed pins | Second UART/IrDA/SPI interface-enables simultaneous host debug (A0) and sensor network (A1) connectivity |
| RST/NMI | Reset and non-maskable interrupt | Hardware reset initiation and high-priority fault handling-critical for fail-safe operation in safety-aware embedded systems |
| BSLEN | Bootloader entry control | Enables factory-programmed ROM bootloader via UART/SPI without external programming voltage-simplifies field firmware updates |
| RSTDVCC/SBWTDIO | SBW test I/O / reset supply monitor | Single-wire JTAG debugging interface and DVCC supervision-reduces debug footprint and enhances power integrity monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O architecture | Enables direct connection to 1.8-V sensors, transceivers, and memory without level-shifting components-reducing BOM cost and board area |
| Ultra-low-power LPM3 mode | 1.9 µA at 3.0 V with RTC running allows years of operation on coin-cell batteries in environmental monitoring nodes |
| No integrated ADC | Reduces die size and dynamic power-ideal for digital-only sensor aggregation, secure bootloaders, or systems using external precision ADCs |
| 3.5 µs wake-up from LPM3 | Minimizes active-mode overhead during short-duration tasks like RF packet transmission or GPIO edge sampling |
| Two independent USCI modules | Supports concurrent UART (debug/host) and I²C (sensor array) communication-eliminating software polling bottlenecks |
| Hardware multiplier (MPY32) | Accelerates fixed-point math for filtering, calibration, or cryptographic operations-reducing CPU load and energy per computation |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via sub-GHz RF transceiver every 5 minutes. IC Role / Device Role / Timing Role: Main controller managing sleep/wake cycles, sensor I²C reads, RF SPI framing, and RTC-triggered transmissions. Use Value: 1.9 µA LPM3 current extends CR2032 life beyond 3 years; dual USCI avoids bus contention between sensor and radio interfaces. | Use Scenario: Standalone vibration logger mounted on motor housing, recording timestamped acceleration bursts to internal Flash. IC Role / Device Role / Timing Role: Real-time data aggregator with RTC timestamping, Flash wear-leveling, and DMA-accelerated sensor FIFO transfers. Use Value: 3.5 µs wake-up ensures minimal latency capturing transient events; 128 KB Flash stores >100k samples before offloading. |
| Smart Meter Communication Module | Low-Power IoT Gateway Controller |
Use Scenario: PLC or RF mesh backhaul module in electricity meter, relaying consumption data to concentrator. IC Role / Device Role / Timing Role: Protocol bridge translating M-Bus or DLMS over UART to Zigbee/LoRaWAN via SPI, with secure boot and OTA update support. Use Value: Dual-supply I/O interfaces natively with 1.8-V LoRa transceivers; BSLEN enables field firmware upgrades without hardware rework. | Use Scenario: Edge gateway aggregating BLE sensor data, performing local preprocessing, and forwarding to cloud via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Co-processor managing BLE HCI UART, sensor I²C, and host MCU communication via second USCI UART. Use Value: No ADC simplifies thermal design and reduces EMI sensitivity; MPY32 accelerates CRC and encryption for secure BLE packet handling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5229IRGCR | Includes 10-bit ADC (10 external + 2 internal channels); otherwise identical peripheral set and pinout | Required when on-chip analog sensing (e.g., battery voltage, thermistor) is needed without external ADC | Select MSP430F5229IRGCR only if ADC functionality is essential-adds no layout change but increases dynamic power in active mode |
| MSP430F5217IRGCR | 64 KB Flash (vs. 128 KB), same RAM, peripherals, and package; otherwise functionally identical | Suitable for smaller firmware footprints where bootloader, drivers, and application fit within 64 KB | Choose MSP430F5217IRGCR to reduce cost when Flash headroom is not required-no PCB or software porting effort |
Compared with MSP430F5229IRGCR, the MSP430F5219IRGCR saves power by omitting ADC circuitry and offers double Flash for future firmware expansion; versus MSP430F5217IRGCR, it provides critical headroom for complex protocol stacks, secure boot, and field-upgradable features without sacrificing low-power performance.
Availability
MSP430F5219IRGCR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and smart meter communication modules requiring stable component supply across multi-year production cycles.
Supply support for MSP430F5219IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency and system integration.
The MSP430F521x product line targets ultra-low-power embedded control in battery-operated measurement and monitoring systems-prioritizing nanowatt sleep modes, fast wake-up, and flexible I/O voltage scaling over mixed-signal integration.
FAQ
What is the maximum operating frequency of the MSP430F5219IRGCR?
The MSP430F5219IRGCR supports a maximum system clock frequency of 25 MHz, achieved via its integrated FLL (Frequency-Locked Loop) using internal or external reference sources such as XT2 (up to 32 MHz crystal) or REFO. This enables high-throughput peripheral operation-including full-speed USCI UART at 1 Mbps-while maintaining deterministic real-time response in active mode.
Does the MSP430F5219IRGCR include an analog-to-digital converter (ADC)?
No, the MSP430F5219IRGCR does not include an ADC. As confirmed in the device comparison table and functional block diagrams, the F521x series omits the ADC10_A module present in the F522x series. This makes the MSP430F5219IRGCR appropriate for digital-only applications or systems using external precision ADCs, reducing power consumption and die area.
What are the supported low-power modes and their typical current draw for the MSP430F5219IRGCR?
The MSP430F5219IRGCR supports five low-power modes: LPM0–LPM4.5. Key values at 3.0 V include: LPM3 draws 1.9 µA (RTC active, full RAM retention); LPM4 draws 1.1 µA (RAM retention only); LPM4.5 draws 0.18 µA (zero-power state). These values are measured with all clocks disabled except those explicitly enabled, per SLAS718H specifications.
Is the MSP430F5219IRGCR pin-compatible with other devices in the F52xx family?
Yes, the MSP430F5219IRGCR in the RGC package is pin-compatible with MSP430F5229IRGCR, MSP430F5227IRGCR, and MSP430F5217IRGCR-sharing identical 64-pin VQFN layout, signal mapping, and power/ground pin locations. This allows hardware reuse across variants differing only in Flash size or ADC inclusion, simplifying platform design and inventory management.
What debug interfaces are supported by the MSP430F5219IRGCR?
The MSP430F5219IRGCR supports both JTAG and Spy-Bi-Wire (SBW) debug interfaces via dedicated pins (TEST/SBWTCK, PJ.0–PJ.3, RSTDVCC/SBWTDIO). SBW uses a single bidirectional data line and clock, reducing debug footprint; JTAG provides full boundary-scan capability. Both are supported by TI's MSP-FET and Code Composer Studio for firmware development and validation.
MSP430F5219IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5219IRGCR FAQ
1.How can I place an order for MSP430F5219IRGCR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5219IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5219IRGCR reliable?
The price and inventory of MSP430F5219IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5219IRGCR is usually 5 days.
3.What payment methods are accepted for MSP430F5219IRGCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5219IRGCR transactions.
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4.How is shipping managed for MSP430F5219IRGCR?
MSP430F5219IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5219IRGCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5219IRGCR?
For technical support, including MSP430F5219IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5219IRGCR requirements.
6.How does Aetrix verify that MSP430F5219IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5219IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5219IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5219IRGCR?
All MSP430F5219IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5219IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5219IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5219IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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