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Texas Instruments MSP430F5219IYFFR
- Part No.:
- MSP430F5219IYFFR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-UFBGA, DSBGA
- Datasheet:
-
MSP430F5219IYFFR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MSP430F5219IYFFR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 128 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, DMA, and comparator. It targets battery-powered sensor nodes and data loggers requiring sub-2 µA LPM3 current and 3.5 µs wake-up.
For engineers reviewing the MSP430F5219IYFFR datasheet, MSP430F5219IYFFR pinout, MSP430F5219IYFFR application, or MSP430F5219IYFFR equivalent, key selection criteria include its 128 KB Flash capacity, DVIO-compatible 1.62–1.98 V I/O rail, absence of integrated ADC (vs. F522x series), 64-pin DSBGA package, and support for crystal oscillators up to 32 MHz.
Technical Context
The MSP430F5219IYFFR implements a split-voltage I/O architecture: DVCC (1.8–3.6 V) powers core logic and select I/Os, while DVIO (1.62–1.98 V) supplies up to 31 general-purpose pins-enabling direct interfacing with 1.8-V peripherals without level shifters. Its unified clock system integrates FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz) sources.
It executes code from Flash or RAM with active-mode current as low as 150 µA/MHz (RAM execution, 3.0 V), enters LPM4.5 shutdown at 0.18 µA, and retains full RAM in all low-power modes. The device lacks ADC10_A (distinguishing it from MSP430F522x variants) but retains all other peripherals including COMP_B (6-channel), RTC_A, and three-channel DMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with constant generators and 25-MHz max system clock |
| Memory | 128 KB Flash (in-system programmable, no external VPP) + 8 KB RAM (full retention in LPM3/LPM4) |
| Low-Power Modes | LPM3: 1.9 µA @ 2.2 V (RTC + watchdog + supervisor active); LPM4.5: 0.18 µA @ 3.0 V (zero-power shutdown) |
| I/O Supply | Dual-rail: DVCC = 1.8–3.6 V (22 I/Os), DVIO = 1.62–1.98 V (31 I/Os), enabling native 1.8-V interface compatibility |
| Timers & Peripherals | Four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (A0/A1/B0/B1), RTC_A, MPY32, DMA (3-channel), COMP_B (6-channel) |
| Oscillators | Integrated VLO (10 kHz), REFO (32.768 kHz), XT1 (32-kHz crystal), XT2 (up to 32-MHz crystal), FLL-based frequency stabilization |
Pinout & Package
Package: 64-pin DSBGA (YFF), 3.2 mm × 3.2 mm, 0.4-mm pitch, thermal pad connected to DVSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Timer A0 clock input / Auxiliary clock output | Configurable as low-frequency system clock source or timer input; supports crystal or internal oscillator |
| P1.1–P1.5/TA0.0–TA0.4 | Timer A0 capture/compare channels | Five independent PWM or input-capture functions on Port 1; usable for motor control or signal timing |
| P1.6/TA1CLK/CBOUT | Timer A1 clock input / Comparator B output | Enables synchronized timer operation or direct comparator output routing to GPIO |
| P2.6/RTCCLK/DMAE0 | Real-time clock input / DMA trigger event | Accepts 32.768-kHz crystal for RTC; also serves as configurable DMA request source |
| P3.0–P3.4/UCB0SIMO–UCA0RXD | USCI_B0 (I²C/SPI) and USCI_A0 (UART/SPI) signals | Shared pins support dual-protocol serial: I²C slave/master or UART TX/RX with auto-baud detection |
| P4.0–P4.5/PM_UCA1/UCB1 | Secondary USCI_A1 and USCI_B1 peripheral mapping | Enables concurrent UART + I²C or dual SPI buses without software multiplexing |
| RST/NMI | Reset and non-maskable interrupt input | Active-low reset with built-in pull-up; doubles as NMI source for critical fault handling |
| BSLEN | Bootloader entry enable | Asserted during power-on or reset to activate on-chip UART bootloader (no external programmer needed) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-supply I/O (DVCC/DVIO) | Eliminates external level shifters when interfacing with 1.8-V sensors, transceivers, or memory |
| Ultra-low-power LPM3 (1.9 µA) | Enables multi-year battery life in always-on sensor nodes with RTC-triggered periodic wake-up |
| Hardware multiplier (MPY32) | Accelerates 16/32-bit arithmetic for FFT, filtering, or cryptographic operations without CPU overhead |
| Three-channel DMA | Offloads data movement from CPU during ADC-less operation (e.g., sensor FIFO transfers via USCI) |
| RTC with alarm and calibration | Provides accurate timekeeping and scheduled wake-up events independent of main CPU activity |
| On-chip bootloader (BSL) | Supports field firmware updates over UART using standard PC tools-no JTAG debugger required |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data via sub-GHz RF transceiver every 5 minutes. IC Role / Device Role / Timing Role: Main controller managing sensor reads, RF packet assembly, low-power sleep/wake cycles, and RTC-based scheduling. Use Value: 1.9 µA LPM3 current extends CR2032 battery life beyond 3 years; DVIO rail directly drives 1.8-V RF IC without voltage translation. |
Use Scenario: Standalone environmental monitor logging pressure, light, and motion data to SPI flash every hour. IC Role / Device Role / Timing Role: Central data aggregator with RTC timestamping, SPI flash controller, and wake-on-interrupt capability. Use Value: Three-channel DMA moves sensor data to flash without CPU intervention; 3.5 µs wake-up ensures precise sampling alignment. |
| Smart Meter Interface Module | Portable Medical Monitor |
Use Scenario: Communication bridge between utility meter ASIC and PLC modem, translating protocols and buffering data. IC Role / Device Role / Timing Role: Protocol converter with UART-to-SPI bridging, real-time clock synchronization, and secure boot. Use Value: Dual USCI modules handle simultaneous UART (meter) and SPI (modem) traffic; LPM4.5 reduces standby leakage to 0.18 µA. |
Use Scenario: Wearable ECG patch acquiring analog signals (via external ADC), processing beats-per-minute, and alerting via BLE. IC Role / Device Role / Timing Role: Signal processor and BLE host controller coordinating acquisition timing, algorithm execution, and wireless transmission. Use Value: Hardware multiplier accelerates QRS detection algorithms; 128 KB Flash stores firmware + patient history logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5229IRGC | Includes 10-bit ADC (10 external + 2 internal channels); same Flash/RAM/timers/peripherals otherwise | Required where on-chip analog sensing (e.g., thermistor, battery voltage) is needed without external ADC | Select MSP430F5229IRGC if integrated ADC functionality is mandatory; otherwise MSP430F5219IYFFR offers lower cost and identical digital performance |
| MSP430F5217IYFFR | Same architecture and peripherals, but reduced Flash (64 KB vs. 128 KB) and same 8 KB RAM | Suitable for firmware with smaller footprint (<64 KB) where code size is constrained by cost or memory density | Choose MSP430F5217IYFFR for cost-sensitive designs with verified <64 KB code size; MSP430F5219IYFFR provides headroom for future feature expansion |
Compared with MSP430F5229IRGC, the MSP430F5219IYFFR removes ADC functionality to reduce cost and power, while retaining identical timer, communication, and low-power capabilities; versus MSP430F5217IYFFR, it doubles Flash capacity for complex firmware or OTA update partitions without changing PCB layout or power design.
Availability
MSP430F5219IYFFR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and smart meter interface modules requiring stable component supply, long-term lifecycle assurance, and TI-authorized traceability.
Supply support for MSP430F5219IYFFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions with emphasis on energy efficiency, reliability, and system integration.
The MSP430F5219IYFFR belongs to TI's MSP430F5xx ultra-low-power MCU family, designed specifically for extended-battery-life applications in sensing, metering, and portable instrumentation where sub-µA sleep currents and fast wake-up are critical.
FAQ
What is the maximum operating frequency of the MSP430F5219IYFFR?
The MSP430F5219IYFFR supports a maximum system clock frequency of 25 MHz, achieved via its integrated FLL (Frequency-Locked Loop) with XT2 crystal oscillator (up to 32 MHz) or internal DCO. This enables high-speed computation while maintaining ultra-low active-mode current of 290 µA/MHz at 8 MHz and 3.0 V.
Does the MSP430F5219IYFFR include an analog-to-digital converter (ADC)?
No, the MSP430F5219IYFFR does not integrate an ADC. It belongs to the MSP430F521x series, which omits the ADC10_A module present in the MSP430F522x series (e.g., MSP430F5229). All other peripherals-including timers, USCI, RTC, comparator, DMA, and hardware multiplier-are retained.
What package type and dimensions does the MSP430F5219IYFFR use?
The MSP430F5219IYFFR uses a 64-pin DSBGA (Die Size Ball Grid Array) package designated YFF, measuring 3.2 mm × 3.2 mm with 0.4-mm ball pitch. The thermal pad must be connected to DVSS for optimal thermal performance and electrical stability.
How does the dual-supply I/O architecture (DVCC/DVIO) benefit system design?
The MSP430F5219IYFFR's DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) rails allow direct connection to 1.8-V peripherals-such as RF transceivers, digital sensors, or memory-without external level shifters. This reduces BOM cost, board space, and signal integrity risks associated with voltage translation.
Can the MSP430F5219IYFFR be programmed in-system without a JTAG debugger?
Yes, the MSP430F5219IYFFR includes an on-chip UART bootloader (BSL) activated via the BSLEN pin. Firmware updates can be performed in-system using standard UART communication and TI-provided BSL scripts-eliminating the need for JTAG hardware during field deployment or prototyping.
MSP430F5219IYFFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-UFBGA, DSBGA
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5219IYFFR FAQ
1.How can I place an order for MSP430F5219IYFFR through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5219IYFFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MSP430F5219IYFFR reliable?
The price and inventory of MSP430F5219IYFFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5219IYFFR is usually 5 days.
3.What payment methods are accepted for MSP430F5219IYFFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MSP430F5219IYFFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MSP430F5219IYFFR?
MSP430F5219IYFFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MSP430F5219IYFFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MSP430F5219IYFFR?
For technical support, including MSP430F5219IYFFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5219IYFFR requirements.
6.How does Aetrix verify that MSP430F5219IYFFR is sourced from the original manufacturer or authorized distributors?
All MSP430F5219IYFFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5219IYFFR meets industry standards.
7.What is the process for return or replacement of MSP430F5219IYFFR?
All MSP430F5219IYFFR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5219IYFFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5219IYFFR part is unused and in its original packaging.
Return procedure for MSP430F5219IYFFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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