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Texas Instruments MSP430F5219IYFFT

Part No.:
MSP430F5219IYFFT
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-UFBGA, DSBGA
Datasheet:
AetrixMSP430F5219IYFFT.pdf
Description:
IC MCU 16BIT 128KB FLASH 64DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:172

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Product details

Overview

MSP430F5219IYFFT from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller with 128 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, DMA, and comparator. It targets battery-powered sensor nodes and data loggers requiring fast wake-up (3.5 µs), sub-2 µA LPM3 current, and 1.62–1.98 V DVIO interface compatibility.

For engineers reviewing the MSP430F5219IYFFT datasheet, MSP430F5219IYFFT pinout, MSP430F5219IYFFT application, or MSP430F5219IYFFT equivalent, key selection criteria include its absence of ADC (vs. F522x series), DSBGA-64 package constraints, DVIO rail support for 1.8-V logic interfacing, and LPM4.5 shutdown current of 0.18 µA at 3.0 V.

Technical Context

The MSP430F5219IYFFT implements a split I/O supply architecture: DVCC powers core logic and analog peripherals (AVCC/AVSS), while DVIO independently supplies up to 31 general-purpose I/O pins-enabling direct connection to 1.8-V systems without level shifters. Its unified clock system integrates FLL, VLO, REFO, XT1 (32-kHz), and XT2 (up to 32 MHz) sources with automatic frequency stabilization.

Peripherals are managed via port mapping control and interrupt vectoring across 16+ interrupt-capable pins. The device lacks ADC10_A but retains full timer complement (TA0 with 5 CC registers, TA1/TA2 with 3 each, TB0 with 7), dual USCI_A/B modules supporting UART/IrDA/SPI/I²C, and RTC_A with alarm capability-all operating under active, LPM3, or LPM4 power modes.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPU with 25-MHz max system clock and extended memory addressing
Memory128 KB Flash (in-system programmable), 8 KB RAM (full retention in LPM3/LPM4)
Power ModesLPM3: 1.9 µA @ 2.2 V (RTC + watchdog + supervisor); LPM4.5: 0.18 µA @ 3.0 V (full shutdown)
Wake-up Time3.5 µs typical from LPM3 to active mode-critical for responsive sensor polling
Dual-Supply I/ODVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V-supports mixed-voltage board design without external translators
TimersFour 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers)
CommunicationUSCI_A0/A1: UART/IrDA/SPI; USCI_B0/B1: I²C/SPI-dual independent serial interfaces

Pinout & Package

Package: DSBGA-64 (YFF), 0.4-mm pitch, 3.2 mm × 3.2 mm body size with exposed thermal pad (to be connected to DVSS).

Pin/TerminalCircuit RoleDesign Meaning
P1.0/TA0CLK/ACLKTimer A0 clock input / Auxiliary clock sourceAccepts external 32-kHz crystal or internal REFO/VLO; enables precise RTC timing
P1.4–P1.7, P2.0–P2.7, P4.0–P4.7, P7.0–P7.5DVIO-domain general-purpose I/ODriven by separate 1.62–1.98 V supply-interfacing directly with 1.8-V logic ICs
RST/NMIReset and non-maskable interrupt inputActive-low reset with Schmitt-trigger input; supports NMI edge detection for critical events
BSLENBootloader entry controlEnables factory-programmed ROM bootloader via DVIO-supplied signal-no external voltage needed
RSTDVCC/SBWTDIOTest interface I/O (Spy-Bi-Wire)Single-wire debug interface powered by DVCC-reduces PCB routing vs. JTAG

Key Features

FeatureDesign Value
Dual-supply I/O architectureEliminates external level shifters when interfacing with 1.8-V sensors, transceivers, or FPGAs
Ultra-low-power LPM4.5 mode0.18 µA shutdown current extends shelf life and battery runtime in infrequently polled devices
Hardware multiplier (MPY32)Accelerates 32-bit arithmetic for sensor fusion, filtering, or cryptographic operations in firmware
Three-channel DMA controllerOffloads CPU during high-speed peripheral transfers (e.g., USCI SPI bursts or timer capture sequences)
Real-time clock with alarmEnables scheduled wake-up for periodic sensing without CPU involvement-reducing average system power

Applications

Wireless Sensor NodeIndustrial Data Logger

Use Scenario: Battery-powered temperature/humidity node transmitting via sub-GHz RF transceiver every 5 minutes.

IC Role / Device Role / Timing Role: Main controller managing sensor reads, RTC-triggered wake-up, low-power SPI communication with RF IC, and DVIO-driven 1.8-V transceiver interface.

Use Value: 1.9 µA LPM3 current and 3.5 µs wake-up minimize energy per measurement cycle; DVIO rail avoids level-shifter BOM cost and layout area.

Use Scenario: Standalone environmental monitor logging pressure, light, and motion to internal Flash over 6 months on coin cell.

IC Role / Device Role / Timing Role: System-on-chip handling analog sensor conditioning (via comparator), time-stamped storage, and USB/UART host upload upon connection.

Use Value: 128 KB Flash stores >100k timestamped samples; RTC alarm wakes CPU only for write cycles-extending battery life beyond 180 days.

Smart Meter Interface ModulePortable Medical Diagnostic Tool

Use Scenario: Add-on module for legacy electricity meters providing pulse counting, tamper detection, and optical IR communication.

IC Role / Device Role / Timing Role: Isolated interface MCU reading meter pulses via comparator, driving IR LED with precise timing, and managing secure firmware updates via USCI_A UART.

Use Value: Dual-supply I/O allows direct connection to 1.8-V IR transceiver IC; LPM4.5 mode ensures <0.2 µA standby draw during idle periods between meter pulses.

Use Scenario: Handheld blood glucose reader with LCD, button interface, and Bluetooth LE connectivity.

IC Role / Device Role / Timing Role: Primary controller acquiring analog strip readings, driving segment LCD, managing button interrupts, and synchronizing BLE advertising intervals using RTC.

Use Value: 8 KB RAM buffers sensor data and BLE packet payloads; 16-bit timers generate precise PWM for LCD contrast control and LED indicators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5229IRGCIncludes 10-bit ADC (10 external + 2 internal channels); same Flash/RAM/timers/USCI; VQFN-64 packageRequired where analog sensor signal acquisition (e.g., thermistor, battery voltage) is performed on-chipSelect when ADC functionality is needed-no software or pinout changes required beyond enabling ADC module
MSP430F5217IYFFTSame feature set and DSBGA-64 package; differs only in Flash size (64 KB vs. 128 KB)Suitable for firmware with smaller code footprint (e.g., fixed-function sensor read + transmit only)Choose for cost-sensitive designs where 64 KB Flash suffices-identical pinout, power, and peripheral compatibility

Compared with MSP430F5229IRGC, the MSP430F5219IYFFT omits ADC but retains identical timer, USCI, RTC, and power architecture-making it optimal for digital-only sensor aggregation. Against MSP430F5217IYFFT, it doubles Flash capacity for field-upgradable firmware or larger protocol stacks without altering PCB layout or power design.

Availability

MSP430F5219IYFFT is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and smart meter interface modules requiring stable component supply, long-term lifecycle assurance, and consistent DSBGA-64 packaging.

Supply support for MSP430F5219IYFFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in ultra-low-power design.

The MSP430F521x series was designed for energy-constrained applications demanding extended battery life, rapid wake-up, and mixed-voltage interoperability-targeting sensor systems, portable instrumentation, and infrastructure monitoring.

FAQ

What is the maximum operating frequency of the MSP430F5219IYFFT?

The MSP430F5219IYFFT supports a maximum system clock frequency of 25 MHz, achieved via its integrated digitally controlled oscillator (DCO) with FLL stabilization. This allows real-time processing of sensor data streams or protocol stack execution while maintaining ultra-low active-mode current (290 µA/MHz at 8 MHz, 3.0 V). The MSP430F5219IYFFT does not require external high-frequency crystals for full-speed operation, though XT2 supports up to 32 MHz if used.

Does the MSP430F5219IYFFT include an analog-to-digital converter (ADC)?

No, the MSP430F5219IYFFT does not include an ADC. It belongs to the MSP430F521x series, which excludes the ADC10_A module present in the F522x family (e.g., MSP430F5229). The MSP430F5219IYFFT retains all other peripherals-including comparators, timers, USCI, RTC, and DMA-but relies on external ADCs or comparator-based threshold detection for analog signal handling.

What is the purpose of the DVIO supply pin on the MSP430F5219IYFFT?

On the MSP430F5219IYFFT, the DVIO supply pin powers a dedicated I/O bank (up to 31 pins) at 1.62–1.98 V, enabling direct interface with 1.8-V logic devices such as sensors, RF transceivers, or FPGAs without external level shifters. This split-rail architecture reduces BOM cost, PCB area, and signal integrity risk-while DVCC (1.8–3.6 V) powers the core, Flash, RAM, and analog peripherals like the comparator and RTC.

How many USCI modules does the MSP430F5219IYFFT support, and what protocols do they implement?

The MSP430F5219IYFFT supports two USCI_A modules (USCI_A0 and USCI_A1) and two USCI_B modules (USCI_B0 and USCI_B1). USCI_A handles UART (with auto-baud detection), IrDA, and SPI; USCI_B supports I²C and SPI. This provides four independent serial interfaces-allowing concurrent communication with multiple peripherals (e.g., UART to host, I²C to sensor, SPI to display) without software multiplexing or performance bottlenecks.

What debug interface is supported by the MSP430F5219IYFFT, and how is it implemented?

The MSP430F5219IYFFT supports Spy-Bi-Wire (SBW), a two-pin (SBWTCK and SBWTDIO) debug interface compatible with TI's MSP-FET and LaunchPad development tools. SBW operates over the RSTDVCC/SBWTDIO and TEST/SBWTCK pins, both powered by DVCC. It enables full JTAG-equivalent functionality-including flash programming, breakpoint setting, and real-time register inspection-with minimal PCB footprint versus traditional 4-wire JTAG.

MSP430F5219IYFFT Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-UFBGA, DSBGA
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5219IYFFT FAQ

1.How can I place an order for MSP430F5219IYFFT through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5219IYFFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5219IYFFT reliable?

The price and inventory of MSP430F5219IYFFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5219IYFFT is usually 5 days.

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Once your MSP430F5219IYFFT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5219IYFFT?

For technical support, including MSP430F5219IYFFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5219IYFFT requirements.

6.How does Aetrix verify that MSP430F5219IYFFT is sourced from the original manufacturer or authorized distributors?

All MSP430F5219IYFFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5219IYFFT meets industry standards.

7.What is the process for return or replacement of MSP430F5219IYFFT?

All MSP430F5219IYFFT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5219IYFFT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5219IYFFT part is unused and in its original packaging.

Return procedure for MSP430F5219IYFFT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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