Texas Instruments MSP430F5219IZQER

Overview

MSP430F5219IZQER from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller in the MSP430F521x series, designed for battery-powered sensor and data-logging systems. It features 128 KB flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), hardware multiplier, DMA, RTC, and comparator - all operating down to 1.8 V DVCC and 1.62 V DVIO.

For engineers reviewing the MSP430F5219IZQER datasheet, MSP430F5219IZQER pinout, MSP430F5219IZQER application, or MSP430F5219IZQER equivalent, key selection criteria include its 64-pin BGA (80-ball ZQE) package, absence of integrated ADC (distinguishing it from F522x variants), dual-rail I/O flexibility, sub-2 µA LPM3 current, and 3.5 µs wake-up time - critical for energy-constrained embedded sensing nodes.

Technical Context

The MSP430F5219IZQER implements a 16-bit RISC CPUXV2 core with constant generators and unified clock system featuring FLL stabilization, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power architecture includes an integrated LDO with programmable core voltage and full SVM/SVS brownout supervision across both DVCC and DVIO rails.

Peripheral integration centers on three USCI modules (USCI_A0/A1/B0), enabling concurrent UART/IrDA/SPI and I²C communication; timer subsystem comprises TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), and TB0 (7 CC shadow registers); and I/O is partitioned into DVCC-domain (22 pins) and DVIO-domain (31 pins), each with configurable drive strength and Schmitt-trigger inputs.

Key Specifications

Pinout & Package

The MSP430F5219IZQER is housed in an 80-ball BGA (ZQE) package with 0.5-mm pitch, thermal pad exposed on underside (to be connected to ground plane per TI recommendation). Pin functions are defined across DVCC- and DVIO-supplied I/O banks, JTAG/SBW debug interface, and dedicated analog/oscillator pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Compared with MSP430F5229IZQE, the MSP430F5219IZQER removes ADC functionality while retaining full timer, USCI, RTC, and DMA capability - making it optimal for digital-sensor-centric designs. Against MSP430F5217IZQE, it doubles flash capacity without increasing power or package size - enabling more robust firmware and field-upgradeability.

Availability

MSP430F5219IZQER is available at Aetrix Electronics and suitable for environmental monitoring, industrial data logging, and portable medical devices requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for MSP430F5219IZQER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.

The MSP430F521x series is part of TI's ultra-low-power MCU portfolio, engineered specifically for extended-battery-life applications in sensing, metering, and portable instrumentation - emphasizing sub-µA sleep modes, fast wake-up, and integrated power management.

FAQ

What is the maximum operating frequency of the MSP430F5219IZQER?

The MSP430F5219IZQER supports a maximum system clock frequency of 25 MHz, achieved via its digitally controlled oscillator (DCO) stabilized by the FLL loop using reference sources such as XT2 (up to 32 MHz), REFO, or VLO. This enables high-throughput processing for time-critical tasks while maintaining ultra-low-power efficiency in active mode.

Does the MSP430F5219IZQER include an analog-to-digital converter (ADC)?

No, the MSP430F5219IZQER does not integrate an ADC. It belongs to the MSP430F521x series, which omits the ADC10_A module present in the F522x series (e.g., MSP430F5229). All other peripherals - including timers, USCI, RTC, comparator, and DMA - are retained, making it ideal for digital-sensor-based systems where external ADCs or digital-output sensors are used.

What package type and pin count does the MSP430F5219IZQER use?

The MSP430F5219IZQER uses an 80-ball BGA package (ZQE) with 5 mm × 5 mm body size and 0.5-mm ball pitch. It is functionally and pin-compatible with other ZQE-packaged members of the F521x/F522x family, including MSP430F5229IZQE and MSP430F5217IZQE, allowing shared PCB layout across variants.

How does the dual-supply I/O architecture of the MSP430F5219IZQER benefit system design?

Its dual-supply I/O architecture separates DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) domains, enabling direct interface to 1.8-V peripherals without external level shifters. This reduces bill-of-materials cost, PCB area, signal integrity issues, and power losses - especially valuable in compact, battery-operated devices like wearables and wireless sensors.

What debug interface does the MSP430F5219IZQER support, and how many pins are required?

The MSP430F5219IZQER supports Spy-Bi-Wire (SBW), a two-wire debug interface using SBWTCK and SBWTDIO (shared with RST/NMI and RSTDVCC pins). This minimizes debug footprint versus standard JTAG, requiring only two dedicated balls in the ZQE package - preserving I/O for application use while enabling full flash programming and real-time debugging.