Texas Instruments MSP430F5227IRGCT
- Part No.:
- MSP430F5227IRGCT
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5227IRGCT.pdf
- Description:
- IC MCU 16BIT 64KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

Inventory:250
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Product details
Overview
MSP430F5227IRGCT from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 64 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), 10-bit ADC with 10 external channels, two USCI modules (UART/IrDA/SPI/I²C), four 16-bit timers, RTC, hardware multiplier, and DMA - deployed in battery-powered sensor nodes and data loggers.
For engineers reviewing the MSP430F5227IRGCT datasheet, MSP430F5227IRGCT pinout, MSP430F5227IRGCT application, or MSP430F5227IRGCT equivalent, key selection criteria include LPM3 current (1.9 µA), dual-voltage I/O support (1.62–1.98 V DVIO), 64-pin VQFN package, RTC alarm capability, and ADC sample rate (200 kSPS) for precision analog sensing.
Technical Context
The MSP430F5227IRGCT implements a CPUXV2 16-bit RISC core with constant generators and extended memory addressing, paired with a unified clock system including FLL, VLO, REFO, XT1 (32 kHz), and XT2 (up to 32 MHz). Its power management includes an integrated LDO with programmable VCORE and supply supervision (SVM/SVS).
Peripherals are organized across two voltage domains: DVCC-supplied I/O (P1.0–P1.3, P5–P6, PJ) and DVIO-supplied I/O (P1.4–P1.7, P2–P4, P7), enabling direct interface to 1.8-V logic without level shifters. All timers (TA0/TA1/TA2/TB0) support capture/compare and PWM, with TB0 offering shadow registers for glitch-free updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | CPUXV2 16-bit RISC with 32-bit hardware multiplier and constant generators for optimized code density and math throughput |
| Memory | 64 KB Flash (in-system programmable, 100k-cycle endurance) + 8 KB RAM (full retention in LPM3/LPM4) |
| ADC | 10-bit SAR ADC (ADC10_A) with 200 kSPS max, 10 external + 2 internal input channels, internal reference (1.5 V/2.0 V/2.5 V) |
| Low-Power Modes | LPM3: 1.9 µA @ 3.0 V (RTC + crystal active); LPM4: 1.1 µA @ 3.0 V; LPM4.5: 0.18 µA @ 3.0 V |
| Timers | TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC shadow registers) - supporting PWM, capture, interval timing, and RTC calibration |
| Communication | USCI_A0/A1: UART (auto-baud detect), IrDA, SPI; USCI_B0/B1: I²C (master/slave), SPI - all configurable per port mapping |
| Supply Domains | DVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V; AVCC: 1.8–3.6 V - enabling independent I/O voltage scaling for mixed-voltage systems |
Pinout & Package
VQFN-64 (RGC) package, 9 mm × 9 mm, 0.5-mm pitch, exposed thermal pad (recommended connection to DVSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0/TA0CLK/ACLK | Primary clock input / timer clock source / auxiliary clock output | Supports low-frequency crystal (XT1) or external clock; feeds ACLK domain for RTC and low-power peripherals |
| P5.4/XIN & P5.5/XOUT | XT1 oscillator terminals | Connects 32.768-kHz watch crystal for RTC operation with automatic gain control and startup stabilization |
| P2.6/RTCCLK/DMAE0 | RTC clock input / DMA trigger source | Accepts ACLK or divided SMCLK; enables RTC alarm-triggered DMA transfers without CPU wake-up |
| P6.0–P6.7/A0–A7/CB0–CB7 | Analog input / comparator input / GPIO | 10-bit ADC channel inputs (A0–A7) and Comparator_B inputs (CB0–CB7); configurable as digital I/O with Schmitt-trigger |
| P3.0–P3.4/UCB0SIMO–UCA0RXD | USCI_B0 (I²C/SPI) and USCI_A0 (UART/SPI) signal lines | Shared pins enable flexible peripheral routing; I²C SDA/SCL and UART TX/RX coexist via port mapping control register |
| RST/NMI | Reset and non-maskable interrupt input | Active-low reset with programmable NMI edge detection; supports brownout and watchdog reset sources |
| BSLEN | Bootloader entry control | Enables factory-programmed UART-based BSL when asserted during power-on; no external programming voltage required |
| RSTDVCC/SBWTDIO | Test interface I/O (Spy-Bi-Wire) | Single-wire debug interface compatible with MSP-FET and IAR/Code Composer Studio; supports full flash erase/program/debug |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Supply I/O (DVCC/DVIO) | Enables direct interfacing to 1.8-V peripherals (e.g., sensors, transceivers) without external level shifters - reducing BOM cost and board space |
| Ultra-Low Standby Current (LPM3) | 1.9 µA at 3.0 V with RTC + 32-kHz crystal active - extends battery life to multi-year operation in periodic-sensing applications |
| Fast Wake-Up (3.5 µs) | Wakes from LPM3 to active mode in ≤3.5 µs (typical), minimizing latency in event-driven sensor wake-ups and real-time response |
| Port Mapping Controller (PMC) | Allows dynamic remapping of USCI, timer, and ADC functions to multiple pin groups - increasing PCB layout flexibility and design reuse |
| Integrated LDO with Programmable VCORE | On-chip LDO regulates core voltage (VCORE) from DVCC; programmable VCORE (1.2–1.45 V) optimizes active-mode power vs. performance trade-off |
| Hardware CRC16 Engine | Offloads checksum computation from CPU; accelerates firmware integrity checks and communication frame validation in secure boot or OTA update flows |
Applications
| Wireless Sensor Node | Industrial Data Logger |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting readings every 5 minutes via sub-GHz RF transceiver. IC Role / Device Role: Main controller managing sensor acquisition (ADC), RTC-triggered wake-up, low-power RF interface (USCI_A0 UART), and sleep state orchestration. Use Value: LPM3 current (1.9 µA) + 3.5-µs wake-up enables >5-year CR2032 battery life while maintaining precise 5-min intervals via crystal-backed RTC. | Use Scenario: DIN-rail mounted environmental monitor logging temperature, pressure, and voltage every second to SD card. IC Role / Device Role: Central data aggregator with ADC sampling, SPI-controlled SD card interface (USCI_B0), RTC timestamping, and flash-based circular buffer management. Use Value: 64 KB Flash stores >100k timestamped samples; dual-voltage I/O directly drives 1.8-V SD card interface without level-shifter components. |
| Portable Medical Monitor | Smart Utility Meter |
Use Scenario: Handheld pulse oximeter acquiring analog PPG signals, computing SpO₂, and displaying results on segment LCD. IC Role / Device Role: Signal processor running ADC oversampling, digital filtering (via hardware multiplier), LCD segment driver (GPIO), and low-power display refresh. Use Value: 10-bit ADC with internal reference ensures stable measurement accuracy across battery voltage drop; LPM4.5 (0.18 µA) enables long standby between patient sessions. | Use Scenario: Electricity meter with metrology IC interface, tamper detection, and PLC/GPRS communication. IC Role / Device Role: System manager handling metrology data readout (SPI), tamper GPIO monitoring, real-time billing timestamp (RTC_A), and secure firmware updates (BSL + CRC16). Use Value: Port mapping allows USCI_B1 to serve both metrology SPI and GPRS UART; BSL enables field firmware upgrades over UART without JTAG hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5229IRGCT | 128 KB Flash (vs. 64 KB), same peripherals, identical pinout and package | Supports larger firmware (e.g., BLE stack + sensor fusion) without layout change | Select when future firmware expansion or dual-application partitioning is required |
| MSP430F5217IRGCT | No ADC10_A module; otherwise identical Flash/RAM/timers/USCI/RTC specs and pinout | Requires external ADC for analog sensing; suited for digital-only control or sensor interfaces with integrated ADC | Select when analog acquisition is handled externally or unnecessary, reducing cost and power |
Compared with MSP430F5229IRGCT and MSP430F5217IRGCT, the MSP430F5227IRGCT delivers optimal balance of on-chip analog capability (10-bit ADC), memory (64 KB Flash), and pin-compatible scalability - making it ideal for cost-sensitive, battery-operated sensing systems requiring integrated data conversion.
Availability
MSP430F5227IRGCT is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply, long-term lifecycle assurance, and TI-authorized traceability.
Supply support for MSP430F5227IRGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The MSP430F522x product line targets ultra-low-power embedded sensing and measurement applications, emphasizing extended battery life, precision analog integration, and flexible low-voltage I/O interfacing.
FAQ
What is the maximum operating frequency of the MSP430F5227IRGCT?
The MSP430F5227IRGCT supports a maximum system clock (MCLK) frequency of 25 MHz, achieved via the FLL-controlled DCO using XT2 (up to 32 MHz crystal) or internal REFO/VLO references. This enables high-speed computation while retaining ultra-low-power operation in active mode (290 µA/MHz at 8 MHz, 3.0 V).
Does the MSP430F5227IRGCT support crystal oscillators for both low- and high-frequency operation?
Yes, the MSP430F5227IRGCT supports dual crystal oscillators: XT1 accepts 32.768-kHz watch crystals for RTC and ACLK generation, while XT2 supports high-frequency crystals up to 32 MHz for MCLK/SMCLK. Both are fully integrated with automatic gain control and fault detection circuitry.
How many external interrupt-capable pins does the MSP430F5227IRGCT have?
The MSP430F5227IRGCT provides up to 12 external interrupt-capable pins - all DVIO-supplied I/O (P1.4–P1.7, P2.0–P2.7) and selected DVCC-supplied I/O (P1.0–P1.3, PJ.0–PJ.3) support configurable edge-triggered interrupts, enabling responsive wake-up from LPM3/LPM4 modes.
Can the MSP430F5227IRGCT operate with different supply voltages for core and I/O?
Yes, the MSP430F5227IRGCT uses a split-supply architecture: DVCC (1.8–3.6 V) powers the core and DVCC-domain I/O, while DVIO (1.62–1.98 V) independently powers DVIO-domain I/O. This allows seamless interfacing with 1.8-V peripherals without external level translation.
Is the MSP430F5227IRGCT pin-compatible with other devices in the MSP430F52xx family?
Yes, the MSP430F5227IRGCT in the 64-pin RGC package shares identical pinout and electrical characteristics with MSP430F5229IRGCT, MSP430F5217IRGCT, and MSP430F5219IRGCT - enabling hardware reuse across variants differing only in Flash size or ADC inclusion.
MSP430F5227IRGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5227IRGCT FAQ
1.How can I place an order for MSP430F5227IRGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for MSP430F5227IRGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for MSP430F5227IRGCT?
For technical support, including MSP430F5227IRGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5227IRGCT requirements.
6.How does Aetrix verify that MSP430F5227IRGCT is sourced from the original manufacturer or authorized distributors?
All MSP430F5227IRGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5227IRGCT meets industry standards.
7.What is the process for return or replacement of MSP430F5227IRGCT?
All MSP430F5227IRGCT units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5227IRGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5227IRGCT part is unused and in its original packaging.
Return procedure for MSP430F5227IRGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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