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Texas Instruments MSP430F5227IZQE

Part No.:
MSP430F5227IZQE
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
80-VFBGA
Datasheet:
AetrixMSP430F5227IZQE.pdf
Description:
IC MCU 16BIT 64KB FLASH 80BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,132

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Product details

Overview

MSP430F5227IZQE from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 64 KB Flash, 8 KB RAM, dual-supply I/O (DVCC/DVIO), 10-bit ADC with 10 external channels, two USCI modules (UART/IrDA/SPI/I²C), four 16-bit timers, RTC, hardware multiplier, and DMA - deployed in battery-powered sensor nodes and data loggers requiring sub-2 µA standby current.

For engineers reviewing the MSP430F5227IZQE datasheet, MSP430F5227IZQE pinout, MSP430F5227IZQE application, or MSP430F5227IZQE equivalent, key selection criteria include its 80-pin BGA (5 mm × 5 mm) package, split I/O supply (1.62–1.98 V DVIO), 3.5 µs wake-up from LPM3, and compatibility with TI's MSP430F522x family toolchain and firmware libraries.

Technical Context

The MSP430F5227IZQE implements a unified clock system with FLL stabilization, dual internal oscillators (VLO and REFO), and support for 32-kHz XT1 and up to 32-MHz XT2 crystals. Its CPUXV2 core executes instructions at up to 25 MHz with constant generators for optimized code density.

Power management includes an integrated LDO with programmable core voltage, SVM/SVS monitoring, brownout reset, and five low-power modes (LPM0–LPM4.5). The device uses a split I/O architecture: DVCC (1.8–3.6 V) powers analog/primary digital I/O, while DVIO (1.62–1.98 V) supplies secondary I/O banks for direct interfacing with 1.8-V peripherals.

Key Specifications

Parameter Value and Actual Design Meaning
Flash Memory 64 KB - sufficient for complex sensor fusion algorithms and bootloader + application partitioning
RAM 8 KB - supports real-time buffering of ADC samples and multi-threaded RTOS operation
ADC Resolution & Channels 10-bit, 10 external + 2 internal inputs - enables simultaneous temperature, voltage, and analog sensor acquisition
Standby Current (LPM3) 1.9 µA at 2.2 V - extends coin-cell battery life to >10 years in periodic wake-up data logging
Wake-up Time (LPM3 → AM) 3.5 µs typical - ensures precise timing-critical response to external interrupts or RTC alarms
Timer Resources TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC) - supports multi-channel PWM, capture, and quadrature decoding
USCI Peripherals USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI) - provides dual serial interfaces for sensor hub + host communication

Pinout & Package

Package: 80-pin BGA (ZQE), 5 mm × 5 mm, 0.4 mm pitch, thermally enhanced with exposed die pad (recommended connection to DVSS).

Pin/Terminal Circuit Role Design Meaning
P1.0/TA0CLK/ACLK Primary timer clock / auxiliary clock input Accepts external 32.768 kHz crystal or digital clock source for RTC and low-frequency timing
P5.4/XIN & P5.5/XOUT XT1 oscillator terminals Supports low-frequency crystal (LF mode) for precision RTC operation with ±20 ppm stability
P5.2/XT2IN & P5.3/XT2OUT XT2 oscillator terminals Drives high-frequency crystal (up to 32 MHz) for system clock generation and high-speed peripheral operation
RST/NMI Reset and non-maskable interrupt input Active-low asynchronous reset; doubles as NMI source for critical fault handling or wake-up
BSLEN Bootloader entry control Enables factory-programmed UART-based BSL without JTAG; requires DVIO domain logic level
RSTDVCC/SBWTDIO SBW debug interface I/O Single-wire JTAG (SBW) bidirectional signal for programming and debugging via MSP-FET or LaunchPad

Key Features

Feature Design Value
Dual-Supply I/O (DVCC/DVIO) Enables direct 1.8-V interface to sensors, transceivers, or memory without external level shifters
Integrated LDO with Programmable Core Voltage Reduces external component count and allows dynamic voltage scaling for power/performance trade-offs
Three-Channel Hardware DMA Offloads CPU during ADC sampling, UART transfers, or memory moves - preserves low-power state integrity
Real-Time Clock with Alarm Provides calendar/timekeeping and configurable wake-up events (e.g., hourly sensor readout) in LPM3
Comparator_B with 6 Input Channels Supports windowed voltage monitoring, battery level detection, or analog threshold triggering without ADC overhead

Applications

Wireless Sensor Node Industrial Data Logger

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and pressure every 5 minutes, transmitting via UART-to-LoRa module.

IC Role / Device Role / Timing Role: Main controller executing sensor polling, ADC conversion, RTC-triggered wake-up, and serial protocol framing.

Use Value: Sub-2 µA LPM3 current and 3.5 µs wake-up ensure >5-year CR2032 battery life with deterministic latency.

Use Scenario: DIN-rail mounted equipment recording voltage/current waveforms and event timestamps over 30 days.

IC Role / Device Role / Timing Role: Real-time data aggregator with 10-bit ADC oversampling, circular buffer management, and RTC timestamping.

Use Value: 8 KB RAM enables 10+ seconds of 10 kSPS buffered acquisition; dual USCI supports isolated RS-485 and SD card SPI.

Portable Medical Monitor Smart Utility Meter Interface

Use Scenario: Handheld pulse oximeter acquiring analog photodiode signals and driving OLED display via SPI.

IC Role / Device Role / Timing Role: Signal conditioner, ADC controller, display driver, and low-power state manager.

Use Value: Split DVIO supply directly interfaces 1.8-V OLED driver; comparator_B replaces external op-amp for LED current regulation.

Use Scenario: Electricity meter front-end communicating with metrology IC via SPI and reporting via I²C to host MCU.

IC Role / Device Role / Timing Role: Isolated peripheral bridge with secure boot, tamper-detection GPIO, and time-stamped event logging.

Use Value: Dual USCI modules enable concurrent metrology SPI and host I²C; RTC alarm triggers anti-tamper audit cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MSP430F5229IZQE 128 KB Flash, same peripherals and pinout - no PCB change required Supports larger firmware images (e.g., OTA update stack + full application) Select when future firmware growth or cryptographic libraries require >64 KB code space
MSP430F5227IRGC Same core specs, but 64-pin VQFN (9 mm × 9 mm) instead of 80-pin BGA (5 mm × 5 mm) Lower I/O count (22 DVCC + 31 DVIO vs. 22 + 31), identical functionality Choose for cost-sensitive designs where BGA assembly is unavailable or board space permits larger footprint

Compared with MSP430F5227IZQE, the F5229IZQE offers double Flash capacity in identical packaging for scalability, while the F5227IRGC trades BGA density for QFN manufacturability - both retain full peripheral compatibility and ultra-low-power performance.

Availability

MSP430F5227IZQE is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and portable medical monitors requiring stable component supply across long-lifecycle embedded programs.

Supply support for MSP430F5227IZQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power design and broad technical support infrastructure.

The MSP430F522x series targets ultra-low-power sensing and measurement applications, emphasizing extended battery life, integrated analog peripherals, and robust real-time operation in resource-constrained environments.

FAQ

What is the maximum system clock frequency supported by the MSP430F5227IZQE?

The MSP430F5227IZQE supports a maximum system clock (MCLK) frequency of 25 MHz, achieved using the FLL with XT2 (up to 32 MHz crystal) or internal DCO. This enables high-speed ADC sampling (200 kSPS), fast UART baud rates, and responsive real-time control loops without compromising ultra-low-power architecture.

Does the MSP430F5227IZQE support crystal oscillators for both low- and high-frequency operation?

Yes, the MSP430F5227IZQE integrates two crystal oscillator circuits: XT1 accepts 32.768 kHz watch crystals for RTC and low-frequency timing, while XT2 supports crystals up to 32 MHz for high-frequency system clock generation - both are fully configurable via software registers and require external load capacitors per layout guidelines.

How many general-purpose I/O pins does the MSP430F5227IZQE provide, and how are they voltage-domain segregated?

The MSP430F5227IZQE provides 22 DVCC-domain I/O pins (1.8–3.6 V) and 31 DVIO-domain I/O pins (1.62–1.98 V), totaling 53 usable GPIOs. This split architecture allows direct interfacing with 1.8-V peripherals without level shifters, while maintaining higher-voltage tolerance on analog and primary digital I/O banks.

What low-power modes are available on the MSP430F5227IZQE, and what is the lowest active current consumption?

The MSP430F5227IZQE offers five low-power modes (LPM0–LPM4.5). Its lowest active-mode current is 150 µA/MHz (RAM execution, 3.0 V), and standby (LPM3) draws just 1.9 µA at 2.2 V with RTC, watchdog, and full RAM retention - enabling decade-scale operation on coin-cell batteries.

Is the MSP430F5227IZQE pin-compatible with other devices in the MSP430F522x family?

Yes, the MSP430F5227IZQE shares identical pinout and package (80-pin ZQE BGA) with MSP430F5229IZQE, MSP430F5219IZQE, and MSP430F5217IZQE - enabling drop-in replacement for Flash size or ADC inclusion changes without PCB revision.

MSP430F5227IZQE Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
80-VFBGA
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5227IZQE FAQ

1.How can I place an order for MSP430F5227IZQE through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5227IZQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5227IZQE reliable?

The price and inventory of MSP430F5227IZQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5227IZQE is usually 5 days.

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MSP430F5227IZQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5227IZQE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5227IZQE?

For technical support, including MSP430F5227IZQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5227IZQE requirements.

6.How does Aetrix verify that MSP430F5227IZQE is sourced from the original manufacturer or authorized distributors?

All MSP430F5227IZQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5227IZQE meets industry standards.

7.What is the process for return or replacement of MSP430F5227IZQE?

All MSP430F5227IZQE units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5227IZQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5227IZQE part is unused and in its original packaging.

Return procedure for MSP430F5227IZQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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