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Texas Instruments MSP430F5229IRGCR

Part No.:
MSP430F5229IRGCR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5229IRGCR.pdf
Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,730

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Product details

Overview

MSP430F5229IRGCR from Texas Instruments is a 16-bit ultra-low-power mixed-signal microcontroller featuring 128 KB Flash, 8 KB RAM, dual-supply operation (DVCC 1.8–3.6 V / DVIO 1.62–1.98 V), 10-bit ADC with 12 channels (10 external + 2 internal), and four 16-bit timers - including Timer_A with 5/3/3 capture/compare registers and Timer_B with 7 registers. It targets battery-powered sensor systems requiring RTC, low-power wake-up (<3.5 µs), and dual-voltage I/O interfacing.

For engineers reviewing the MSP430F5229IRGCR datasheet, MSP430F5229IRGCR pinout, MSP430F5229IRGCR application, or MSP430F5229IRGCR equivalent, key selection criteria include its 64-pin VQFN package, split I/O supply architecture, 22 DVCC + 31 DVIO GPIOs, integrated hardware multiplier, three-channel DMA, and dual USCI modules supporting UART/IrDA/SPI/I²C - all optimized for energy-constrained embedded measurement.

Technical Context

The MSP430F5229IRGCR implements a unified clock system with FLL stabilization, low-frequency VLO and trimmed REFO sources, 32-kHz XT1 crystal support, and up to 32-MHz XT2 capability. Its power-management system integrates a programmable LDO core regulator, supply voltage supervision (SVM/SVS), and brownout reset.

Peripherals include two USCI_A modules (UART/IrDA/SPI) and two USCI_B modules (I²C/SPI), a 200-KSPS 10-bit ADC10_A with internal reference and sample-and-hold, an 8-channel Comparator_B, RTC_A with alarm, CRC16 engine, and MPY32 hardware multiplier - all accessible via configurable port mapping.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPU with constant generators and extended memory addressing
Flash / RAM128 KB Flash (in-system programmable, no external VPP) + 8 KB SRAM
ADC Resolution & Speed10-bit SAR ADC with 200 KSPS max sampling rate and internal reference
Active Mode Current290 µA/MHz at 8 MHz, 3.0 V (Flash execution); enables efficient real-time processing
Standby (LPM3) Current1.9 µA at 3.0 V with RTC + crystal active and full RAM retention
Wake-up Time3.5 µs typical from LPM3 to active mode - critical for duty-cycled sensing
Dual Supply RailsDVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) enable direct interface to 1.8-V peripherals without level shifters

Pinout & Package

The MSP430F5229IRGCR is housed in a 64-pin VQFN (RGC) package measuring 9 mm × 9 mm with exposed thermal pad recommended to be connected to DVSS.

Pin/TerminalCircuit RoleDesign Meaning
P1.0/TA0CLK/ACLKTimer A0 clock input / Auxiliary clock outputProvides low-frequency timing source for peripherals and system clock domain synchronization
P5.4/XIN & P5.5/XOUTLow-frequency crystal oscillator terminalsSupports 32.768-kHz watch crystal for RTC accuracy and low-power timekeeping
P5.2/XT2IN & P5.3/XT2OUTHigh-frequency crystal oscillator terminalsEnables up to 32-MHz system clock for high-speed processing or communication
P6.0–P6.7/A0–A7/CB0–CB7Analog input / Comparator B inputs10-bit ADC channel inputs (A0–A7) and comparator inputs (CB0–CB7) share same pins
RST/NMIReset and non-maskable interrupt inputActive-low reset with NMI capability for critical fault handling or watchdog recovery
TEST/SBWTCK & PJ.0–PJ.3Spy-Bi-Wire debug interface4-pin 2-wire JTAG-compatible interface for programming and real-time debugging
BSLEN & RSTDVCC/SBWTDIOBootloader entry control / Debug data I/OEnables factory-programmed ROM bootloader activation without external tools

Key Features

FeatureDesign Value
Dual-Supply I/O ArchitectureSeparate DVCC (1.8–3.6 V) and DVIO (1.62–1.98 V) rails eliminate need for external level translators when interfacing with 1.8-V sensors or logic
Ultra-Low-Power Standby1.9 µA LPM3 current with RTC + crystal ensures years of operation on coin-cell batteries in data loggers
Hardware AccelerationMPY32 multiplier and three-channel DMA offload CPU during math-intensive or burst-data operations (e.g., sensor fusion)
Flexible Clock SystemFLL-stabilized DCO, VLO, REFO, XT1, and XT2 sources allow dynamic clock scaling and fail-safe redundancy
Peripheral InterconnectPort mapping control (PMM) enables runtime remapping of USCI, timer, and ADC functions to different GPIO groups

Applications

Wireless Sensor NodeIndustrial Data Logger

Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity via sub-GHz RF link every 5 minutes.

IC Role / Device Role / Timing Role: Central controller managing ADC sampling, RTC-triggered wake-up, SPI communication with RF transceiver, and low-power sleep scheduling.

Use Value: 1.9 µA LPM3 current with RTC extends 2000-mAh coin cell life beyond 5 years; dual-supply I/O directly interfaces 1.8-V RF IC without level shifters.

Use Scenario: DIN-rail mounted vibration logger capturing accelerometer data at 1 kHz for predictive maintenance analysis.

IC Role / Device Role / Timing Role: Real-time signal acquisition host with 200-KSPS ADC, DMA-driven buffer transfers, and timestamping via RTC_A alarm.

Use Value: Hardware multiplier accelerates FFT preprocessing; 3.5 µs wake-up ensures minimal missed samples during burst-triggered acquisition windows.

Smart Meter Interface ModulePortable Medical Monitor

Use Scenario: Sub-metering add-on board reading pulse outputs from utility meters and reporting via RS-485.

IC Role / Device Role / Timing Role: Isolated UART bridge with galvanically separated USCI_A0, precision timing for pulse counting, and tamper-detection GPIO monitoring.

Use Value: Dual USCI modules support simultaneous UART (RS-485) and I²C (local sensor bus); 22 DVCC + 31 DVIO GPIOs accommodate multiple isolation and sensing interfaces.

Use Scenario: Wearable ECG patch acquiring analog biopotentials, performing baseline correction, and storing 24-hour waveform history.

IC Role / Device Role / Timing Role: Analog front-end controller with 10-bit ADC, comparator-based R-peak detection, and flash-resident algorithm execution.

Use Value: Integrated 10-bit ADC with internal reference eliminates external voltage reference IC; 128 KB Flash stores firmware + compressed waveform buffers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5227IRGCR64 KB Flash (vs. 128 KB), identical peripherals, package, and pinoutReduced firmware footprint requirement; suitable for simpler sensor firmware without OTA updatesSelect when application code size remains under 64 KB and cost sensitivity outweighs future scalability needs
MSP430F5224IRGZR48-pin VQFN (7×7 mm), 128 KB Flash, but only 8 external ADC channels and 20 DVCC + 17 DVIO GPIOsSpace-constrained designs where reduced I/O count and smaller footprint are prioritized over ADC channel countChoose for compact PCB layouts where full 64-pin I/O is unnecessary and 48-pin RGZ mechanical fit is required

Compared with MSP430F5227IRGCR and MSP430F5224IRGZR, the MSP430F5229IRGCR provides maximum Flash capacity and ADC channel count in the 64-pin RGC package - making it optimal for feature-rich, field-upgradable sensor edge nodes requiring long-term data buffering and complex signal processing.

Availability

MSP430F5229IRGCR is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial data loggers, and smart meter interface modules requiring stable component supply, long-lifecycle support, and TI-qualified automotive-grade traceability.

Supply support for MSP430F5229IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power microcontrollers and precision analog technology.

The MSP430F5229IRGCR belongs to the MSP430F5xx ultra-low-power MCU family, designed specifically for battery-operated measurement and sensing applications demanding nanowatt-level standby, fast wake-up, and integrated analog peripherals.

FAQ

What is the maximum system clock frequency supported by the MSP430F5229IRGCR?

The MSP430F5229IRGCR supports a maximum system clock frequency of 25 MHz from its digitally controlled oscillator (DCO), and up to 32 MHz when using the high-frequency crystal oscillator (XT2) with external crystal. This allows flexible trade-offs between power efficiency and processing throughput depending on application demands.

Does the MSP430F5229IRGCR include an integrated real-time clock (RTC)?

Yes, the MSP430F5229IRGCR includes a dedicated RTC_A module with calendar mode, alarm functionality, and automatic leap-year compensation. It operates in LPM3 with a 32.768-kHz crystal connected to P5.4/XIN and P5.5/XOUT, drawing only 1.9 µA at 3.0 V - enabling precise timekeeping during ultra-low-power operation.

How many analog input channels does the MSP430F5229IRGCR's 10-bit ADC support?

The MSP430F5229IRGCR's ADC10_A module supports 12 total input channels: 10 external analog inputs (A0–A9 on P6.0–P6.7 and P5.0–P5.1) plus 2 internal references (VeREF+ and VeREF−). This configuration enables simultaneous monitoring of multiple sensors while retaining internal calibration capability.

Can the MSP430F5229IRGCR operate with separate I/O and core supply voltages?

Yes, the MSP430F5229IRGCR features a dual-supply architecture: DVCC (1.8–3.6 V) powers the core and DVCC-domain GPIOs, while DVIO (1.62–1.98 V) powers the DVIO-domain GPIOs. This allows direct interfacing with 1.8-V peripherals without external level-shifting circuitry - reducing BOM cost and board space.

What debug interface does the MSP430F5229IRGCR use, and how many pins are required?

The MSP430F5229IRGCR uses the Spy-Bi-Wire (SBW) interface, a 2-wire variant of JTAG, implemented on TEST/SBWTCK (pin 19) and RSTDVCC/SBWTDIO (pin 64). Only two dedicated pins plus ground are required for full programming, debugging, and boundary-scan access - simplifying test fixture design and PCB layout.

MSP430F5229IRGCR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5229IRGCR FAQ

1.How can I place an order for MSP430F5229IRGCR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5229IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5229IRGCR reliable?

The price and inventory of MSP430F5229IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5229IRGCR is usually 5 days.

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MSP430F5229IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5229IRGCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5229IRGCR?

For technical support, including MSP430F5229IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5229IRGCR requirements.

6.How does Aetrix verify that MSP430F5229IRGCR is sourced from the original manufacturer or authorized distributors?

All MSP430F5229IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5229IRGCR meets industry standards.

7.What is the process for return or replacement of MSP430F5229IRGCR?

All MSP430F5229IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5229IRGCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5229IRGCR part is unused and in its original packaging.

Return procedure for MSP430F5229IRGCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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