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Texas Instruments MSP430F5239IRGCR

Part No.:
MSP430F5239IRGCR
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
64-VFQFN Exposed Pad
Datasheet:
AetrixMSP430F5239IRGCR.pdf
Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,925

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Product details

Overview

MSP430F5239IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC microcontroller in the MSP430F523x series, designed for battery-powered sensor and data-logging applications. It features 128 KB flash, 8 KB RAM, four 16-bit timers (TA0/TA1/TA2/TB0), two USCI modules (UART/IrDA/SPI/I²C), RTC, hardware multiplier, and 53 GPIOs - all operating from 1.8 V to 3.6 V with standby current as low as 1.9 µA.

For engineers reviewing the MSP430F5239IRGCR datasheet, MSP430F5239IRGCR pinout, MSP430F5239IRGCR application, or MSP430F5239IRGCR equivalent, key selection criteria include its absence of integrated ADC (distinguishing it from F524x variants), VQFN-64 package compatibility, RTC+DMA support for time-stamped sensing, and ultra-low-power LPM3/LPM4 operation critical for multi-year battery life in remote monitoring systems.

Technical Context

The MSP430F5239IRGCR implements a unified clock system with FLL-based frequency stabilization, dual crystal support (XT1 for 32-kHz RTC, XT2 up to 32 MHz), and internal sources (VLO, REFO). Its power management includes an integrated LDO with programmable core voltage and brownout detection across multiple supply domains (DVCC, AVCC, VCORE).

It executes code from flash or RAM with active-mode current of 290 µA/MHz (flash) and 150 µA/MHz (RAM) at 8 MHz/3.0 V, and wakes from LPM3 in 3.5 µs (typical) - enabling rapid response to external events while maintaining sub-2-µA real-time clock operation.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2 with constant generators for optimized code density and execution efficiency
Flash / RAM128 KB flash (in-system programmable) + 8 KB SRAM for firmware storage and real-time data buffering
Operating Voltage1.8 V to 3.6 V - supports direct Li-ion/Li-Po or dual-cell alkaline battery operation without external regulators
LPM3 Current1.9 µA at 3.0 V with RTC, watchdog, and full RAM retention - enables years of operation on coin-cell batteries
Wake-up Time3.5 µs from LPM3 to active mode - ensures timely response to sensor interrupts or communication triggers
Timer PeripheralsFour independent 16-bit timers: TA0 (5 CC), TA1 (3 CC), TA2 (3 CC), TB0 (7 CC) - supports complex PWM, capture, and time-slicing tasks
CommunicationTwo USCI modules: USCI_A0/A1 (UART/IrDA/SPI), USCI_B0/B1 (I²C/SPI) - enables dual-interface sensor hub or host-bridge designs
RTC & DMAIntegrated RTC_A with alarm and 3-channel DMA - allows autonomous time-stamped data acquisition without CPU intervention

Pinout & Package

VQFN-64 (RGC) package, 9 mm × 9 mm, with exposed thermal pad recommended to be connected to DVSS.

Pin/TerminalCircuit RoleDesign Meaning
P1.0/TA0CLK/ACLKPort 1 bit 0 / Timer A0 clock input / Auxiliary clock outputConfigurable I/O supporting low-frequency timing reference or external event synchronization
P2.6/RTCCLK/DMAE0Port 2 bit 6 / RTC clock input / DMA trigger sourceDirect connection point for 32-kHz crystal or external clock; enables RTC-triggered DMA transfers
P3.0–P3.4/UCB0SIMO–UCA0RXDUSCI peripheral pins (SPI/I²C/UART)Dual USCI interface routing allows simultaneous SPI sensor bus and UART debug/communication channel
RST/NMIReset and non-maskable interrupt inputActive-low reset with NMI capability - supports hardware fault recovery and emergency wake-up
VCORECore voltage supply (regulated by internal LDO)Must be decoupled locally; voltage level set via PMM register - isolates core logic from I/O supply noise
RSTDVCC/SBWTDIOSupply for JTAG/Spy-Bi-Wire test interfaceEnables in-system programming and debugging without external voltage translation

Key Features

FeatureDesign Value
Ultra-low-power LPM4.5 shutdown0.18 µA at 3.0 V - lowest power state for long-term storage or deep sleep between scheduled wake-ups
Integrated LDO with programmable VCOREReduces external component count and improves PSRR; core voltage adjustable to balance performance vs. power
FLL-based clock stabilizationEnables reliable operation across voltage/temperature without external high-frequency crystal - lowers BOM cost
Hardware multiplier (MPY32)Accelerates 16/32-bit arithmetic for sensor fusion, filtering, or cryptographic operations without CPU overhead
Real-time clock with alarmSupports autonomous periodic wake-up and timestamping - essential for data loggers and metering applications
3-channel DMA controllerOffloads CPU during ADC-less data movement (e.g., USCI receive buffers → RAM), preserving low-power states

Applications

Wireless Sensor NodeEnergy Metering

Use Scenario: Battery-powered temperature/humidity node transmitting data via UART-to-LoRa module every 15 minutes.

IC Role / Device Role / Timing Role: Main controller managing sensor reads, RTC-triggered wake-up, SPI sensor interface, and UART transmission.

Use Value: Sub-2-µA LPM3 current extends 2032 coin-cell life beyond 5 years; 3.5-µs wake-up ensures precise transmission timing.

Use Scenario: Residential electricity meter with tamper detection, pulse counting, and daily usage logging.

IC Role / Device Role / Timing Role: System-on-chip handling metrology interface (pulse inputs), RTC calendar, EEPROM-backed log storage, and optical UART port.

Use Value: RTC alarm wakes MCU hourly to update logs; DMA moves pulse counts to RAM without CPU involvement - minimizing active time.

Industrial Data LoggerPortable Medical Monitor

Use Scenario: Handheld environmental logger recording CO₂, pressure, and GPS timestamps over 72-hour field deployment.

IC Role / Device Role / Timing Role: Central data aggregator with RTC time-stamping, USB/UART host interface, and SD card SPI control.

Use Value: 128 KB flash stores >100k sensor records; LPM4 shutdown (0.18 µA) preserves charge during transport/storage.

Use Scenario: Wearable ECG patch capturing analog front-end signals and streaming processed waveforms via BLE bridge.

IC Role / Device Role / Timing Role: Signal preprocessor and BLE coordinator - handles analog comparator thresholds, timer-driven sampling, and UART-to-BLE packet framing.

Use Value: Comparator_B (8 channels) monitors lead-off and battery voltage autonomously; no ADC required for basic alerting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5237IRGCRSame package and peripherals, but 64 KB flash and 8 KB RAM - reduced program capacitySuitable for simpler firmware with smaller code footprint; identical power/performance profileSelect when application firmware fits within 64 KB and cost sensitivity outweighs flash headroom
MSP430F5249IRGCRIncludes 10-bit ADC (10 external + 2 internal channels); otherwise identical flash/RAM/timers/USCIRequired when analog signal acquisition (e.g., thermistor, battery voltage) is needed on-chipChoose only if ADC functionality is mandatory - adds no benefit and increases cost/power when unused

Compared with MSP430F5237IRGCR, the MSP430F5239IRGCR provides 2× flash capacity for complex firmware or future updates; versus MSP430F5249IRGCR, it eliminates ADC-related design complexity, layout area, and calibration overhead where analog sensing is handled externally.

Availability

MSP430F5239IRGCR is available at Aetrix Electronics and suitable for wireless sensor nodes, energy metering systems, and industrial data loggers requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for MSP430F5239IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The MSP430F5239IRGCR belongs to TI's MSP430F523x ultra-low-power MCU family, engineered specifically for extended-battery-life applications where RTC, DMA, and multi-interface connectivity are essential - but on-chip analog-to-digital conversion is unnecessary.

FAQ

What is the maximum system clock frequency supported by the MSP430F5239IRGCR?

The MSP430F5239IRGCR supports a maximum system clock frequency of 25 MHz, achieved using the FLL with XT2 (high-frequency crystal oscillator) up to 32 MHz or internal DCO calibration. This enables high-speed peripheral operation and efficient instruction throughput while maintaining ultra-low-power architecture benefits.

Does the MSP430F5239IRGCR include an integrated analog-to-digital converter (ADC)?

No, the MSP430F5239IRGCR does not include an integrated ADC. It belongs to the MSP430F523x series, which omits the ADC10_A module present in the F524x series. Applications requiring analog signal conversion must use external ADCs or select an F524x variant like MSP430F5249IRGCR.

What package type and pin count does the MSP430F5239IRGCR use?

The MSP430F5239IRGCR uses a 64-pin VQFN package (RGC variant), measuring 9 mm × 9 mm with an exposed thermal pad. This package is shared across the F5239/F5237/F5249/F5247 devices and supports high I/O density (53 GPIOs) in a compact, thermally efficient footprint.

How does the power management system of the MSP430F5239IRGCR reduce system-level BOM cost?

The MSP430F5239IRGCR integrates a fully regulated LDO with programmable VCORE, eliminating the need for external DC/DC converters or LDOs. Combined with internal VLO, REFO, and FLL-based clock synthesis, it reduces external passive components and simplifies power tree design - lowering total solution cost and PCB area.

Can the MSP430F5239IRGCR operate from a single 2.0-V supply without performance degradation?

Yes, the MSP430F5239IRGCR operates across 1.8 V to 3.6 V. At 2.0 V, it maintains full functionality including 25-MHz-capable FLL, RTC, DMA, and all timers - though maximum achievable MCLK is reduced per datasheet curves. Active-mode current remains proportional (e.g., ~230 µA/MHz at 2.0 V), preserving ultra-low-power advantage.

MSP430F5239IRGCR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
64-VFQFN Exposed Pad
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5239IRGCR FAQ

1.How can I place an order for MSP430F5239IRGCR through Aetrix?

Please submit a Request for Quotation (RFQ) for MSP430F5239IRGCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5239IRGCR reliable?

The price and inventory of MSP430F5239IRGCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5239IRGCR is usually 5 days.

3.What payment methods are accepted for MSP430F5239IRGCR?

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MSP430F5239IRGCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MSP430F5239IRGCR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5239IRGCR?

For technical support, including MSP430F5239IRGCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5239IRGCR requirements.

6.How does Aetrix verify that MSP430F5239IRGCR is sourced from the original manufacturer or authorized distributors?

All MSP430F5239IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5239IRGCR meets industry standards.

7.What is the process for return or replacement of MSP430F5239IRGCR?

All MSP430F5239IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5239IRGCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5239IRGCR part is unused and in its original packaging.

Return procedure for MSP430F5239IRGCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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