Texas Instruments MSP430F5253IRGCR
- Part No.:
- MSP430F5253IRGCR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 64-VFQFN Exposed Pad
- Datasheet:
-
MSP430F5253IRGCR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 64VQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MSP430F5253IRGCR from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller designed as an "always-on" system controller for portable and battery-powered devices. It features 128 KB flash, 16 KB RAM, dual-supply operation (DVCC: 1.8–3.6 V; DVIO: 1.62–1.98 V), four USCI_A (UART/IrDA/SPI) and four USCI_B (I²C/SPI) modules, and operates at up to 25 MHz. It serves in sensor hub and power-management roles where fast wake-up (3.5 µs) and sub-µA standby current (1.6 µA at 3.0 V in LPM3) are critical.
For engineers reviewing the MSP430F5253IRGCR datasheet, MSP430F5253IRGCR pinout, MSP430F5253IRGCR application, or MSP430F5253IRGCR equivalent, key selection criteria include split-rail I/O voltage support (1.8-V DVIO rail), 35 total GPIOs with 18 DVCC and 35 DVIO-capable pins, RTC-integrated low-power modes, hardware multiplier, and 10-bit ADC with internal reference - all validated for sensor fusion and system control use cases.
Technical Context
The MSP430F5253IRGCR implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32-kHz crystal), and XT2 (up to 32-MHz HF crystal). Its power architecture integrates a programmable LDO core regulator, supply voltage supervision (SVS/SVM), and brownout reset - enabling robust operation across variable battery conditions.
Peripheral integration includes three 16-bit Timer_A instances (5/3/3 capture/compare registers), one 16-bit Timer_B (7 registers), 10-bit ADC10_A (12-channel, 200 ksps), comparator_B (8 channels), 3-channel DMA, and RTC_A with alarm. All I/O ports are mapped to either DVCC or DVIO domains, with interrupt/wakeup capability on P1, P2, P6, and PJ pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 16-bit RISC CPUXV2 with extended memory addressing; supports up to 25-MHz system clock for real-time sensor processing. |
| Memory | 128 KB flash (in-system programmable, no external VPP); 16 KB RAM (full retention in LPM3/LPM4). |
| Power Modes | Active mode: 290 µA/MHz @ 8 MHz, 3.0 V (flash execution); Standby (LPM3): 1.6 µA @ 3.0 V with RTC active and full RAM retention. |
| Supply Rails | Dual-rail: DVCC = 1.8–3.6 V (core & analog); DVIO = 1.62–1.98 V (I/O domain); enables direct interface to 1.8-V application processors without level shifters. |
| Serial Interfaces | Four USCI_A modules (UART/IrDA/SPI) + four USCI_B modules (I²C/SPI); supports eight concurrent hardware serial links for multi-sensor communication. |
| Analog Peripherals | 10-bit ADC10_A: 12 input channels (10 external, 2 internal), 200 ksps max sample rate, internal reference (1.5 V); comparator_B with 8 channels and rail-to-rail input. |
| Timers & RTC | Three Timer_A (TA0/TA1/TA2) + one Timer_B (TB0); RTC_A with calendar mode, alarm, and battery-backup capability. |
Pinout & Package
VQFN-64 (RGCR) package, 9 mm × 9 mm body, 0.5-mm pitch, thermally enhanced with exposed thermal pad. Pin functions validated per TI SLAS903D Rev. D (October 2020), Figure 7-1 and Table 7-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1.0–P1.7 | DVIO-domain GPIO / TA0CLK / ACLK | 1.8-V I/O bank with timer clock input and low-frequency oscillator output; supports wakeup and interrupt. |
| P2.0–P2.7 | DVIO-domain GPIO / USCI_B3 / RTCCLK / DMAE0 | 1.8-V I/O bank supporting I²C/SPI, real-time clock input, and DMA trigger; interrupt-capable. |
| P3.0–P3.4 | DVIO-domain GPIO / USCI_B0 / USCI_A0 | 1.8-V I/O bank with dual USCI support (I²C + UART/SPI); enables concurrent peripheral communication. |
| P4.0–P4.7 | DVIO-domain GPIO / USCI_B1 / USCI_A1 | 1.8-V I/O bank dedicated to second pair of USCI_B and USCI_A modules; expands serial interface count. |
| P5.0–P5.5 | DVCC-domain GPIO / ADC inputs / XIN / XOUT | 3.0-V I/O bank with analog inputs (A0–A5), crystal oscillator connections, and reference voltage terminals. |
| P6.0–P6.7 | DVCC-domain GPIO / TA2 / comparator inputs | 3.0-V I/O bank supporting Timer_A2 clock/input and comparator_B channels; interrupt/wakeup capable. |
| P7.0–P7.5 | DVIO-domain GPIO / USCI_A3 | 1.8-V I/O bank supporting third USCI_A module (UART/SPI); extends serial connectivity options. |
| PJ.0–PJ.3 | DVCC-domain GPIO / RST/NMI / BSLEN | 3.0-V I/O bank with reset, non-maskable interrupt, and bootloader enable; critical for system initialization and recovery. |
| DVCC / DVSS / AVCC / AVSS / VCORE / DVIO | Power and ground terminals | Dual-supply separation: DVCC/DVSS powers core logic; AVCC/AVSS powers analog peripherals; DVIO sets I/O voltage level. |
Key Features
| Feature | Design Value |
|---|---|
| Split-rail I/O architecture | Enables direct 1.8-V interface to application processors and sensors without external level translators - reducing BOM cost and board space. |
| Ultra-low-power LPM3 standby | 1.6 µA typical current draw with RTC, watchdog, and full RAM retention - ideal for always-on monitoring with <3.5 µs wake-up latency. |
| Eight hardware serial interfaces | Four USCI_A + four USCI_B modules allow simultaneous I²C, SPI, and UART communication - eliminating software bit-banging overhead in sensor hubs. |
| Integrated 10-bit ADC with internal reference | 200 ksps sampling rate and built-in 1.5-V reference enable accurate battery voltage, temperature, and analog sensor measurement without external components. |
| Hardware 32-bit multiplier | Accelerates math-intensive sensor fusion algorithms (e.g., Kalman filtering, FFT preprocessing) in firmware without CPU cycle penalty. |
| RTC_A with calendar and alarm | Provides time-stamped data logging and scheduled wake-up events - essential for energy-efficient periodic sensing in data loggers. |
Applications
| Wearable Health Monitor | Smart Home Sensor Hub |
|---|---|
|
Use Scenario: Continuous acquisition of accelerometer, gyroscope, and heart-rate sensor data while main application processor remains powered down. IC Role / Device Role / Timing Role: Always-on system controller managing sensor polling, data aggregation, and wake-up triggering via RTC alarm or motion interrupt. Use Value: Achieves <2 µA average system current during sleep using LPM3 with RTC, extending coin-cell battery life to >1 year. |
Use Scenario: Centralized coordination of Zigbee, BLE, and environmental sensors (temp/humidity/CO₂) in a battery-powered smart thermostat. IC Role / Device Role / Timing Role: Low-power hub executing sensor fusion, local decision logic, and wireless gateway handoff - interfacing via I²C and SPI. Use Value: Dual-supply I/O (DVIO = 1.8 V) allows direct connection to 1.8-V wireless SoCs and digital sensors, eliminating level-shifter ICs. |
| Industrial Data Logger | Portable Medical Device |
|
Use Scenario: Periodic logging of analog sensor outputs (pressure, strain, voltage) into flash memory with timestamping and fault detection. IC Role / Device Role / Timing Role: Standalone data acquisition controller using ADC10_A, RTC_A, and 128 KB flash for autonomous long-term recording. Use Value: 200 ksps ADC sampling and hardware DMA offload CPU during burst acquisition, preserving low-power operation. |
Use Scenario: Battery-powered glucose meter requiring precise analog front-end measurement, button interface, and USB/Bluetooth communication. IC Role / Device Role / Timing Role: Mixed-signal controller handling ADC conversion, LCD driving, button debouncing, and serial protocol bridging (USCI_A/B). Use Value: Comparator_B and internal reference enable accurate low-voltage battery monitoring and sensor signal conditioning without external op-amps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MSP430F5252IRGCR | Same 128 KB flash and 16 KB RAM, but lacks 10-bit ADC and internal reference; no analog sensor interface capability. | Suitable only for digital-only control tasks (e.g., simple I/O expansion, protocol translation) without analog measurement needs. | Select MSP430F5252IRGCR only when ADC functionality is unnecessary and cost reduction is prioritized over analog integration. |
| MSP430F5255IRGCR | Identical memory, timers, and USCI count; differs only in BSL type (I²C instead of UART) and ADC presence (same 10-bit ADC10_A as MSP430F5253IRGCR). | Functionally interchangeable for ADC-based sensor hub designs; UART BSL simplifies field firmware updates via serial interface. | Choose MSP430F5255IRGCR if UART-based bootloader access is required; otherwise, MSP430F5253IRGCR offers identical analog/peripheral capability at same package and pinout. |
Compared with MSP430F5252IRGCR, the MSP430F5253IRGCR adds essential analog measurement capability via its 10-bit ADC and internal reference - making it suitable for sensor-based applications where MSP430F5252IRGCR falls short. Against MSP430F5255IRGCR, it shares full peripheral equivalence except BSL interface type, offering equal performance for most embedded control and data acquisition use cases.
Availability
MSP430F5253IRGCR is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, and industrial data loggers requiring stable component supply, long-lifecycle support, and verified ultra-low-power performance.
Supply support for MSP430F5253IRGCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in ultra-low-power microcontroller design.
The MSP430F525x product line was engineered specifically for "always-on" system controller applications - delivering split-rail I/O, sub-µA standby, and integrated peripherals to replace discrete power-management and sensor-interface circuitry in portable electronics.
FAQ
What is the maximum operating frequency of the MSP430F5253IRGCR?
The MSP430F5253IRGCR supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL-controlled DCO and optional external XT2 crystal oscillator (up to 32 MHz). This frequency is achievable under recommended operating conditions (DVCC ≥ 2.2 V), and the device maintains timing compliance across its full active-mode current range (290 µA/MHz typical at 8 MHz, 3.0 V).
Does the MSP430F5253IRGCR support both 1.8-V and 3.0-V I/O simultaneously?
Yes, the MSP430F5253IRGCR implements true dual-supply I/O: DVIO (1.62–1.98 V) powers P1, P2, P3, P4, P7, and PJ pins for 1.8-V interface compatibility, while DVCC (1.8–3.6 V) powers P5, P6, and analog peripherals. This eliminates external level shifters when interfacing with 1.8-V sensors or application processors - a core feature confirmed in the device description and pin-function tables of SLAS903D.
What low-power modes are available on the MSP430F5253IRGCR, and what is the lowest current draw?
The MSP430F5253IRGCR offers five low-power modes (LPM0–LPM4.5). The lowest active-retention mode is LPM4 (Off mode) at 1.3 µA @ 3.0 V, and the lowest with RTC operation is LPM3 (Standby) at 1.6 µA @ 3.0 V. LPM4.5 (Shutdown) draws just 0.18 µA @ 3.0 V but loses RAM retention. All values are typical and specified in Section 8.5 of the official datasheet SLAS903D.
How many hardware serial interfaces does the MSP430F5253IRGCR include, and what protocols do they support?
The MSP430F5253IRGCR integrates eight hardware serial interfaces: four USCI_A modules (each supporting UART, IrDA, and SPI) and four USCI_B modules (each supporting I²C and SPI). This enables concurrent communication with multiple sensors and peripherals - for example, four I²C sensors and four SPI devices - without CPU intervention or software emulation overhead.
Is the MSP430F5253IRGCR pin-compatible with other members of the MSP430F525x family in the RGC package?
Yes, all MSP430F525x devices in the 64-pin VQFN (RGC/RGCR) package share identical pinout and footprint, including MSP430F5252IRGCR, MSP430F5253IRGCR, MSP430F5254IRGCR, and MSP430F5255IRGCR. This allows direct substitution within the same PCB layout, provided peripheral configuration (e.g., ADC usage, BSL type) aligns with firmware requirements.
MSP430F5253IRGCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 64-VFQFN Exposed Pad
- Series:
- MSP430F5xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- MSP430 CPUXV2
- Core Size:
- 16-Bit
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 10x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MSP430F5253IRGCR FAQ
1.How can I place an order for MSP430F5253IRGCR through Aetrix?
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6.How does Aetrix verify that MSP430F5253IRGCR is sourced from the original manufacturer or authorized distributors?
All MSP430F5253IRGCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5253IRGCR meets industry standards.
7.What is the process for return or replacement of MSP430F5253IRGCR?
All MSP430F5253IRGCR units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5253IRGCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MSP430F5253IRGCR part is unused and in its original packaging.
Return procedure for MSP430F5253IRGCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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