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Texas Instruments MSP430F5256IZQE

Part No.:
MSP430F5256IZQE
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
80-VFBGA
Datasheet:
AetrixMSP430F5256IZQE.pdf
Description:
IC MCU 16BIT 128KB FLASH 80BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,698

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Product details

Overview

MSP430F5256IZQE from Texas Instruments is an ultra-low-power 16-bit RISC mixed-signal microcontroller with dual-supply operation (DVCC/DVIO), 128 KB flash, 16 KB RAM, four USCI_A and four USCI_B modules, and a 10-bit ADC with internal reference. It delivers 290 µA/MHz active-mode current at 3.0 V and supports 35 general-purpose I/Os on the 1.8-V DVIO rail for sensor hub and system controller applications.

For engineers reviewing the MSP430F5256IZQE datasheet, MSP430F5256IZQE pinout, MSP430F5256IZQE application, or MSP430F5256IZQE equivalent, key selection criteria include split-rail I/O voltage support (1.62–1.98 V DVIO / 1.8–3.6 V DVCC), LPM3 standby current of 2.3 µA at 3.0 V, 3.5 µs wake-up time, RTC integration, and MicroStar Junior BGA (80-pin) package compatibility.

Technical Context

The MSP430F5256IZQE implements a unified clock system with FLL stabilization, VLO and REFO internal sources, XT1 (32-kHz crystal), and XT2 (up to 32-MHz HF crystal). Its power management includes a programmable LDO core regulator, supply supervision, and brownout detection across both DVCC and DVIO domains.

Peripherals include four 16-bit timers (TA0/TA1/TA2/TB0), hardware multiplier supporting 32-bit operations, 3-channel DMA, comparator_B with 8 channels, and full-featured USCI modules enabling concurrent UART/IrDA/SPI (USCI_A) and I²C/SPI (USCI_B) communication - all operating independently under their respective voltage rails.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture16-bit RISC CPUXV2 with extended memory addressing up to 25-MHz system clock
Memory128 KB flash + 16 KB RAM; enables complex sensor fusion algorithms and real-time data logging without external memory
Power ModesLPM3 standby: 2.3 µA at 3.0 V; LPM4 shutdown: 1.3 µA; LPM4.5 deep shutdown: 0.18 µA - ideal for battery-backed always-on operation
I/O Voltage RailsDual-supply: DVCC = 1.8–3.6 V, DVIO = 1.62–1.98 V - eliminates level shifters when interfacing with 1.8-V application processors
Serial InterfacesFour USCI_A (UART/IrDA/SPI) + four USCI_B (I²C/SPI); supports eight concurrent hardware serial links for multi-sensor systems
Analog Peripherals10-bit ADC10_A with 12 input channels (10 external, 2 internal), sample-and-hold, and built-in reference - suitable for battery monitoring and environmental sensing
Real-Time ClockRTC_A module with alarm capability and crystal support (XT1) - maintains timekeeping in LPM3 with full RAM retention

Pinout & Package

Package: MicroStar Junior™ BGA (80-pin), 5 mm × 5 mm body size. Pinout validated per TI SLAS903D datasheet Section 7.1–7.2 for ZQE package.

Pin/TerminalCircuit RoleDesign Meaning
P1.x (x=0–7)DVIO-domain GPIO / Timer_A0/1 inputs1.8-V tolerant I/O with interrupt/wakeup capability; supports clock input (P1.0/ACLK) and capture/compare functions
P2.x (x=0–7)DVIO-domain GPIO / USCI_B3 / RTCCLKConfigurable for I²C/SPI slave or master; P2.6 provides RTC clock source independent of main system clock
P3.x (x=0–4)DVIO-domain GPIO / USCI_B0 / USCI_A0Dual-function pins supporting I²C (SCL/SDA) and UART (TXD/RXD); enable direct connection to touch controllers or accelerometers
P4.x (x=0–7)DVIO-domain GPIO / USCI_B1 / USCI_A1Peripheral multiplexing allows dedicated I²C and SPI buses for separate sensor clusters without software arbitration
P5.x (x=0–5)DVCC-domain GPIO / ADC inputs / XT13.0-V domain I/O; P5.0/P5.1 serve as ADC reference inputs (VeREF+/VeREF−); P5.4/P5.5 support 32-kHz crystal
P6.x (x=0–7)DVCC-domain GPIO / Comparator_B / TA2High-drive-strength outputs for analog comparators and timer clock routing; supports low-latency event detection
P7.x (x=0–5)DVIO-domain GPIO / USCI_A3Additional UART/SPI interface for auxiliary communication; supports IrDA encoding/decoding
VQFN-specific pins omittedN/AZQE package has no exposed thermal pad; all power/ground pins are ball-mounted per TI mechanical drawing

Key Features

FeatureDesign Value
Dual-voltage I/O architectureEnables direct interface to 1.8-V application processors and sensors without external level translators, reducing BOM count and PCB area
Ultra-low-power LPM3 mode2.3 µA at 3.0 V with RTC, watchdog, and full RAM retention - extends coin-cell battery life to multi-year operation in data loggers
Four independent USCI_B modulesSupports up to four concurrent I²C buses (e.g., for ambient light, temperature, humidity, and pressure sensors), eliminating software bit-banging overhead
Hardware multiplier (MPY32)Accelerates 32-bit arithmetic for digital filtering and sensor calibration routines, reducing CPU load and active-mode duration
RTC_A with alarm and crystal supportProvides autonomous timekeeping and scheduled wake-up events while main CPU remains in LPM4, critical for periodic sensor sampling

Applications

Wearable Health MonitorSmart Home Sensor Hub

Use Scenario: Continuous acquisition of ECG, accelerometer, and skin temperature data from multiple analog/digital sensors on a wrist-worn device powered by a CR2032 coin cell.

IC Role / Device Role / Timing Role: System controller managing sensor polling, data aggregation, and BLE subsystem wake-up; RTC_A schedules 100-ms sampling intervals.

Use Value: 1.8-V DVIO rail interfaces directly with low-voltage MEMS sensors; LPM3 current of 2.3 µA enables >2-year battery life with daily sync.

Use Scenario: Central node aggregating data from Zigbee-connected door/window sensors, CO detectors, and HVAC controls in a residential automation gateway.

IC Role / Device Role / Timing Role: Low-power coordinator translating protocols (I²C → UART → Zigbee stack); TA0 generates precise 32.768-kHz timing for wireless packet scheduling.

Use Value: Four USCI_B modules allow isolated I²C buses per sensor type; 35 DVIO I/Os support expansion headers for future add-ons without redesign.

Industrial Battery Management UnitPortable Diagnostic Tool

Use Scenario: Monitoring voltage, current, and temperature of Li-ion packs in cordless power tools, with fault logging and charge-state reporting via USB-UART bridge.

IC Role / Device Role / Timing Role: Analog front-end controller performing ADC conversions, comparator-based overvoltage detection, and nonvolatile event logging to flash.

Use Value: 10-bit ADC10_A with internal reference ensures ±1% measurement accuracy across 0–4.2 V range; 128 KB flash stores firmware + 10k-cycle event history.

Use Scenario: Handheld tool reading OBD-II signals, displaying live engine parameters, and storing trip logs on microSD card via SPI interface.

IC Role / Device Role / Timing Role: Host MCU handling CAN bus parsing (via external transceiver), display refresh, and SD card file I/O using DMA-driven transfers.

Use Value: 3-channel DMA offloads SPI/UART traffic from CPU; USCI_A3 supports IrDA for legacy diagnostic equipment pairing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power mixed-signal microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MSP430F5252IZQESame 80-pin ZQE package, but only 16 KB RAM and no ADC10_A moduleSuitable for pure control tasks without analog sensing; lacks battery voltage monitoring capabilitySelect when cost-sensitive designs omit analog signal acquisition and require identical footprint
MSP430F5256IRGCVQFN-64 package (9 mm × 9 mm), same memory/peripherals, but different pinout and thermal characteristicsBetter suited for prototyping and manual assembly; incompatible with ZQE-restricted PCB layoutsChoose for development boards or space-tolerant industrial designs where BGA rework is impractical

Compared with MSP430F5252IZQE, the MSP430F5256IZQE adds 10-bit ADC functionality and doubles RAM capacity for richer firmware features; versus MSP430F5256IRGC, it offers identical electrical performance in a smaller 5 mm × 5 mm BGA footprint optimized for high-density portable electronics.

Availability

MSP430F5256IZQE is available at Aetrix Electronics and suitable for wearable health monitors, smart home sensor hubs, and industrial battery management units requiring stable component supply and long-term lifecycle support.

Supply support for MSP430F5256IZQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in low-power design.

The MSP430F5256IZQE belongs to the MSP430F525x ultra-low-power MCU family, engineered specifically for "always-on" system controller roles in portable and energy-constrained devices where split-rail I/O and sub-µA standby operation are mandatory.

FAQ

What is the maximum operating frequency of the MSP430F5256IZQE?

The MSP430F5256IZQE supports a maximum system clock frequency of 25 MHz, enabled by its integrated FLL control loop and compatibility with HF crystals up to 32 MHz via the XT2 oscillator. This allows deterministic real-time execution of sensor fusion algorithms while maintaining ultra-low power consumption in active mode.

Does the MSP430F5256IZQE support crystal oscillators for real-time clock functionality?

Yes, the MSP430F5256IZQE integrates the RTC_A module with dedicated support for 32-kHz watch crystals connected to P5.4 (XIN) and P5.5 (XOUT). This enables accurate timekeeping in LPM3 mode with full RAM retention and fast 3.5-µs wake-up, making it suitable for time-triggered sensor sampling in battery-powered applications.

How many independent I²C interfaces does the MSP430F5256IZQE provide?

The MSP430F5256IZQE provides four independent USCI_B modules (USCI_B0 through USCI_B3), each capable of full-duplex I²C communication. This allows concurrent connection to up to four separate I²C sensor devices - such as ambient light, temperature, humidity, and pressure sensors - without software arbitration or bus contention.

What is the purpose of the DVIO supply rail on the MSP430F5256IZQE?

The DVIO supply rail (1.62–1.98 V) powers all I/O ports designated for 1.8-V operation (P1.x–P4.x, P7.x), enabling direct interface with 1.8-V application processors, sensors, and peripherals without external level-shifting circuitry. This reduces system complexity, PCB area, and power loss associated with voltage translation.

Is the MSP430F5256IZQE compatible with the MSP430F525x family's bootloader (BSL)?

Yes, the MSP430F5256IZQE includes an integrated UART-based bootloader (BSL) accessible via P3.3/P3.4 (UCA0TXD/UCA0RXD) that supports in-system programming without external hardware. The BSL operates under DVIO supply conditions and requires no external programming voltage, simplifying field firmware updates in deployed devices.

MSP430F5256IZQE Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
80-VFBGA
Series:
MSP430F5xx
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
MSP430 CPUXV2
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MSP430F5256IZQE FAQ

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Please submit a Request for Quotation (RFQ) for MSP430F5256IZQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MSP430F5256IZQE reliable?

The price and inventory of MSP430F5256IZQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MSP430F5256IZQE is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MSP430F5256IZQE?

For technical support, including MSP430F5256IZQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MSP430F5256IZQE requirements.

6.How does Aetrix verify that MSP430F5256IZQE is sourced from the original manufacturer or authorized distributors?

All MSP430F5256IZQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MSP430F5256IZQE meets industry standards.

7.What is the process for return or replacement of MSP430F5256IZQE?

All MSP430F5256IZQE units undergo pre-shipment inspection (PSI). If there is an issue with MSP430F5256IZQE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MSP430F5256IZQE part is unused and in its original packaging.

Return procedure for MSP430F5256IZQE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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